Eiji Kono

Person

Kariya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat sink for power module
- Patent number 8,411,438
- Issue date Apr 2, 2013
- Kabushiki Kaisha Toyota Jidoshokki
- Hidehito Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device
- Patent number 8,391,011
- Issue date Mar 5, 2013
- Kabushiki Kaisha Toyota Jidoshokki
- Shogo Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heat sink for power module
- Patent number 8,387,685
- Issue date Mar 5, 2013
- Kabushiki Kaisha Toshiba Jidoshokki
- Masahiko Kimbara
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device includes a ceramic substrate and heat sink
- Patent number 8,299,606
- Issue date Oct 30, 2012
- Kabushiki Kaisha Toyota Jidoshokki
- Shogo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having anti-warping sheet
- Patent number 8,283,773
- Issue date Oct 9, 2012
- Kabushiki Kaisha Toyota Jidoshokki
- Shogo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiator and power module
- Patent number 8,198,539
- Issue date Jun 12, 2012
- Kabushiki Kaisha Toyota Jidoshokki
- Kota Otoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 7,923,833
- Issue date Apr 12, 2011
- Showa Denko K.K.
- Yuichi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiator member for electronic appliances and processes for produci...
- Patent number 7,364,632
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of producing base plate circuit board, base plate for circui...
- Patent number 7,323,255
- Issue date Jan 29, 2008
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a low expansion material and semiconductor...
- Patent number 7,196,417
- Issue date Mar 27, 2007
- Kabushiki Kaisha Toyota Jidoshokki
- Tomohei Sugiyama
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite structural material, and method of producing the same
- Patent number 7,097,914
- Issue date Aug 29, 2006
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-expansion unit, method of manufacturing the same and semiconduc...
- Patent number 7,087,316
- Issue date Aug 8, 2006
- Kabushiki Kaisha Toyota Jidoshokki
- Takashi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material and method for manufacturing the same
- Patent number 6,994,917
- Issue date Feb 7, 2006
- Kabushiki Kaisha Toyota Jidoshokki
- Kyoichi Kinoshita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,885,097
- Issue date Apr 26, 2005
- Kabushiki Kaisha Toyota Jidoshokki
- Kazuhiro Maeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating material and manufacturing method thereof
- Patent number 6,753,093
- Issue date Jun 22, 2004
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for filling powder, apparatus therefor and process for prod...
- Patent number 6,698,465
- Issue date Mar 2, 2004
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Radiator plate and process for manufacturing the same
- Patent number 6,597,574
- Issue date Jul 22, 2003
- Kabushiki Kaisha Toyota Jidoshokki
- Kyoichi Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of power module radiation
- Patent number 6,529,380
- Issue date Mar 4, 2003
- Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- Eiji Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 6,521,992
- Issue date Feb 18, 2003
- Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- Eiji Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 6,459,146
- Issue date Oct 1, 2002
- Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- Eiji Kono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK FOR POWER MODULE
- Publication number 20140140004
- Publication date May 22, 2014
- SHOWA DENKO K.K.
- Hidehito KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120126390
- Publication date May 24, 2012
- Kabushiki Kaisha Toyota Jidoshokki
- Shogo MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20110235279
- Publication date Sep 29, 2011
- Kabushiki Kaisha Toyota Jidoshokki
- Shogo MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100193941
- Publication date Aug 5, 2010
- Kabushiki Kaisha Toyota Jidoshokki
- Shogo MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR POWER MODULE
- Publication number 20090314474
- Publication date Dec 24, 2009
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Masahiko Kimbara
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Sink For Power Module
- Publication number 20090302458
- Publication date Dec 10, 2009
- Hidehito Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE AND POWER MODULE
- Publication number 20090200065
- Publication date Aug 13, 2009
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Kota Otoshi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Module
- Publication number 20090174063
- Publication date Jul 9, 2009
- Yuichi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK DEVICE
- Publication number 20090139704
- Publication date Jun 4, 2009
- Kabushiki Kaisha Toyota Jidoshokki
- Kota Otoshi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF PRODUCING BASE PLATE FOR CIRCUIT BOARD, BASE PLATE FOR CI...
- Publication number 20080087400
- Publication date Apr 17, 2008
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20070045801
- Publication date Mar 1, 2007
- Tomohei Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing composite material
- Publication number 20060249500
- Publication date Nov 9, 2006
- Hidehiro Kudo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Circuit board and manufacturing method thereof
- Publication number 20060214295
- Publication date Sep 28, 2006
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing base plate circuit board, base plate for circui...
- Publication number 20060046035
- Publication date Mar 2, 2006
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and semiconductor device using the same
- Publication number 20050029658
- Publication date Feb 10, 2005
- Tomohei Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low-expansion unit, method of manufacturing the same and semiconduc...
- Publication number 20050031889
- Publication date Feb 10, 2005
- Takashi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material and method for manufacturing the same
- Publication number 20040142202
- Publication date Jul 22, 2004
- Kyoichi Kinoshita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a low expansion material and semiconductor...
- Publication number 20040130018
- Publication date Jul 8, 2004
- Tomohei Sugiyama
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Composite structural material, and method of producing the same
- Publication number 20040101707
- Publication date May 27, 2004
- Katsufumi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat dissipation member for electronic apparatus and method for pro...
- Publication number 20040094537
- Publication date May 20, 2004
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor module and plate-shaped lead
- Publication number 20040065947
- Publication date Apr 8, 2004
- Tomohei Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low expansion plate, method of manufacturing the same, and semicond...
- Publication number 20040041244
- Publication date Mar 4, 2004
- Tomohei Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiator system, radiating method, thermal buffer, semiconductor mo...
- Publication number 20040016748
- Publication date Jan 29, 2004
- Kyoichi Kinoshita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radiator plate and process for manufacturing the same
- Publication number 20030198019
- Publication date Oct 23, 2003
- Kyoichi Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating material and manufacturing method thereof
- Publication number 20030066621
- Publication date Apr 10, 2003
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Process for filling powder, apparatus therefor and process for prod...
- Publication number 20030041915
- Publication date Mar 6, 2003
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device
- Publication number 20020158327
- Publication date Oct 31, 2002
- Kazuhiro Maeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiator plate and process for manufacturing the same
- Publication number 20020063499
- Publication date May 30, 2002
- Kyoichi Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus
- Publication number 20020011350
- Publication date Jan 31, 2002
- Eiji Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus
- Publication number 20010050421
- Publication date Dec 13, 2001
- Eiji Kono
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Heat sink for power module

Cooling device

Heat sink for power module

Semiconductor device includes a ceramic substrate and heat sink

Semiconductor device having anti-warping sheet

Heat radiator and power module

Semiconductor module

Radiator member for electronic appliances and processes for produci...

Method of producing base plate circuit board, base plate for circui...

Method of manufacturing a low expansion material and semiconductor...

Composite structural material, and method of producing the same

Low-expansion unit, method of manufacturing the same and semiconduc...

Composite material and method for manufacturing the same

Semiconductor device

Heat dissipating material and manufacturing method thereof

Process for filling powder, apparatus therefor and process for prod...

Radiator plate and process for manufacturing the same

Structure of power module radiation

Semiconductor apparatus

Semiconductor apparatus

Patents Applicationslast 30 patents

HEAT SINK FOR POWER MODULE

SEMICONDUCTOR DEVICE

COOLING DEVICE

SEMICONDUCTOR DEVICE

HEAT SINK FOR POWER MODULE

Heat Sink For Power Module

HEAT DISSIPATION DEVICE AND POWER MODULE

Semiconductor Module

HEAT SINK DEVICE

METHOD OF PRODUCING BASE PLATE FOR CIRCUIT BOARD, BASE PLATE FOR CI...

Circuit board

Method of manufacturing composite material

Circuit board and manufacturing method thereof

Method of producing base plate circuit board, base plate for circui...

Circuit board and semiconductor device using the same

Low-expansion unit, method of manufacturing the same and semiconduc...

Composite material and method for manufacturing the same

Method of manufacturing a low expansion material and semiconductor...

Composite structural material, and method of producing the same

Heat dissipation member for electronic apparatus and method for pro...

Semiconductor module and plate-shaped lead

Low expansion plate, method of manufacturing the same, and semicond...

Radiator system, radiating method, thermal buffer, semiconductor mo...

Radiator plate and process for manufacturing the same

Heat dissipating material and manufacturing method thereof

Process for filling powder, apparatus therefor and process for prod...

Semiconductor device

Radiator plate and process for manufacturing the same

Semiconductor apparatus

Semiconductor apparatus