Membership
Tour
Register
Log in
Eric Tan Swee Seng
Follow
Person
Singapore, SG
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Assemblies and multi-chip modules including stacked semiconductor d...
Patent number
8,237,290
Issue date
Aug 7, 2012
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced footprint packaged microelectronic components and methods f...
Patent number
7,691,726
Issue date
Apr 6, 2010
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for assembling semiconductor devices and interposers
Patent number
7,528,007
Issue date
May 5, 2009
Micron Technology, Inc.
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assemblies and multi-chip modules including stacked semiconductor d...
Patent number
7,492,039
Issue date
Feb 17, 2009
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Invertible microfeature device packages
Patent number
7,368,810
Issue date
May 6, 2008
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component assemblies with recessed wire bonds and m...
Patent number
7,365,424
Issue date
Apr 29, 2008
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming a multi-chip module having discrete spacers
Patent number
7,276,790
Issue date
Oct 2, 2007
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers with receptacles for receiving semiconductor devices an...
Patent number
7,274,095
Issue date
Sep 25, 2007
Micron Technology, Inc.
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Invertible microfeature device packages
Patent number
7,259,451
Issue date
Aug 21, 2007
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced footprint packaged microelectronic components and methods f...
Patent number
7,218,001
Issue date
May 15, 2007
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic component assemblies
Patent number
6,951,982
Issue date
Oct 4, 2005
Micron Technology, Inc.
Lim Thiam Chye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods of forming same
Patent number
6,943,450
Issue date
Sep 13, 2005
Micron Technology, Inc.
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods of forming same
Patent number
6,876,066
Issue date
Apr 5, 2005
Micron Technology, Inc.
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHODS FOR FORMING ASSEMBLIES AND MULTI CHIP MODULES INCLUDING STA...
Publication number
20120295401
Publication date
Nov 22, 2012
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLIES AND MULTI CHIP MODULES INCLUDING STACKED SEMICONDUCTOR D...
Publication number
20090121338
Publication date
May 14, 2009
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT ASSEMBLIES WITH RECESSED WIRE BONDS AND M...
Publication number
20080164591
Publication date
Jul 10, 2008
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic component assemblies with recessed wire bonds and m...
Publication number
20060208366
Publication date
Sep 21, 2006
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball grid array interposer, packages and methods
Publication number
20040217459
Publication date
Nov 4, 2004
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS