Fee Li Lie

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer dielectric stack for damascene top-via integration
- Patent number 12,334,398
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical unclonable function
- Patent number 12,327,798
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Kangguo Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 12,327,730
- Issue date Jun 10, 2025
- Adeia Semiconductor Solutions LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet channel-to-source and drain isolation
- Patent number 12,166,110
- Issue date Dec 10, 2024
- Adeia Semiconductor Solutions LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process to tuck fin tips self-aligned to gates
- Patent number RE50174
- Issue date Oct 15, 2024
- TESSERA LLC
- Bruce B. Doris
Information Patent Grant
Vertical transistor and method of forming the vertical transistor
- Patent number 12,046,673
- Issue date Jul 23, 2024
- International Business Machines Corporation
- Fee Li Lie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,978,639
- Issue date May 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure identification of wafer and chip
- Patent number 11,947,712
- Issue date Apr 2, 2024
- International Business Machines Corporation
- Richard C. Johnson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming the semiconductor device
- Patent number 11,869,937
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Marc Adam Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the semiconductor device
- Patent number 11,869,936
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Marc Adam Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,699,591
- Issue date Jul 11, 2023
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevator analytics facilitating passenger destination prediction an...
- Patent number 11,673,766
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Gauri Karve
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Nanosheet channel-to-source and drain isolation
- Patent number 11,652,161
- Issue date May 16, 2023
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate isolated VTFET devices
- Patent number 11,615,992
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non volatile resistive memory logic device
- Patent number 11,600,325
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked vertical transport field effect transistors with anchors
- Patent number 11,569,229
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer for metal gates
- Patent number 11,557,589
- Issue date Jan 17, 2023
- Tessera, LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor and method of forming the vertical transistor
- Patent number 11,520,768
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Fee Li Lie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Patterning magnetic tunnel junctions and the like while reducing de...
- Patent number 11,476,415
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sublithography gate cut physical unclonable function
- Patent number 11,462,631
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Three-dimensional microelectronic package with embedded cooling cha...
- Patent number 11,462,512
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact source/drain resistance
- Patent number 11,322,588
- Issue date May 3, 2022
- International Business Machines Corporation
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the semiconductor device
- Patent number 11,239,316
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Marc Adam Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual width finned semiconductor structure
- Patent number 11,189,532
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the semiconductor device
- Patent number 11,127,815
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Marc Adam Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-fluidic channels having various critical dimensions
- Patent number 11,081,424
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Secure wafer inspection and identification
- Patent number 11,079,337
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Fee Li Lie
- G01 - MEASURING TESTING
Information Patent Grant
Transistor gate having tapered segments positioned above the fin ch...
- Patent number 11,075,299
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,062,911
- Issue date Jul 13, 2021
- Tessera, Inc.
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION
- Publication number 20250142856
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE ASSEMBLY
- Publication number 20240332194
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240258113
- Publication date Aug 1, 2024
- Adeia Semiconductor Solutions LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS
- Publication number 20240203816
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER
- Publication number 20240203904
- Publication date Jun 20, 2024
- International Business Machines Corporation
- FEE LI LIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES
- Publication number 20240203780
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES
- Publication number 20240194670
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED POWER RAIL DIRECTLY CONTACTING BACKSIDE POWER DELIVERY NETWORK
- Publication number 20240105607
- Publication date Mar 28, 2024
- International Business Machines Corporation
- SOMNATH GHOSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION
- Publication number 20240088268
- Publication date Mar 14, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240079247
- Publication date Mar 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER FOR METAL GATES
- Publication number 20230352480
- Publication date Nov 2, 2023
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TSV LANDING OVER BURIED POWER RAIL
- Publication number 20230253322
- Publication date Aug 10, 2023
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT INTERCONNECT STRUCTURE
- Publication number 20230207330
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS
- Publication number 20230163039
- Publication date May 25, 2023
- International Business Machines Corporation
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESSED MATERIAL WITHIN GATE CUT REGION
- Publication number 20230139399
- Publication date May 4, 2023
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR WITH ANCHORS
- Publication number 20230122234
- Publication date Apr 20, 2023
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE IDENTIFICATION OF WAFER AND CHIP
- Publication number 20230094707
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Richard C. Johnson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER DIELECTRIC STACK FOR DAMASCENE TOP-VIA INTEGRATION
- Publication number 20230055600
- Publication date Feb 23, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTOR AND METHOD OF FORMING THE VERTICAL TRANSISTOR
- Publication number 20230042711
- Publication date Feb 9, 2023
- International Business Machines Corporation
- Fee Li LIE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PATTERNING MAGNETIC TUNNEL JUNCTIONS AND THE LIKE WHILE REDUCING DE...
- Publication number 20230006131
- Publication date Jan 5, 2023
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON VOLATILE RESISTIVE MEMORY LOGIC DEVICE
- Publication number 20220172776
- Publication date Jun 2, 2022
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE
- Publication number 20220140074
- Publication date May 5, 2022
- International Business Machines Corporation
- Marc Adam Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE
- Publication number 20210376078
- Publication date Dec 2, 2021
- International Business Machines Corporation
- Marc Adam Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20210343536
- Publication date Nov 4, 2021
- Tessera, Inc.
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multilayer dielectric stack for damascene top-via integration

Physical unclonable function

Two-color self-aligned double patterning (SADP) to yield static ran...

Nanosheet channel-to-source and drain isolation

High aspect ratio buried power rail metallization

Structure and process to tuck fin tips self-aligned to gates

Vertical transistor and method of forming the vertical transistor

Two-color self-aligned double patterning (SADP) to yield static ran...

Secure identification of wafer and chip

Semiconductor device and method of forming the semiconductor device

Semiconductor device and method of forming the semiconductor device

Two-color self-aligned double patterning (SADP) to yield static ran...

Elevator analytics facilitating passenger destination prediction an...

Nanosheet channel-to-source and drain isolation

Substrate isolated VTFET devices

Non volatile resistive memory logic device

Stacked vertical transport field effect transistors with anchors

Air gap spacer for metal gates

Vertical transistor and method of forming the vertical transistor

Patterning magnetic tunnel junctions and the like while reducing de...

Sublithography gate cut physical unclonable function

Three-dimensional microelectronic package with embedded cooling cha...

Contact source/drain resistance

Semiconductor device and method of forming the semiconductor device

Dual width finned semiconductor structure

Semiconductor device and method of forming the semiconductor device

Micro-fluidic channels having various critical dimensions

Secure wafer inspection and identification

Transistor gate having tapered segments positioned above the fin ch...

Two-color self-aligned double patterning (SADP) to yield static ran...

Patents Applicationslast 30 patents

NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

CHIP MODULE ASSEMBLY

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS

STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER

DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES

ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES

BURIED POWER RAIL DIRECTLY CONTACTING BACKSIDE POWER DELIVERY NETWORK

NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION

AIR GAP SPACER FOR METAL GATES

NANO-TSV LANDING OVER BURIED POWER RAIL

CIRCUIT INTERCONNECT STRUCTURE

DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS

STRESSED MATERIAL WITHIN GATE CUT REGION

STACKED VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR WITH ANCHORS

SECURE IDENTIFICATION OF WAFER AND CHIP

MULTILAYER DIELECTRIC STACK FOR DAMASCENE TOP-VIA INTEGRATION

VERTICAL TRANSISTOR AND METHOD OF FORMING THE VERTICAL TRANSISTOR

PATTERNING MAGNETIC TUNNEL JUNCTIONS AND THE LIKE WHILE REDUCING DE...

NON VOLATILE RESISTIVE MEMORY LOGIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...