David Jandzinski

Person

Summerfield, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating contact pads for electronic substrates
- Patent number 11,765,826
- Issue date Sep 19, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact pads for electronic substrates and related methods
- Patent number 10,905,007
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level package with enhanced performance and manufacturing met...
- Patent number 10,882,740
- Issue date Jan 5, 2021
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double-sided module with electromagnetic shielding
- Patent number 10,888,040
- Issue date Jan 5, 2021
- Qorvo US, Inc.
- David Jandzinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided module with electromagnetic shielding
- Patent number 10,856,456
- Issue date Dec 1, 2020
- Qorvo US, Inc.
- David Jandzinski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,773,952
- Issue date Sep 15, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,676,348
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,589,993
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,549,988
- Issue date Feb 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Additive conductor redistribution layer (ACRL)
- Patent number 10,043,707
- Issue date Aug 7, 2018
- Qorvo US, Inc.
- John August Orlowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 10,020,206
- Issue date Jul 10, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,997,376
- Issue date Jun 12, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,960,054
- Issue date May 1, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip module with enhanced properties
- Patent number 9,960,145
- Issue date May 1, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip module with enhanced properties
- Patent number 9,929,125
- Issue date Mar 27, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,929,024
- Issue date Mar 27, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip module with enhanced properties
- Patent number 9,899,350
- Issue date Feb 20, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,892,937
- Issue date Feb 13, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,859,132
- Issue date Jan 2, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,613,831
- Issue date Apr 4, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated dies with enhanced thermal performance
- Patent number 9,576,822
- Issue date Feb 21, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal shielding process using flush structures
- Patent number 8,409,658
- Issue date Apr 2, 2013
- RF Micro Devices, Inc.
- David J. Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal shielding employing segment buildup
- Patent number 8,296,941
- Issue date Oct 30, 2012
- RF Micro Devices, Inc.
- David J. Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210144853
- Publication date May 13, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210007224
- Publication date Jan 7, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200102217
- Publication date Apr 2, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE-SIDED MODULE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20190104653
- Publication date Apr 4, 2019
- Qorvo US, Inc.
- David Jandzinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20170334710
- Publication date Nov 23, 2017
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP MODULE WITH ENHANCED PROPERTIES
- Publication number 20160343592
- Publication date Nov 24, 2016
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE
- Publication number 20160284568
- Publication date Sep 29, 2016
- RF Micro Devices, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE
- Publication number 20160284570
- Publication date Sep 29, 2016
- RF Micro Devices, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
- Publication number 20140146489
- Publication date May 29, 2014
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVE CONDUCTOR REDISTRIBUTION LAYER (ACRL)
- Publication number 20140106564
- Publication date Apr 17, 2014
- RF Micro Devices, Inc.
- John August Orlowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
- Publication number 20110225803
- Publication date Sep 22, 2011
- RF Micro Devices, Inc.
- David J. Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
- Publication number 20100199492
- Publication date Aug 12, 2010
- RF Micro Devices, Inc.
- David J. Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
- Publication number 20090000815
- Publication date Jan 1, 2009
- RF Micro Devices, Inc.
- David J. Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL SHIELDING PROCESS USING FLUSH STRUCTURES
- Publication number 20090000816
- Publication date Jan 1, 2009
- RF Micro Devices, Inc.
- David J. Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

David Jandzinski

Person

Patents Grantslast 30 patents

Method of fabricating contact pads for electronic substrates

Contact pads for electronic substrates and related methods

Wafer-level package with enhanced performance and manufacturing met...

Double-sided module with electromagnetic shielding

Double-sided module with electromagnetic shielding

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Additive conductor redistribution layer (ACRL)

Encapsulated dies with enhanced thermal performance

Encapsulated dies with enhanced thermal performance

Encapsulated dies with enhanced thermal performance

Flip chip module with enhanced properties

Flip chip module with enhanced properties

Encapsulated dies with enhanced thermal performance

Flip chip module with enhanced properties

Encapsulated dies with enhanced thermal performance

Encapsulated dies with enhanced thermal performance

Encapsulated dies with enhanced thermal performance

Encapsulated dies with enhanced thermal performance

Conformal shielding process using flush structures

Conformal shielding employing segment buildup

Patents Applicationslast 30 patents

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

DOUBLE-SIDED MODULE WITH ELECTROMAGNETIC SHIELDING

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

FLIP CHIP MODULE WITH ENHANCED PROPERTIES

ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE

ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE

SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES

ADDITIVE CONDUCTOR REDISTRIBUTION LAYER (ACRL)

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

CONFORMAL SHIELDING PROCESS USING FLUSH STRUCTURES