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Patents Grants
last 30 patents
Information
Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
Patent number
10,910,267
Issue date
Feb 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
Patent number
10,692,764
Issue date
Jun 23, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
Patent number
10,163,706
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon via structure
Patent number
9,997,497
Issue date
Jun 12, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for through silicon via structure
Patent number
9,633,900
Issue date
Apr 25, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment mark and method of formation
Patent number
9,478,480
Issue date
Oct 25, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon via structure
Patent number
9,299,676
Issue date
Mar 29, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconfigurable guide pin design for centering wafers having differe...
Patent number
9,099,515
Issue date
Aug 4, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Copper bump structures having sidewall protection layers
Patent number
9,093,314
Issue date
Jul 28, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double treatment on hard mask for gate N/P patterning
Patent number
8,980,706
Issue date
Mar 17, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Matt Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon via structure
Patent number
8,952,506
Issue date
Feb 10, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
Patent number
8,928,159
Issue date
Jan 6, 2015
Taiwan Semiconductor Manufacturing & Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper bump structures having sidewall protection layers
Patent number
8,922,004
Issue date
Dec 30, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a protective structure
Patent number
8,900,994
Issue date
Dec 2, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment mark and method of formation
Patent number
8,896,136
Issue date
Nov 25, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing substrate warpage in semiconductor processing
Patent number
8,691,706
Issue date
Apr 8, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Reconfigurable guide pin design for centering wafers having differe...
Patent number
8,567,837
Issue date
Oct 29, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Replacement gate FinFET devices and methods for forming the same
Patent number
8,513,107
Issue date
Aug 20, 2013
Taiwan Semiconductor Manufacturing Co., Ltd.
Bor-Wen Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for metal gate N/P patterning
Patent number
8,048,810
Issue date
Nov 1, 2011
Taiwan Semiconductor Manufacturing Company, Ltd.
Fang Wen Tsai
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Extreme low-K dielectric film scheme for advanced interconnects
Patent number
RE42514
Issue date
Jul 5, 2011
Taiwan Semiconductor Manufacturing Co., Ltd.
Fang-Wen Tsai
257 - Active solid-state devices
Information
Patent Grant
High selectivity etching process for metal gate N/P patterning
Patent number
7,732,344
Issue date
Jun 8, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Fang Wen Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Extreme low-k dielectric film scheme for advanced interconnect
Patent number
7,626,245
Issue date
Dec 1, 2009
Taiwan Semiconductor Manufacturing Co., Ltd.
Fang-Wen Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming dielectric film to improve adhesion of low-k film
Patent number
7,465,676
Issue date
Dec 16, 2008
Taiwan Semiconductor Manufacturing Company, Ltd.
Fang Wen Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solution for FSG induced metal corrosion & metal peeling defects wi...
Patent number
6,953,608
Issue date
Oct 11, 2005
Taiwan Semiconductor Manufacturing Co., Ltd.
Pong-Hsiung Leu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
Publication number
20190131172
Publication date
May 2, 2019
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Through Silicon via Structure
Publication number
20170221861
Publication date
Aug 3, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through Silicon Via Structure and Method
Publication number
20160181157
Publication date
Jun 23, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through Silicon Via Structure and Method
Publication number
20150137361
Publication date
May 21, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
Publication number
20150118840
Publication date
Apr 30, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper Bump Structures Having Sidewall Protection Layers
Publication number
20150111342
Publication date
Apr 23, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Alignment Mark and Method of Formation
Publication number
20150069580
Publication date
Mar 12, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through Silicon Via Structure and Method
Publication number
20140203439
Publication date
Jul 24, 2014
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reconfigurable Guide Pin Design for Centering Wafers Having Differe...
Publication number
20130334832
Publication date
Dec 19, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
Reducing Substrate Warpage in Semiconductor Processing
Publication number
20130183831
Publication date
Jul 18, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Through Silicon Via Structure and Method
Publication number
20120313247
Publication date
Dec 13, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reconfigurable Guide Pin Design for Centering Wafers Having Differe...
Publication number
20120128457
Publication date
May 24, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
Publication number
20120056315
Publication date
Mar 8, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Alignment Mark and Method of Formation
Publication number
20120001337
Publication date
Jan 5, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper Bump Structures Having Sidewall Protection Layers
Publication number
20110304042
Publication date
Dec 15, 2011
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR METAL GATE N/P PATTERNING
Publication number
20110189847
Publication date
Aug 4, 2011
Taiwan Semiconductor Manufacturing Company, Ltd.
Fang Wen Tsai
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
REPLACEMENT GATE FinFET DEVICES AND METHODS FOR FORMING THE SAME
Publication number
20110183508
Publication date
Jul 28, 2011
Taiwan Semiconductor Manufacturing Co., LTD
Bor-Wen Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE TREATMENT ON HARD MASK FOR GATE N/P PATTERNING
Publication number
20100068875
Publication date
Mar 18, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Matt Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTREME LOW-K DIELECTRIC FILM SCHEME FOR ADVANCED INTERCONNECTS
Publication number
20090166817
Publication date
Jul 2, 2009
Taiwan Semiconductor Manufacturing Co., LTD
Fang-Wen Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Peeling-free porous capping material
Publication number
20080188074
Publication date
Aug 7, 2008
I-I Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Initiation layer for reducing stress transition due to curing
Publication number
20080116578
Publication date
May 22, 2008
Kuan-Chen Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming dielectric film to improve adhesion of low-k film
Publication number
20070249159
Publication date
Oct 25, 2007
Taiwan Semiconductor Manufacturing Company, Ltd.
Fang Wen Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solution for FSG induced metal corrosion & metal peeling defects wi...
Publication number
20040213921
Publication date
Oct 28, 2004
Taiwan Semiconductor Manufacturing Co.
Pong-Hsiung Leu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...