Deepak K. Pai

Person

Bloomington, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for converting commerical off-the-shelf (COTS)...
- Patent number 9,318,350
- Issue date Apr 19, 2016
- General Dynamics Advanced Information Systems, Inc.
- Deepak Keshav Pai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for filling holes in printed wiring boards
- Patent number 8,726,498
- Issue date May 20, 2014
- General Dynamics Advanced Information Systems
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of connecting a grid array package to a printed circuit board
- Patent number 8,549,737
- Issue date Oct 8, 2013
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile compliant leads
- Patent number 8,481,862
- Issue date Jul 9, 2013
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing leads
- Patent number 8,196,291
- Issue date Jun 12, 2012
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming laminated multiple substrates
- Patent number 8,028,403
- Issue date Oct 4, 2011
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to change solder pad size using a differential...
- Patent number 7,892,441
- Issue date Feb 22, 2011
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for compliantly connecting stack of high-densi...
- Patent number 7,818,879
- Issue date Oct 26, 2010
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for filling holes in printed wiring boards
- Patent number 7,802,360
- Issue date Sep 28, 2010
- General Dynamics Advanced Information Systems, Inc.
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method of using a compliant lead interposer
- Patent number 7,684,205
- Issue date Mar 23, 2010
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for a segmented squeegee for stenciling
- Patent number 7,614,341
- Issue date Nov 10, 2009
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for compliantly connecting stack of high-densi...
- Patent number 7,503,767
- Issue date Mar 17, 2009
- General Dynamics Advanced Information Systems, Inc.
- Deepak Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for laminating multiple substrates
- Patent number 7,490,402
- Issue date Feb 17, 2009
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated multiple substrates
- Patent number 7,282,787
- Issue date Oct 16, 2007
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated multilayer package
- Patent number 6,856,008
- Issue date Feb 15, 2005
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to compliantly interconnect commercial-off-the...
- Patent number 6,830,177
- Issue date Dec 14, 2004
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing laminated high layer count printed circui...
- Patent number 6,742,247
- Issue date Jun 1, 2004
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to compliantly interconnect area grid arrays a...
- Patent number 6,493,238
- Issue date Dec 10, 2002
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for connecting area grid arrays to printed wir...
- Patent number 6,000,126
- Issue date Dec 14, 1999
- General Dynamics Information Systems, Inc.
- Deepak Keshay Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated multilayer substrates
- Patent number 5,986,339
- Issue date Nov 16, 1999
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing an operation on an integrated circuit
- Patent number 5,977,784
- Issue date Nov 2, 1999
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- G01 - MEASURING TESTING
Information Patent Grant
Process of making interposers for land grip arrays
- Patent number 5,953,816
- Issue date Sep 21, 1999
- General Dynamics Information Systems, Inc.
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for machining conductive structures on substrates
- Patent number 5,871,868
- Issue date Feb 16, 1999
- General Dynamics Information Systems, Inc.
- Deepak Keshav Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for performing a function on an integrated circuit
- Patent number 5,831,444
- Issue date Nov 3, 1998
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- G01 - MEASURING TESTING
Information Patent Grant
Laminated multilayer substrates
- Patent number 5,786,238
- Issue date Jul 28, 1998
- Generyal Dynamics Information Systems, Inc.
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to wick solder from conductive surfaces
- Patent number 5,746,367
- Issue date May 5, 1998
- Ceridan Corporation
- Deepak Keshav Pai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for attaching/detaching a land grid array component to a...
- Patent number 5,740,954
- Issue date Apr 21, 1998
- General Dynamics Information Systems, Inc.
- Deepak Keshav Pai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of measuring coplanarity of circuit pads and/or grid arrays
- Patent number 5,734,475
- Issue date Mar 31, 1998
- Ceridian Corporation
- Deepak K. Pai
- G01 - MEASURING TESTING
Information Patent Grant
Mark of an electronic component lid
- Patent number 5,466,540
- Issue date Nov 14, 1995
- Ceridian Corporation
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask alignment mark system
- Patent number 5,407,763
- Issue date Apr 18, 1995
- Ceridian Corporation
- Deepak K. Pai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Converting Commerical Off-The-Shelf (COTS)...
- Publication number 20140131307
- Publication date May 15, 2014
- Deepak Keshav Pai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS...
- Publication number 20110157855
- Publication date Jun 30, 2011
- General Dynamics Advanced Information Systems
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and methods of attaching hybrid vlsi chips to printed wir...
- Publication number 20110101075
- Publication date May 5, 2011
- General Dynamics Advanced Information Systems
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for filling holes in printed wiring boards
- Publication number 20110067235
- Publication date Mar 24, 2011
- General Dynamics Advanced Information Systems, Inc.
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method of using a compliant lead interposer
- Publication number 20100175248
- Publication date Jul 15, 2010
- General Dynamics Advanced
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and methods of attaching hybrid vlsi chips to printed wir...
- Publication number 20090250506
- Publication date Oct 8, 2009
- General Dynamics Advanced Information Systems
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for compliantly connecting stack of high-densi...
- Publication number 20090246984
- Publication date Oct 1, 2009
- Deepak Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Technique for laminating multiple substrates
- Publication number 20090151158
- Publication date Jun 18, 2009
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus to change solder pad size using a differential...
- Publication number 20080296253
- Publication date Dec 4, 2008
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for manufacturing C-shaped leads
- Publication number 20080106877
- Publication date May 8, 2008
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Technique for laminating multiple substrates
- Publication number 20080066304
- Publication date Mar 20, 2008
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for compliantly connecting stack of high-densi...
- Publication number 20080032517
- Publication date Feb 7, 2008
- General Dynamics Advanced Information Systems
- Deepak Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical fiber cable to inject or extract light
- Publication number 20070193772
- Publication date Aug 23, 2007
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Low profile compliant leads
- Publication number 20070190822
- Publication date Aug 16, 2007
- General Dynamics Advanced Information Systems, Inc.
- Deepak Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Dielectric barrier discharge plasma reactor cell
- Publication number 20050179395
- Publication date Aug 18, 2005
- Deepak Pai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Methods for filling holes in printed wiring boards
- Publication number 20050011069
- Publication date Jan 20, 2005
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Technique for laminating multiple substrates
- Publication number 20040246688
- Publication date Dec 9, 2004
- General Dynamics Advanced Information Systems, Inc
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated multilayer package
- Publication number 20040032028
- Publication date Feb 19, 2004
- General Dynamics Advanced Information Systems, Inc
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lamination of high-layer-count substrates
- Publication number 20030174484
- Publication date Sep 18, 2003
- General Dynamics Advanced Information Systems, Inc
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus to compliantly interconnect commercial-off-the...
- Publication number 20030049952
- Publication date Mar 13, 2003
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric barrier discharge plasma reactor cell
- Publication number 20030030374
- Publication date Feb 13, 2003
- Deepak Pai
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Deepak K. Pai

Person

Patents Grantslast 30 patents

Method and apparatus for converting commerical off-the-shelf (COTS)...

Methods for filling holes in printed wiring boards

Method of connecting a grid array package to a printed circuit board

Low profile compliant leads

Method for manufacturing leads

Method for forming laminated multiple substrates

Method and apparatus to change solder pad size using a differential...

Method and apparatus for compliantly connecting stack of high-densi...

Methods for filling holes in printed wiring boards

System and method of using a compliant lead interposer

Apparatus and method for a segmented squeegee for stenciling

Method and apparatus for compliantly connecting stack of high-densi...

Technique for laminating multiple substrates

Laminated multiple substrates

Laminated multilayer package

Method and apparatus to compliantly interconnect commercial-off-the...

Process for manufacturing laminated high layer count printed circui...

Method and apparatus to compliantly interconnect area grid arrays a...

Method and apparatus for connecting area grid arrays to printed wir...

Laminated multilayer substrates

Method of performing an operation on an integrated circuit

Process of making interposers for land grip arrays

Apparatus and method for machining conductive structures on substrates

Apparatus for performing a function on an integrated circuit

Laminated multilayer substrates

Method and apparatus to wick solder from conductive surfaces

Apparatus for attaching/detaching a land grid array component to a...

Process of measuring coplanarity of circuit pads and/or grid arrays

Mark of an electronic component lid

Mask alignment mark system

Patents Applicationslast 30 patents

Method and Apparatus for Converting Commerical Off-The-Shelf (COTS)...

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS...

Apparatus and methods of attaching hybrid vlsi chips to printed wir...

Methods for filling holes in printed wiring boards

System and method of using a compliant lead interposer

Apparatus and methods of attaching hybrid vlsi chips to printed wir...

Method and apparatus for compliantly connecting stack of high-densi...

Technique for laminating multiple substrates

Method and apparatus to change solder pad size using a differential...

System and method for manufacturing C-shaped leads

Technique for laminating multiple substrates

Method and apparatus for compliantly connecting stack of high-densi...

Optical fiber cable to inject or extract light

Low profile compliant leads

Dielectric barrier discharge plasma reactor cell

Methods for filling holes in printed wiring boards

Technique for laminating multiple substrates

Laminated multilayer package

Lamination of high-layer-count substrates

Method and apparatus to compliantly interconnect commercial-off-the...

Dielectric barrier discharge plasma reactor cell