Eugene Zhao

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for making reinforced wafer polishing pads and apparatuses...
- Patent number 6,949,020
- Issue date Sep 27, 2005
- Lam Research Corporation
- Cangshan Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for controlling CMP pad surface finish
- Patent number 6,939,207
- Issue date Sep 6, 2005
- Lam Research Corporation
- Alan J. Jensen
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing thickness control in magnetic head fa...
- Patent number 6,776,917
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Richard Hsiao
- B24 - GRINDING POLISHING
Information Patent Grant
Platen assembly having a topographically altered platen surface
- Patent number 6,712,679
- Issue date Mar 30, 2004
- Lam Research Corporation
- Travis R. Taylor
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for controlling CMP pad surface finish
- Patent number 6,645,052
- Issue date Nov 11, 2003
- Lam Research Corporation
- Alan J. Jensen
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for accurate endpoint detection in supported polishing pads
- Patent number 6,641,470
- Issue date Nov 4, 2003
- Lam Research Corporation
- Eugene Y. Zhao
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for making reinforced wafer polishing pads utilizing direct...
- Patent number 6,572,463
- Issue date Jun 3, 2003
- LAM Research Corp.
- Cangshan Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for making reinforced wafer polishing pads and apparatuses...
- Patent number 6,561,889
- Issue date May 13, 2003
- Lam Research Corporation
- Cangshan Xu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Application of heated slurry for CMP
- Publication number 20040266192
- Publication date Dec 30, 2004
- LAM RESEARCH CORPORATION
- Gregory C. Lee
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for controlling CMP pad surface finish
- Publication number 20040127144
- Publication date Jul 1, 2004
- Lam Research Corporation
- Alan J. Jensen
- B24 - GRINDING POLISHING
Information Patent Application
Methods for making reinforced wafer polishing pads and apparatuses...
- Publication number 20030194963
- Publication date Oct 16, 2003
- LAM RESEARCH CORPORATION
- Cangshan Xu
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for controlling CMP pad surface finish
- Publication number 20030082997
- Publication date May 1, 2003
- Alan J. Jensen
- B24 - GRINDING POLISHING
Information Patent Application
Platen assembly having a topographically altered platen surface
- Publication number 20030032379
- Publication date Feb 13, 2003
- Lam Research Corportion
- Travis R. Taylor
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing thickness control in magnetic head fa...
- Publication number 20020084243
- Publication date Jul 4, 2002
- Richard Hsiao
- B24 - GRINDING POLISHING

Eugene Zhao

Person

Patents Grantslast 30 patents

Methods for making reinforced wafer polishing pads and apparatuses...

Method and apparatus for controlling CMP pad surface finish

Chemical mechanical polishing thickness control in magnetic head fa...

Platen assembly having a topographically altered platen surface

Method and apparatus for controlling CMP pad surface finish

Apparatus for accurate endpoint detection in supported polishing pads

Methods for making reinforced wafer polishing pads utilizing direct...

Methods for making reinforced wafer polishing pads and apparatuses...

Patents Applicationslast 30 patents

Application of heated slurry for CMP

Method and apparatus for controlling CMP pad surface finish

Methods for making reinforced wafer polishing pads and apparatuses...

Method and apparatus for controlling CMP pad surface finish

Platen assembly having a topographically altered platen surface

Chemical mechanical polishing thickness control in magnetic head fa...