Douglas Hawks

Person

Escondido, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems microphone packaging systems
- Patent number 8,421,168
- Issue date Apr 16, 2013
- Fairchild Semiconductor Corporation
- Howard Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package with embedded components
- Patent number 8,304,888
- Issue date Nov 6, 2012
- Fairchild Semiconductor Corporation
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making micromodules including integrated thin film inductors
- Patent number 8,110,474
- Issue date Feb 7, 2012
- Fairchild Semiconductor Corporation
- Francesco Carobolante
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Micromodules including integrated thin film inductors
- Patent number 7,838,964
- Issue date Nov 23, 2010
- Fairchild Semiconductor Corporation
- Francesco Carobolante
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and structure for securing a mold compound to a printed circ...
- Patent number 6,903,270
- Issue date Jun 7, 2005
- Skyworks Solutions, Inc.
- Doug A. Hawks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER DICING METHODS
- Publication number 20180233410
- Publication date Aug 16, 2018
- pSemi Corporation
- JOHN JAMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED COMPONENTS
- Publication number 20110147917
- Publication date Jun 23, 2011
- Fairchild Semiconductor Corporation
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS
- Publication number 20110121413
- Publication date May 26, 2011
- Howard Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS O...
- Publication number 20110030206
- Publication date Feb 10, 2011
- Francesco Carobolante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-Modules with Molded Passive Components, Systems Using the Sam...
- Publication number 20090315162
- Publication date Dec 24, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Packages with Stacked Flexible Modules Having Pas...
- Publication number 20090315163
- Publication date Dec 24, 2009
- Terry Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromodules Including Integrated Thin Film Inductors and Methods o...
- Publication number 20090212391
- Publication date Aug 27, 2009
- Francesco Carobolante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity down ball grid array package with EMI shielding and reduced...
- Publication number 20020096767
- Publication date Jul 25, 2002
- Kevin J. Cote
- H01 - BASIC ELECTRIC ELEMENTS

Douglas Hawks

Person

Patents Grantslast 30 patents

Microelectromechanical systems microphone packaging systems

Integrated circuit package with embedded components

Method of making micromodules including integrated thin film inductors

Micromodules including integrated thin film inductors

Method and structure for securing a mold compound to a printed circ...

Patents Applicationslast 30 patents

WAFER DICING METHODS

INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED COMPONENTS

MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS

MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS O...

Micro-Modules with Molded Passive Components, Systems Using the Sam...

Semiconductor Die Packages with Stacked Flexible Modules Having Pas...

Micromodules Including Integrated Thin Film Inductors and Methods o...

Cavity down ball grid array package with EMI shielding and reduced...