Feng Chen

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selective deposition
- Patent number 12,157,943
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse selective etch stop layer
- Patent number 11,955,382
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for precleaning and treating wafer surfaces
- Patent number 11,939,666
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning process modelling
- Patent number 11,875,101
- Issue date Jan 16, 2024
- ASML Netherlands B.V.
- Jen-Shiang Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing substrate surface scratching using machine learning
- Patent number 11,835,927
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Kartik B Shah
- G05 - CONTROLLING REGULATING
Information Patent Grant
Ruthenium liner and cap for back-end-of-line
- Patent number 11,784,127
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line applications
- Patent number 11,764,157
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing substrate surface scratching using machine learning
- Patent number 11,586,160
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Kartik B Shah
- G05 - CONTROLLING REGULATING
Information Patent Grant
Binary metal liner layers
- Patent number 11,587,873
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Gang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining an etch profile of a layer of a wafer for a...
- Patent number 11,568,123
- Issue date Jan 31, 2023
- ASML Netherlands B.V.
- Chi-Hsiang Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for intermixing layer for enhanced metal reflow
- Patent number 11,527,437
- Issue date Dec 13, 2022
- Applied Materials, Inc.
- Lanlan Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Water assisted highly pure ruthenium thin film deposition
- Patent number 11,293,093
- Issue date Apr 5, 2022
- Applied Materials Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping of metal barrier layers
- Patent number 11,270,911
- Issue date Mar 8, 2022
- Applied Materials Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming cobalt and ruthenium capping layers for interco...
- Patent number 11,171,046
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach for selective metal via fill
- Patent number 11,164,780
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature tungsten film deposition for small critical dimensi...
- Patent number 9,673,146
- Issue date Jun 6, 2017
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low tempature tungsten film deposition for small critical dimension...
- Patent number 9,236,297
- Issue date Jan 12, 2016
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming tensile tungsten films and compressive tungsten...
- Patent number 9,034,760
- Issue date May 19, 2015
- Novellus Systems, Inc.
- Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of improving tungsten contact resistance in small critical...
- Patent number 8,975,184
- Issue date Mar 10, 2015
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing tungsten film with low roughness and low resi...
- Patent number 8,853,080
- Issue date Oct 7, 2014
- Novellus Systems, Inc.
- Yan Guan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing ultra thin low resistivity tungsten film for...
- Patent number 8,623,733
- Issue date Jan 7, 2014
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing tungsten roughness and improving reflectivity
- Patent number 8,551,885
- Issue date Oct 8, 2013
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing thin tungsten film with low resistivity and r...
- Patent number 8,409,987
- Issue date Apr 2, 2013
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving uniformity and adhesion of low resistivity tun...
- Patent number 8,329,576
- Issue date Dec 11, 2012
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing thin tungsten film with low resistivity and r...
- Patent number 8,058,170
- Issue date Nov 15, 2011
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving uniformity and adhesion of low resistivity tun...
- Patent number 7,772,114
- Issue date Aug 10, 2010
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Low Resistance and High Reliability Metallization Module
- Publication number 20250029874
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING AN ETCH EFFECT BASED ON AN ETCH BIAS DIRECTION
- Publication number 20250021015
- Publication date Jan 16, 2025
- ASML NETHERLANDS B.V.
- Jin CHENG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20250022750
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Shinjae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Publication number 20240420997
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240339358
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Jesus Candelario Mendoza-Gutierrez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRA-THIN LAYERS BY SELECTIVE PASSIVATION
- Publication number 20240321633
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE
- Publication number 20240290655
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Zheng JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA TREATMENT OF BARRIER AND LINER LAYERS
- Publication number 20240258103
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES
- Publication number 20240183028
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Xiangjin XIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method to Deposit Metal Cap for Interconnect
- Publication number 20240186181
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FORM METAL LINERS FOR INTERCONNECTS
- Publication number 20240153816
- Publication date May 9, 2024
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
- Publication number 20240071927
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shinjae Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE BARRIER LAYERS
- Publication number 20240006235
- Publication date Jan 4, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20230253248
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING AN ETCH PROFILE OF A LAYER OF A WAFER FOR A...
- Publication number 20230144584
- Publication date May 11, 2023
- ASML NETHERLANDS B.V.
- Chi-Hsiang Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING
- Publication number 20230121513
- Publication date Apr 20, 2023
- Applied Materials, Inc.
- Kartik B. Shah
- G05 - CONTROLLING REGULATING
Information Patent Application
Method Of Forming A Metal Liner For Interconnect Structures
- Publication number 20230072614
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING
- Publication number 20220413452
- Publication date Dec 29, 2022
- Applied Materials, Inc.
- Kartik B. Shah
- G05 - CONTROLLING REGULATING
Information Patent Application
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
- Publication number 20220344275
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING PROCESS BASED CONTOUR INFORMATION OF STRUCTUR...
- Publication number 20220299881
- Publication date Sep 22, 2022
- ASML NETHERLANDS B.V.
- Yunan ZHENG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PATTERNING PROCESS MODELLING
- Publication number 20220260921
- Publication date Aug 18, 2022
- ASML NETHERLANDS B.V.
- Jen-Shiang WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REVERSE SELECTIVE ETCH STOP LAYER
- Publication number 20220181204
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING PATTERN IN A PATTERNING PROCESS
- Publication number 20220179321
- Publication date Jun 9, 2022
- ASML NETHERLANDS B.V.
- Ziyang MA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED...
- Publication number 20220122923
- Publication date Apr 21, 2022
- Applied Materials, Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE AND HIGH RELIABILITY METALLIZATION MODULE
- Publication number 20220108917
- Publication date Apr 7, 2022
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTERMIXING LAYER FOR ENHANCED METAL REFLOW
- Publication number 20220084882
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Lanlan ZHONG
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF SELECTIVE DEPOSITION
- Publication number 20220064784
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FORMING STABILIZATION LAYERS
- Publication number 20220037204
- Publication date Feb 3, 2022
- Applied Materials, Inc.
- Wenjing XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
- Publication number 20220028795
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of forming a metal liner for interconnect structures

Methods of selective deposition

Low resistance and high reliability metallization module

Reverse selective etch stop layer

Methods and apparatus for precleaning and treating wafer surfaces

Method for patterning process modelling

Reducing substrate surface scratching using machine learning

Ruthenium liner and cap for back-end-of-line

Ruthenium liner and cap for back-end-of-line applications

Reducing substrate surface scratching using machine learning

Binary metal liner layers

Method for determining an etch profile of a layer of a wafer for a...

Methods and apparatus for intermixing layer for enhanced metal reflow

Water assisted highly pure ruthenium thin film deposition

Doping of metal barrier layers

Methods for forming cobalt and ruthenium capping layers for interco...

Process integration approach for selective metal via fill

Low temperature tungsten film deposition for small critical dimensi...

Low tempature tungsten film deposition for small critical dimension...

Methods of forming tensile tungsten films and compressive tungsten...

Methods of improving tungsten contact resistance in small critical...

Method for depositing tungsten film with low roughness and low resi...

Methods for depositing ultra thin low resistivity tungsten film for...

Method for reducing tungsten roughness and improving reflectivity

Method for depositing thin tungsten film with low resistivity and r...

Method for improving uniformity and adhesion of low resistivity tun...

Method for depositing thin tungsten film with low resistivity and r...

Method for improving uniformity and adhesion of low resistivity tun...

Patents Applicationslast 30 patents

Low Resistance and High Reliability Metallization Module

DETERMINING AN ETCH EFFECT BASED ON AN ETCH BIAS DIRECTION

METHODS OF FORMING INTERCONNECT STRUCTURES

COPPER REFLOW BY SURFACE MODIFICATION

SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION

METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES

ULTRA-THIN LAYERS BY SELECTIVE PASSIVATION

SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE

PLASMA TREATMENT OF BARRIER AND LINER LAYERS

METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES

Method to Deposit Metal Cap for Interconnect

METHODS TO FORM METAL LINERS FOR INTERCONNECTS

TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS

COMPOSITE BARRIER LAYERS

METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES

METHOD FOR DETERMINING AN ETCH PROFILE OF A LAYER OF A WAFER FOR A...

REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING

Method Of Forming A Metal Liner For Interconnect Structures

REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING

RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS

METHODS FOR IMPROVING PROCESS BASED CONTOUR INFORMATION OF STRUCTUR...

METHOD FOR PATTERNING PROCESS MODELLING

REVERSE SELECTIVE ETCH STOP LAYER

METHOD FOR DETERMINING PATTERN IN A PATTERNING PROCESS

METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED...

LOW RESISTANCE AND HIGH RELIABILITY METALLIZATION MODULE

METHODS AND APPARATUS FOR INTERMIXING LAYER FOR ENHANCED METAL REFLOW

METHODS OF SELECTIVE DEPOSITION

METHODS AND APPARATUS FOR FORMING STABILIZATION LAYERS

RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS