Eric D. Johnson

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
High resistivity substrate final resistance test structure
- Patent number 9,383,404
- Issue date Jul 5, 2016
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- G01 - MEASURING TESTING
Information Patent Grant
Fixed gantry CT system having a non-uniform slit
- Patent number 9,093,187
- Issue date Jul 28, 2015
- SureScan Corporation
- Eric Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for determining adjustable wafer acceptance cri...
- Patent number 8,862,417
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test equipment for verification of crystal linearity at high-flux l...
- Patent number 8,039,812
- Issue date Oct 18, 2011
- SureScan Corporation
- Michael Crocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor for monitoring environmental parameters in concrete
- Patent number 7,551,058
- Issue date Jun 23, 2009
- Advanced Design Consulting USA, Inc.
- Eric Arthur Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Passive alignment of VCSELs to waveguides in opto-electronic cards...
- Patent number 7,499,614
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Eric A. Johnson
- G02 - OPTICS
Information Patent Grant
Undersea data logging device with automated data transmission
- Patent number 7,380,453
- Issue date Jun 3, 2008
- Advanced Design Consulting USA, Inc.
- Eric Van Every
- G01 - MEASURING TESTING
Information Patent Grant
System for allergen reduction through indoor humidity control
- Patent number 7,264,649
- Issue date Sep 4, 2007
- Advanced Design Consulting USA, Inc.
- Eric Arthur Johnson
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Device for collecting statistical data for maintenance of small-arms
- Patent number 7,143,644
- Issue date Dec 5, 2006
- Advanced Design Consulting USA, Inc.
- Eric Arthur Johnson
- F41 - WEAPONS
Information Patent Grant
Winch assembly for use with synthetic ropes
- Patent number 7,134,645
- Issue date Nov 14, 2006
- Advanced Design Consulting USA
- Eric Arthur Johnson
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,119,003
- Issue date Oct 10, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for collecting statistical data for maintenance of small-arms
- Patent number 7,100,437
- Issue date Sep 5, 2006
- Advanced Design Consulting USA, Inc.
- Eric Arthur Johnson
- F41 - WEAPONS
Information Patent Grant
Packaging integrated circuits with adhesive posts
- Patent number 7,094,966
- Issue date Aug 22, 2006
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,067,916
- Issue date Jun 27, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel-plate capacitive element for monitoring environmental para...
- Patent number 7,038,470
- Issue date May 2, 2006
- Advanced Design Consulting, USA, Ind.
- Eric Arthur Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for measuring the magnetic field produced by an insertion...
- Patent number 7,019,522
- Issue date Mar 28, 2006
- Advanced Design Consulting USA
- Eric Arthur Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Patent number 6,984,286
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming
- Patent number 6,933,619
- Issue date Aug 23, 2005
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially captured oriented interconnections for BGA packages and a...
- Patent number 6,913,948
- Issue date Jul 5, 2005
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array stiffener for use with flexible chip carriers
- Patent number 6,905,961
- Issue date Jun 14, 2005
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for convection cooling in horizontal applications
- Patent number 6,883,593
- Issue date Apr 26, 2005
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for multi-processor shared-memory system
- Patent number 6,793,123
- Issue date Sep 21, 2004
- International Business Machines Corporation
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially captured oriented interconnections for BGA packages and a...
- Patent number 6,774,474
- Issue date Aug 10, 2004
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink for convection cooling in horizontal applications
- Patent number 6,691,769
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for electronic component
- Patent number 6,677,522
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Charles F. Carey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled-cap flip chip BGA package with improved cap design for redu...
- Patent number 6,670,223
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an apparatus to reduce thermal fatigue stress on...
- Patent number 6,667,557
- Issue date Dec 23, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface for an electronic module
- Patent number 6,665,186
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Varaprasad V. Calmidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to reduce thermal fatigue stress on flip chip solder conn...
- Patent number 6,570,259
- Issue date May 27, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Patent number 6,545,869
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH RESISTIVITY SUBSTRATE FINAL RESISTANCE TEST STRUCTURE
- Publication number 20160161545
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING ADJUSTABLE WAFER ACCEPTANCE CRI...
- Publication number 20120310574
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Albert M. CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST EQUIPMENT FOR VERIFICATION OF CRYSTAL LINEARITY AT HIGH-FLUX L...
- Publication number 20110248177
- Publication date Oct 13, 2011
- Michael Crocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20050224973
- Publication date Oct 13, 2005
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR COLLECTING STATISTICAL DATA FOR MAINTENANCE OF SMALL-ARMS
- Publication number 20050155420
- Publication date Jul 21, 2005
- Eric Arthur Johnson
- F41 - WEAPONS
Information Patent Application
Device for collecting statistical data for maintenance of small-arms
- Publication number 20050114084
- Publication date May 26, 2005
- Advanced Design Consulting USA, Inc.
- Eric Arthur Johnson
- F41 - WEAPONS
Information Patent Application
Passive alignment of VCSELs to waveguides in opto-electronic cards...
- Publication number 20050089264
- Publication date Apr 28, 2005
- International Business Machines Corporation
- Eric A. Johnson
- G02 - OPTICS
Information Patent Application
Heat sink for convection cooling in horizontal applications
- Publication number 20040149423
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially captured oriented interconnections for BGA packages and a...
- Publication number 20040099936
- Publication date May 27, 2004
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging integrated circuits with adhesive posts
- Publication number 20040075990
- Publication date Apr 22, 2004
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN APPARATUS TO REDUCE THERMAL FATIGUE STRESS ON...
- Publication number 20030210531
- Publication date Nov 13, 2003
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging for multi-processor shared-memory system
- Publication number 20030146268
- Publication date Aug 7, 2003
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Publication number 20030101582
- Publication date Jun 5, 2003
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array stiffener for use with flexible chip carriers
- Publication number 20030090000
- Publication date May 15, 2003
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coupled-cap flip chip BGA package with improved cap design for redu...
- Publication number 20030053297
- Publication date Mar 20, 2003
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package and method of forming
- Publication number 20030034569
- Publication date Feb 20, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink for convection cooling in horizontal applications
- Publication number 20030029601
- Publication date Feb 13, 2003
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20020195707
- Publication date Dec 26, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array stiffener use with flexible chip carriers
- Publication number 20020180061
- Publication date Dec 5, 2002
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT MULTI-LAYERED CIRCUIT BOARD FOR PBGA APPLICATIONS
- Publication number 20020139570
- Publication date Oct 3, 2002
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED BODY FOR PBGA AND CHIP-SCALE PACKAGES
- Publication number 20020140108
- Publication date Oct 3, 2002
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Publication number 20020141160
- Publication date Oct 3, 2002
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus to reduce thermal fatigue stress on flip chip solder conn...
- Publication number 20020135063
- Publication date Sep 26, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coupled-cap flip chip BGA package with improved cap design for redu...
- Publication number 20020121694
- Publication date Sep 5, 2002
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integral design features for heatsink attach for electronic packages
- Publication number 20010005312
- Publication date Jun 28, 2001
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming BGA interconnections having mixed solder profiles
- Publication number 20010000925
- Publication date May 10, 2001
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS

Eric D. Johnson

Person

Patents Grantslast 30 patents

High resistivity substrate final resistance test structure

Fixed gantry CT system having a non-uniform slit

Systems and methods for determining adjustable wafer acceptance cri...

Test equipment for verification of crystal linearity at high-flux l...

Sensor for monitoring environmental parameters in concrete

Passive alignment of VCSELs to waveguides in opto-electronic cards...

Undersea data logging device with automated data transmission

System for allergen reduction through indoor humidity control

Device for collecting statistical data for maintenance of small-arms

Winch assembly for use with synthetic ropes

Extension of fatigue life for C4 solder ball to chip connection

Device for collecting statistical data for maintenance of small-arms

Packaging integrated circuits with adhesive posts

Extension of fatigue life for C4 solder ball to chip connection

Parallel-plate capacitive element for monitoring environmental para...

Apparatus for measuring the magnetic field produced by an insertion...

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Electronic package and method of forming

Partially captured oriented interconnections for BGA packages and a...

Land grid array stiffener for use with flexible chip carriers

Heat sink for convection cooling in horizontal applications

Packaging for multi-processor shared-memory system

Partially captured oriented interconnections for BGA packages and a...

Heat sink for convection cooling in horizontal applications

Package for electronic component

Coupled-cap flip chip BGA package with improved cap design for redu...

Method of forming an apparatus to reduce thermal fatigue stress on...

Liquid metal thermal interface for an electronic module

Apparatus to reduce thermal fatigue stress on flip chip solder conn...

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Patents Applicationslast 30 patents

HIGH RESISTIVITY SUBSTRATE FINAL RESISTANCE TEST STRUCTURE

SYSTEMS AND METHODS FOR DETERMINING ADJUSTABLE WAFER ACCEPTANCE CRI...

TEST EQUIPMENT FOR VERIFICATION OF CRYSTAL LINEARITY AT HIGH-FLUX L...

Extension of fatigue life for C4 solder ball to chip connection

DEVICE FOR COLLECTING STATISTICAL DATA FOR MAINTENANCE OF SMALL-ARMS

Device for collecting statistical data for maintenance of small-arms

Passive alignment of VCSELs to waveguides in opto-electronic cards...

Heat sink for convection cooling in horizontal applications

Partially captured oriented interconnections for BGA packages and a...

Packaging integrated circuits with adhesive posts

METHOD OF FORMING AN APPARATUS TO REDUCE THERMAL FATIGUE STRESS ON...

Packaging for multi-processor shared-memory system

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Land grid array stiffener for use with flexible chip carriers

Coupled-cap flip chip BGA package with improved cap design for redu...

Electronic package and method of forming

Heat sink for convection cooling in horizontal applications

Extension of fatigue life for C4 solder ball to chip connection

Land grid array stiffener use with flexible chip carriers

COMPLIANT MULTI-LAYERED CIRCUIT BOARD FOR PBGA APPLICATIONS

MOLDED BODY FOR PBGA AND CHIP-SCALE PACKAGES

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Apparatus to reduce thermal fatigue stress on flip chip solder conn...

Coupled-cap flip chip BGA package with improved cap design for redu...

Integral design features for heatsink attach for electronic packages

Method of forming BGA interconnections having mixed solder profiles