David A. Gibson

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked microelectronic assemblies
- Patent number 9,437,582
- Issue date Sep 6, 2016
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microelectronic assemblies
- Patent number 8,704,351
- Issue date Apr 22, 2014
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,939,934
- Issue date May 10, 2011
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components, methods and assemblies for stacked packages
- Patent number 7,935,569
- Issue date May 3, 2011
- Tessera, Inc.
- Kyong-Mo Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked packages and microelectronic assemblies incorporating the same
- Patent number 7,589,409
- Issue date Sep 15, 2009
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assembly having array including passive elements an...
- Patent number 7,335,995
- Issue date Feb 26, 2008
- Tessera, Inc.
- L. Elliott Pflughaupt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components, methods and assemblies for stacked packages
- Patent number 7,294,928
- Issue date Nov 13, 2007
- Tessera, Inc.
- Kyong-Mo Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked packages and systems incorporating the same
- Patent number 7,183,643
- Issue date Feb 27, 2007
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microelectronic assemblies
- Patent number 7,149,095
- Issue date Dec 12, 2006
- Tessera, Inc.
- Michael Warner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components, methods and assemblies for multi-chip packages
- Patent number 7,061,122
- Issue date Jun 13, 2006
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked packages
- Patent number 6,977,440
- Issue date Dec 20, 2005
- Tessera, Inc.
- L. Elliott Pflughaupt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked packages
- Patent number 6,913,949
- Issue date Jul 5, 2005
- Tessera, Inc.
- L. Elliott Pflughaupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packages
- Patent number 6,897,565
- Issue date May 24, 2005
- Tessera, Inc.
- L. Elliott Pflughaupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for using visual images to mix sound
- Patent number 6,898,291
- Issue date May 24, 2005
- David A. Gibson
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Connection components with frangible leads and bus
- Patent number 6,888,229
- Issue date May 3, 2005
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for using visual images to mix sound
- Patent number 6,490,359
- Issue date Dec 3, 2002
- David A. Gibson
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Microelectronic bond ribbon design
- Patent number 6,081,035
- Issue date Jun 27, 2000
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection components with frangible leads and bus
- Patent number 6,054,756
- Issue date Apr 25, 2000
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making connections to a semiconductor chip assembly
- Patent number 5,915,752
- Issue date Jun 29, 1999
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked Packages and Microelectronic Assemblies Incorporating the Same
- Publication number 20140332982
- Publication date Nov 13, 2014
- Tessera, Inc.
- David Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGES AND MICROELECTRONIC ASSEMBLIES INCORPORATING THE SAME
- Publication number 20100013108
- Publication date Jan 21, 2010
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Components, methods and assemblies for stacked packages
- Publication number 20080042274
- Publication date Feb 21, 2008
- Tessera, Inc.
- Kyong-Mo Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked packages and systems incorporating the same
- Publication number 20070290316
- Publication date Dec 20, 2007
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Components, methods and assemblies for multi-chip packages
- Publication number 20070166876
- Publication date Jul 19, 2007
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered assemblies and methods of making the same
- Publication number 20060278997
- Publication date Dec 14, 2006
- Tessera, Inc.
- David Gibson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic loop packages
- Publication number 20060278962
- Publication date Dec 14, 2006
- Tessera, Inc.
- David Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20060249857
- Publication date Nov 9, 2006
- Tessera, Inc.
- Belgacem Haba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stacked packages
- Publication number 20060033216
- Publication date Feb 16, 2006
- Tessera, Inc.
- L. Elliott Pflughaupt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-frequency noise suppression capacitor set
- Publication number 20050280134
- Publication date Dec 22, 2005
- Tessera, Inc.
- David Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked packages and systems incorporating the same
- Publication number 20050194672
- Publication date Sep 8, 2005
- Tessera, Inc.
- David Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic assembly having array including passive elements an...
- Publication number 20050173796
- Publication date Aug 11, 2005
- Tessera, Inc.
- L. Elliott Pflughaupt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Components, methods and assemblies for multi-chip packages
- Publication number 20040262777
- Publication date Dec 30, 2004
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for using visual images to mix sound
- Publication number 20040240686
- Publication date Dec 2, 2004
- David A. Gibson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Connection components with frangible leads and bus
- Publication number 20040238922
- Publication date Dec 2, 2004
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked packages
- Publication number 20040203190
- Publication date Oct 14, 2004
- Tessera, Inc.
- L. Elliott Pflughaupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components, methods and assemblies for stacked packages
- Publication number 20040145054
- Publication date Jul 29, 2004
- Tessera, Inc.
- Kyong-Mo Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked packages
- Publication number 20040031972
- Publication date Feb 19, 2004
- Tessera, Inc.
- L. Elliott Pflughaupt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods of making microelectronic assemblies including folded subst...
- Publication number 20030168725
- Publication date Sep 11, 2003
- Tessera, Inc.
- Michael Warner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked packages
- Publication number 20030107118
- Publication date Jun 12, 2003
- Tessera, Inc.
- L. Elliott Pflughaupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for using visual images to mix sound
- Publication number 20030091204
- Publication date May 15, 2003
- David A. Gibson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
P-connection components with frangible leads and bus
- Publication number 20020151111
- Publication date Oct 17, 2002
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS

David A. Gibson

Person

Patents Grantslast 30 patents

Stacked microelectronic assemblies

Stacked microelectronic assemblies

Microelectronic packages and methods therefor

Components, methods and assemblies for stacked packages

Stacked packages and microelectronic assemblies incorporating the same

Microelectronic assembly having array including passive elements an...

Components, methods and assemblies for stacked packages

Stacked packages and systems incorporating the same

Stacked microelectronic assemblies

Components, methods and assemblies for multi-chip packages

Stacked packages

Stacked packages

Stacked packages

Method and apparatus for using visual images to mix sound

Connection components with frangible leads and bus

Method and apparatus for using visual images to mix sound

Microelectronic bond ribbon design

Connection components with frangible leads and bus

Method of making connections to a semiconductor chip assembly

Patents Applicationslast 30 patents

Stacked Packages and Microelectronic Assemblies Incorporating the Same

STACKED PACKAGES AND MICROELECTRONIC ASSEMBLIES INCORPORATING THE SAME

Components, methods and assemblies for stacked packages

Stacked packages and systems incorporating the same

Components, methods and assemblies for multi-chip packages

Soldered assemblies and methods of making the same

Microelectronic loop packages

Microelectronic packages and methods therefor

Stacked packages

Multi-frequency noise suppression capacitor set

Stacked packages and systems incorporating the same

Microelectronic assembly having array including passive elements an...

Components, methods and assemblies for multi-chip packages

Method and apparatus for using visual images to mix sound

Connection components with frangible leads and bus

Stacked packages

Components, methods and assemblies for stacked packages

Stacked packages

Methods of making microelectronic assemblies including folded subst...

Stacked packages

Method and apparatus for using visual images to mix sound

P-connection components with frangible leads and bus