Durodami Joscelyn Lisk

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple (multi-) die integrated circuit (IC) packages for supporti...
- Patent number 12,062,648
- Issue date Aug 13, 2024
- QUALCOMM Incorporated
- Darko Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die employing repurposed seed layer for forming addit...
- Patent number 11,817,406
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless interconnects in an interposer
- Patent number 9,165,791
- Issue date Oct 20, 2015
- QUALCOMM Incorporated
- Xiaoxia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced package thermal management using external and internal cap...
- Patent number 9,136,202
- Issue date Sep 15, 2015
- QUALCOMM Incorporated
- Victor A. Chiriac
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...
- Publication number 20240363605
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Darko POPOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACIT...
- Publication number 20240038831
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INT...
- Publication number 20230163113
- Publication date May 25, 2023
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE (MULTI-) DIE INTEGRATED CIRCUIT (IC) PACKAGES FOR SUPPORTI...
- Publication number 20230102167
- Publication date Mar 30, 2023
- QUALCOMM Incorporated
- Darko Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE EMPLOYING REPURPOSED SEED LAYER FOR FORMING ADDIT...
- Publication number 20230090181
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS INTERCONNECTS IN AN INTERPOSER
- Publication number 20150115405
- Publication date Apr 30, 2015
- QUALCOMM Incorporated
- Xiaoxia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-ENABLED PACKAGE-ON-PACKAGE
- Publication number 20140252561
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Durodami Joscelyn Lisk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT...
- Publication number 20140225246
- Publication date Aug 14, 2014
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT FLOORPLAN FOR A MULTI-TIER STACKED IC PACKAGE
- Publication number 20130286595
- Publication date Oct 31, 2013
- QUALCOMM Incorporated
- Durodami J. Lisk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAP...
- Publication number 20130270721
- Publication date Oct 17, 2013
- QUALCOMM Incorporated
- Victor A. Chiriac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing Arrangements of Vias
- Publication number 20110193212
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Durodami Joscelyn Lisk

Person

Patents Grantslast 30 patents

Multiple (multi-) die integrated circuit (IC) packages for supporti...

Semiconductor die employing repurposed seed layer for forming addit...

Wireless interconnects in an interposer

Enhanced package thermal management using external and internal cap...

Patents Applicationslast 30 patents

STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACIT...

PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INT...

MULTIPLE (MULTI-) DIE INTEGRATED CIRCUIT (IC) PACKAGES FOR SUPPORTI...

SEMICONDUCTOR DIE EMPLOYING REPURPOSED SEED LAYER FOR FORMING ADDIT...

WIRELESS INTERCONNECTS IN AN INTERPOSER

VIA-ENABLED PACKAGE-ON-PACKAGE

DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT...

THERMAL MANAGEMENT FLOORPLAN FOR A MULTI-TIER STACKED IC PACKAGE

ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAP...

Systems and Methods Providing Arrangements of Vias