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Etuo Egashira
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Yamanashi, JP
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last 30 patents
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Patent Grant
Wafer having chamfered bend portions in the joint regions between t...
Patent number
RE40139
Issue date
Mar 4, 2008
Renesas Technology Corp.
Hisashi Maejima
438 - Semiconductor device manufacturing: process
Information
Patent Grant
Method of producing a wafer having a curved notch
Patent number
5,279,992
Issue date
Jan 18, 1994
Hitachi, Ltd.
Hisashi Maejima
C30 - CRYSTAL GROWTH
Information
Patent Grant
Wafer having chamfered bend portions in the joint regions between t...
Patent number
5,230,747
Issue date
Jul 27, 1993
Hitachi, Ltd.
Hisashi Maejima
C30 - CRYSTAL GROWTH
Information
Patent Grant
Wafer and method of working the same
Patent number
4,783,225
Issue date
Nov 8, 1988
Hitachi, Ltd.
Hisashi Maejima
C30 - CRYSTAL GROWTH