David B. Slater, JR.

Person

Durham, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diodes including barrier layers/sublayers and manufa...
- Patent number 8,269,241
- Issue date Sep 18, 2012
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel tin bonding system with barrier layer for semiconductor wafe...
- Patent number 8,247,836
- Issue date Aug 21, 2012
- Cree, Inc.
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with self aligned bond pad
- Patent number RE43412
- Issue date May 29, 2012
- Cree, Inc.
- David Beardsley Slater, Jr.
- 257 - Active solid-state devices
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,183,588
- Issue date May 22, 2012
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,174,037
- Issue date May 8, 2012
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming light emitting devices having current reducing s...
- Patent number 8,163,577
- Issue date Apr 24, 2012
- Cree, Inc.
- David Todd Emerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,154,039
- Issue date Apr 10, 2012
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent ohmic contacts on light emitting diodes with growth sub...
- Patent number 8,101,961
- Issue date Jan 24, 2012
- Cree, Inc.
- John A. Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with conductively joined bonding structure
- Patent number 8,076,670
- Issue date Dec 13, 2011
- Cree, Inc.
- David Beardsley Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED fabrication via ion implant isolation
- Patent number 7,943,954
- Issue date May 17, 2011
- Cree, Inc.
- Yifeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED fabrication via ion implant isolation
- Patent number 7,943,406
- Issue date May 17, 2011
- Cree, Inc.
- David Beardsley Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel tin bonding system with barrier layer for semiconductor wafe...
- Patent number 7,910,945
- Issue date Mar 22, 2011
- Cree, Inc.
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical geometry InGaN LED
- Patent number RE42007
- Issue date Dec 28, 2010
- Cree, Inc.
- Kathleen Marie Doverspike
- 257 - Active solid-state devices
Information Patent Grant
Modified gold-tin system with increased melting temperature for waf...
- Patent number 7,855,459
- Issue date Dec 21, 2010
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting devices having current reducing structures and metho...
- Patent number 7,795,623
- Issue date Sep 14, 2010
- Cree, Inc.
- David Todd Emerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External extraction light emitting diode based upon crystallographi...
- Patent number 7,791,061
- Issue date Sep 7, 2010
- Cree, Inc.
- John A. Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip
- Patent number D616839
- Issue date Jun 1, 2010
- Cree, Inc.
- John Edmond
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Methods of treating a silicon carbide substrate for improved epitax...
- Patent number 7,675,068
- Issue date Mar 9, 2010
- Cree, Inc.
- Davis Andrew McClure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED bonding structures and methods of fabricating LED bonding struc...
- Patent number 7,642,121
- Issue date Jan 5, 2010
- Cree, Inc.
- David Beardsley Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for assembling components on submounts and methods therefor
- Patent number 7,638,013
- Issue date Dec 29, 2009
- Cree, Inc.
- Norbert Hiller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graded dielectric layer
- Patent number 7,638,811
- Issue date Dec 29, 2009
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing light emitting diodes including barrier la...
- Patent number 7,611,915
- Issue date Nov 3, 2009
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting devices suitable for flip-chip bonding
- Patent number 7,608,860
- Issue date Oct 27, 2009
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED fabrication via ion implant isolation
- Patent number 7,592,634
- Issue date Sep 22, 2009
- Cree, Inc.
- Yifeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust Group III light emitting diode for high reliability in stand...
- Patent number 7,473,938
- Issue date Jan 6, 2009
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip
- Patent number D582865
- Issue date Dec 16, 2008
- Cree, Inc.
- John Edmond
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
LED bonding structures and methods of fabricating LED bonding struc...
- Patent number 7,462,861
- Issue date Dec 9, 2008
- Cree, Inc.
- David Beardsley Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with self aligned bond pad
- Patent number 7,432,536
- Issue date Oct 7, 2008
- Cree, Inc.
- David Beardsley Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes including transparent oxide layers
- Patent number 7,420,222
- Issue date Sep 2, 2008
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting devices with self aligned ohmic contacts
- Patent number 7,402,837
- Issue date Jul 22, 2008
- Cree, Inc.
- David Beardsley Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODES INCLUDING BARRIER SUBLAYERS
- Publication number 20120305939
- Publication date Dec 6, 2012
- Cree, Inc.
- David B. Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ANNEALING OF METAL-SILICON CARBIDE OHMIC CONTACTS AND DEV...
- Publication number 20120164765
- Publication date Jun 28, 2012
- David B. Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING LIGHT EMITTING DEVICES HAVING CURRENT REDUCING S...
- Publication number 20120153343
- Publication date Jun 21, 2012
- Cree, Inc.
- David Todd Emerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY GROUP III NITRIDE LED WITH LENTICULAR SURFACE
- Publication number 20110284875
- Publication date Nov 24, 2011
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafe...
- Publication number 20110180839
- Publication date Jul 28, 2011
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING LIGHT EMITTING DEVICES HAVING CURRENT REDUCING S...
- Publication number 20110008922
- Publication date Jan 13, 2011
- David Todd Emerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES INCLUDING OPTICALLY MATCHED SUBSTRATES
- Publication number 20100283077
- Publication date Nov 11, 2010
- Cree, Inc.
- David B. Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL EXTRACTION LIGHT EMITTING DIODE BASED UPON CRYSTALLOGRAPHI...
- Publication number 20100276700
- Publication date Nov 4, 2010
- Cree, Inc.
- JOHN A. EDMOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Diode with Improved Light Extraction
- Publication number 20100140636
- Publication date Jun 10, 2010
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Bonding Structures and Methods of Fabricating LED Bonding Struc...
- Publication number 20100052004
- Publication date Mar 4, 2010
- Cree, Inc.
- David Beardsley Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES INCLUDING BARRIER LAYERS/SUBLAYERS AND MANUFA...
- Publication number 20100006883
- Publication date Jan 14, 2010
- CREE,INC.
- David B. Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Fabrication via Ion Implant Isolation
- Publication number 20090309124
- Publication date Dec 17, 2009
- Cree, Inc.
- Yifeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Efficiency Group III Nitride LED with Lenticular Surface
- Publication number 20090242918
- Publication date Oct 1, 2009
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES INCLUDING TWO REFLECTOR LAYERS
- Publication number 20090166658
- Publication date Jul 2, 2009
- Cree, Inc.
- David B. Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Efficiency Group III Nitride LED with Lenticular Surface
- Publication number 20090166659
- Publication date Jul 2, 2009
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Fabrication Via Ion Implant Isolation
- Publication number 20090104726
- Publication date Apr 23, 2009
- Cree, Inc.
- David Beardsley Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Bonding Structures and Methods of Fabricating LED Bonding Struc...
- Publication number 20090068774
- Publication date Mar 12, 2009
- David Beardsley Slater, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING
- Publication number 20070241360
- Publication date Oct 18, 2007
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL GEOMETRY INGAN LED
- Publication number 20020121642
- Publication date Sep 5, 2002
- KATHLEEN MARIE DOVERSPIKE
- H01 - BASIC ELECTRIC ELEMENTS

David B. Slater, JR.

Person

Patents Grantslast 30 patents

Light emitting diodes including barrier layers/sublayers and manufa...

Nickel tin bonding system with barrier layer for semiconductor wafe...

LED with self aligned bond pad

High efficiency group III nitride LED with lenticular surface

High efficiency group III nitride LED with lenticular surface

Methods of forming light emitting devices having current reducing s...

High efficiency group III nitride LED with lenticular surface

Transparent ohmic contacts on light emitting diodes with growth sub...

LED with conductively joined bonding structure

LED fabrication via ion implant isolation

LED fabrication via ion implant isolation

Nickel tin bonding system with barrier layer for semiconductor wafe...

Vertical geometry InGaN LED

Modified gold-tin system with increased melting temperature for waf...

Light emitting devices having current reducing structures and metho...

External extraction light emitting diode based upon crystallographi...

LED chip

Methods of treating a silicon carbide substrate for improved epitax...

LED bonding structures and methods of fabricating LED bonding struc...

Systems for assembling components on submounts and methods therefor

Graded dielectric layer

Methods of manufacturing light emitting diodes including barrier la...

Light emitting devices suitable for flip-chip bonding

LED fabrication via ion implant isolation

Robust Group III light emitting diode for high reliability in stand...

LED chip

LED bonding structures and methods of fabricating LED bonding struc...

LED with self aligned bond pad

Light emitting diodes including transparent oxide layers

Light emitting devices with self aligned ohmic contacts

Patents Applicationslast 30 patents

LIGHT EMITTING DIODES INCLUDING BARRIER SUBLAYERS

LOCALIZED ANNEALING OF METAL-SILICON CARBIDE OHMIC CONTACTS AND DEV...

METHODS OF FORMING LIGHT EMITTING DEVICES HAVING CURRENT REDUCING S...

HIGH EFFICIENCY GROUP III NITRIDE LED WITH LENTICULAR SURFACE

Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafe...

METHODS OF FORMING LIGHT EMITTING DEVICES HAVING CURRENT REDUCING S...

LIGHT EMITTING DIODES INCLUDING OPTICALLY MATCHED SUBSTRATES

EXTERNAL EXTRACTION LIGHT EMITTING DIODE BASED UPON CRYSTALLOGRAPHI...

Light Emitting Diode with Improved Light Extraction

LED Bonding Structures and Methods of Fabricating LED Bonding Struc...

LIGHT EMITTING DIODES INCLUDING BARRIER LAYERS/SUBLAYERS AND MANUFA...

LED Fabrication via Ion Implant Isolation

High Efficiency Group III Nitride LED with Lenticular Surface

LIGHT EMITTING DIODES INCLUDING TWO REFLECTOR LAYERS

High Efficiency Group III Nitride LED with Lenticular Surface

LED Fabrication Via Ion Implant Isolation

LED Bonding Structures and Methods of Fabricating LED Bonding Struc...

LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING

VERTICAL GEOMETRY INGAN LED