Derek J. Gochnour

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor packages and related methods
- Patent number 11,462,580
- Issue date Oct 4, 2022
- Semiconductor Components Industries, LLC
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 10,770,492
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 10,079,254
- Issue date Sep 18, 2018
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 9,754,983
- Issue date Sep 5, 2017
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using data regarding manufacturing procedures integrated...
- Patent number 7,561,938
- Issue date Jul 14, 2009
- Micron Technology, Inc.
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dicing saw with variable indexing capability
- Patent number 7,387,119
- Issue date Jun 17, 2008
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for reducing warpage during application and curing of encaps...
- Patent number 7,166,252
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for using data regarding manufacturing procedures integrated...
- Patent number 7,155,300
- Issue date Dec 26, 2006
- Micron Technology, Inc.
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for using data regarding manufacturing procedures integrated...
- Patent number 7,120,513
- Issue date Oct 10, 2006
- Micron Technology, Inc.
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid interconnect and system for testing semiconductor dice
- Patent number 7,049,840
- Issue date May 23, 2006
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Substrate mapping
- Patent number 7,022,533
- Issue date Apr 4, 2006
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring element for use in an apparatus for attaching to a semicondu...
- Patent number 7,011,532
- Issue date Mar 14, 2006
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Reduced-sized memory card package, length-extending adaptor and met...
- Patent number 6,970,359
- Issue date Nov 29, 2005
- Micron Technology, Inc.
- Derek J. Gochnour
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spring element for use in an apparatus for attaching to a semicondu...
- Patent number 6,939,145
- Issue date Sep 6, 2005
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,932,077
- Issue date Aug 23, 2005
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,897,571
- Issue date May 24, 2005
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate mapping
- Patent number 6,888,159
- Issue date May 3, 2005
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to secure an adaptor to a reduced-sized memory...
- Patent number 6,865,086
- Issue date Mar 8, 2005
- Micron Technology, Inc.
- Derek J. Gochnour
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate mapping
- Patent number 6,841,796
- Issue date Jan 11, 2005
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing warpage during application and curing of encaps...
- Patent number 6,830,719
- Issue date Dec 14, 2004
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate mapping
- Patent number 6,808,947
- Issue date Oct 26, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring element for use in an apparatus for attaching to a semicondu...
- Patent number 6,806,493
- Issue date Oct 19, 2004
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for reducing warpage during application and cu...
- Patent number 6,764,549
- Issue date Jul 20, 2004
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clip chip carrier
- Patent number 6,730,999
- Issue date May 4, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSP BGA test socket with insert and method
- Patent number 6,710,612
- Issue date Mar 23, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Spring element for use in an apparatus for attaching to a semicondu...
- Patent number 6,703,640
- Issue date Mar 9, 2004
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,691,696
- Issue date Feb 17, 2004
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Sawing method employing multiple indexing techniques and semiconduc...
- Patent number 6,687,990
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of forming a semiconductor chip carrier
- Patent number 6,656,754
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test carrier with molded interconnect for testing semiconductor com...
- Patent number 6,642,730
- Issue date Nov 4, 2003
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20220415943
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20200411573
- Publication date Dec 31, 2020
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- G02 - OPTICS
Information Patent Application
CHIP SCALE PACKAGE AND RELATED METHODS
- Publication number 20180342549
- Publication date Nov 29, 2018
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND RELATED METHODS
- Publication number 20180019275
- Publication date Jan 18, 2018
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...
- Publication number 20160031707
- Publication date Feb 4, 2016
- Micron Technology, Inc.
- Jonathon G. Greenwood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CONDUCTIVE SHIELD FOR MICROELECTRONIC DEVICE ASSEMBLIES...
- Publication number 20090243051
- Publication date Oct 1, 2009
- Micron Technology, Inc.
- Kiran Kumar Vanam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD STRUCTURES FOR SEMICONDUCTOR CO...
- Publication number 20090243012
- Publication date Oct 1, 2009
- Micron Technology, Inc.
- Kiran Kumar Vanam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices and methods for manufacturing microelectron...
- Publication number 20070045807
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- Jonathon G. Greenwood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate mapping
- Publication number 20060168552
- Publication date Jul 27, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing saw with variable indexing capability
- Publication number 20050211236
- Publication date Sep 29, 2005
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Spring element for use in an apparatus for attaching to a semicondu...
- Publication number 20050191876
- Publication date Sep 1, 2005
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Method for reducing warpage during application and curing of encaps...
- Publication number 20050087909
- Publication date Apr 28, 2005
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduced-sized memory card package, length-extending, adaptor and me...
- Publication number 20050007745
- Publication date Jan 13, 2005
- Derek J. Gochnour
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Substrate mapping
- Publication number 20040171179
- Publication date Sep 2, 2004
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for sawing wafers employing multiple indexing techniques for...
- Publication number 20040089282
- Publication date May 13, 2004
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and apparatus for reducing warpage during application and cu...
- Publication number 20040011283
- Publication date Jan 22, 2004
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method to secure an adaptor to a reduced-sized memory...
- Publication number 20040009708
- Publication date Jan 15, 2004
- Derek J. Gochnour
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Spring element for use in an apparatus for attaching to a semicondu...
- Publication number 20030192172
- Publication date Oct 16, 2003
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Method for using data regarding manufacturing procedures integrated...
- Publication number 20030191550
- Publication date Oct 9, 2003
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Substrate mapping
- Publication number 20030162311
- Publication date Aug 28, 2003
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing warpage during application and curing of encaps...
- Publication number 20030111766
- Publication date Jun 19, 2003
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate mapping
- Publication number 20030047805
- Publication date Mar 13, 2003
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate mapping
- Publication number 20030046810
- Publication date Mar 13, 2003
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MAPPING
- Publication number 20030038365
- Publication date Feb 27, 2003
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for sawing wafers employing multiple indexing techniques for...
- Publication number 20030030122
- Publication date Feb 13, 2003
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CSP BGA test socket with insert and method
- Publication number 20030011393
- Publication date Jan 16, 2003
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Sawing method employing multiple indexing techniques and semiconduc...
- Publication number 20020194968
- Publication date Dec 26, 2002
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CSP BGA test socket with insert and method
- Publication number 20020190739
- Publication date Dec 19, 2002
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Spring element for use in an apparatus for attaching to a semicondu...
- Publication number 20020117791
- Publication date Aug 29, 2002
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Method for using data regarding manufacturing procedures integrated...
- Publication number 20020082740
- Publication date Jun 27, 2002
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING

Derek J. Gochnour

Person

Patents Grantslast 30 patents

Image sensor packages and related methods

Chip scale package and related methods

Chip scale package and related methods

Chip scale package and related methods

Method for using data regarding manufacturing procedures integrated...

Dicing saw with variable indexing capability

Method for reducing warpage during application and curing of encaps...

Method for using data regarding manufacturing procedures integrated...

Method for using data regarding manufacturing procedures integrated...

Hybrid interconnect and system for testing semiconductor dice

Substrate mapping

Spring element for use in an apparatus for attaching to a semicondu...

Reduced-sized memory card package, length-extending adaptor and met...

Spring element for use in an apparatus for attaching to a semicondu...

Method for sawing wafers employing multiple indexing techniques for...

Method for sawing wafers employing multiple indexing techniques for...

Substrate mapping

Apparatus and method to secure an adaptor to a reduced-sized memory...

Substrate mapping

Method for reducing warpage during application and curing of encaps...

Substrate mapping

Spring element for use in an apparatus for attaching to a semicondu...

Method and apparatus for reducing warpage during application and cu...

Clip chip carrier

CSP BGA test socket with insert and method

Spring element for use in an apparatus for attaching to a semicondu...

Method for sawing wafers employing multiple indexing techniques for...

Sawing method employing multiple indexing techniques and semiconduc...

Method of forming a semiconductor chip carrier

Test carrier with molded interconnect for testing semiconductor com...

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGES AND RELATED METHODS

IMAGE SENSOR PACKAGES AND RELATED METHODS

CHIP SCALE PACKAGE AND RELATED METHODS

CHIP SCALE PACKAGE AND RELATED METHODS

MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...

INTEGRATED CONDUCTIVE SHIELD FOR MICROELECTRONIC DEVICE ASSEMBLIES...

ELECTROMAGNETIC INTERFERENCE SHIELD STRUCTURES FOR SEMICONDUCTOR CO...

Microelectronic devices and methods for manufacturing microelectron...

Substrate mapping

Dicing saw with variable indexing capability

Spring element for use in an apparatus for attaching to a semicondu...

Method for reducing warpage during application and curing of encaps...

Reduced-sized memory card package, length-extending, adaptor and me...

Substrate mapping

Method for sawing wafers employing multiple indexing techniques for...

Method and apparatus for reducing warpage during application and cu...

Apparatus and method to secure an adaptor to a reduced-sized memory...

Spring element for use in an apparatus for attaching to a semicondu...

Method for using data regarding manufacturing procedures integrated...

Substrate mapping

Method for reducing warpage during application and curing of encaps...

Substrate mapping

Substrate mapping

SUBSTRATE MAPPING

Method for sawing wafers employing multiple indexing techniques for...

CSP BGA test socket with insert and method

Sawing method employing multiple indexing techniques and semiconduc...

CSP BGA test socket with insert and method

Spring element for use in an apparatus for attaching to a semicondu...

Method for using data regarding manufacturing procedures integrated...