Fernando A. Santos

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-mount amplifier devices
- Patent number 12,184,237
- Issue date Dec 31, 2024
- NXP USA, INC.
- Lu Ll
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless power amplifier packages including topside termination int...
- Patent number 11,984,429
- Issue date May 14, 2024
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating leadless power amplifier packages including...
- Patent number 11,621,231
- Issue date Apr 4, 2023
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit modules with front-side interposer terminals and through-mo...
- Patent number 11,581,241
- Issue date Feb 14, 2023
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with top terminations
- Patent number 11,343,919
- Issue date May 24, 2022
- NXP USA, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless power amplifier packages including topside terminations an...
- Patent number 11,342,275
- Issue date May 24, 2022
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer dicing for wafers with backside metallization and p...
- Patent number 10,741,446
- Issue date Aug 11, 2020
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,630,243
- Issue date Apr 21, 2020
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,529,638
- Issue date Jan 7, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,476,442
- Issue date Nov 12, 2019
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,396,006
- Issue date Aug 27, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing packaged electronic devices with top termi...
- Patent number 10,375,833
- Issue date Aug 6, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,303
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,302
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,110,170
- Issue date Oct 23, 2018
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with top terminations, and methods of m...
- Patent number 9,986,646
- Issue date May 29, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,800,208
- Issue date Oct 24, 2017
- NXP USA, INC.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method and apparatus for multi-chip structure semiconductor package
- Patent number 9,466,588
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 9,450,547
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaged RF amplifier devices and methods of manufacture thereof
- Patent number 9,337,774
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,300,254
- Issue date Mar 29, 2016
- Freescale Semiconductor Inc.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
System, method and apparatus for leadless surface mounted semicondu...
- Patent number 9,263,375
- Issue date Feb 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bond foot jumper connections
- Patent number 9,236,363
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged leadless semiconductor device
- Patent number 9,159,588
- Issue date Oct 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multi-chip structure semiconductor package
- Patent number 8,963,305
- Issue date Feb 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-defining, low capacitance wire bond pad
- Patent number 8,890,339
- Issue date Nov 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and apparatus for leadless surface mounted semicondu...
- Patent number 8,803,302
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged leadless semiconductor device
- Patent number 8,698,291
- Issue date Apr 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...
- Publication number 20240203912
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Jeffrey Spencer Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...
- Publication number 20230197645
- Publication date Jun 22, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...
- Publication number 20230115340
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING...
- Publication number 20220238450
- Publication date Jul 28, 2022
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...
- Publication number 20220208646
- Publication date Jun 30, 2022
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS AN...
- Publication number 20220130768
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
- Publication number 20200335398
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR, PACKAGED DEVICE, AND METHOD OF FABRICATION
- Publication number 20200098684
- Publication date Mar 26, 2020
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20200067460
- Publication date Feb 27, 2020
- NXP USA, Inc.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMI...
- Publication number 20190343005
- Publication date Nov 7, 2019
- NXP USA, Inc.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190109060
- Publication date Apr 11, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190051571
- Publication date Feb 14, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043774
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043775
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20190028063
- Publication date Jan 24, 2019
- NXP USA, Inc.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...
- Publication number 20190013242
- Publication date Jan 10, 2019
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...
- Publication number 20180270960
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Lakshminarayan VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20170005621
- Publication date Jan 5, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...
- Publication number 20160163623
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20160164471
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...
- Publication number 20160150632
- Publication date May 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20160087586
- Publication date Mar 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MARGARET A. SZYMANOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20150381117
- Publication date Dec 31, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Wedge Bond Foot Jumper Connections
- Publication number 20150262961
- Publication date Sep 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED LEADLESS SEMICONDUCTOR DEVICE
- Publication number 20150249021
- Publication date Sep 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
- Publication number 20150171057
- Publication date Jun 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20150170986
- Publication date Jun 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...
- Publication number 20140332941
- Publication date Nov 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DEFINING, LOW CAPACITANCE WIRE BOND PAD
- Publication number 20140319703
- Publication date Oct 30, 2014
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
- Publication number 20140084432
- Publication date Mar 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS

Fernando A. Santos

Person

Patents Grantslast 30 patents

Surface-mount amplifier devices

Radio frequency packages containing multilevel power substrates and...

Leadless power amplifier packages including topside termination int...

Methods of fabricating leadless power amplifier packages including...

Circuit modules with front-side interposer terminals and through-mo...

Packaged dies with metal outer layers extending from die back sides...

Packaged electronic devices with top terminations

Leadless power amplifier packages including topside terminations an...

Method of wafer dicing for wafers with backside metallization and p...

Semiconductor package having an isolation wall to reduce electromag...

Molded air cavity packages and methods for the production thereof

Semiconductor package having an isolation wall to reduce electromag...

Molded air cavity packages and methods for the production thereof

Methods of manufacturing packaged electronic devices with top termi...

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Semiconductor package having an isolation wall to reduce electromag...

Packaged electronic devices with top terminations, and methods of m...

Radio frequency devices with surface-mountable capacitors for decou...

Method and apparatus for multi-chip structure semiconductor package

Semiconductor package having an isolation wall to reduce electromag...

Packaged RF amplifier devices and methods of manufacture thereof

Radio frequency devices with surface-mountable capacitors for decou...

System, method and apparatus for leadless surface mounted semicondu...

Wedge bond foot jumper connections

Packaged leadless semiconductor device

Method and apparatus for multi-chip structure semiconductor package

Self-defining, low capacitance wire bond pad

System, method and apparatus for leadless surface mounted semicondu...

Packaged leadless semiconductor device

Patents Applicationslast 30 patents

AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...

RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...

METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING...

CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS AN...

PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...

TRANSISTOR, PACKAGED DEVICE, AND METHOD OF FABRICATION

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMI...

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...

PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...

PACKAGED RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURE THEREOF

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

Wedge Bond Foot Jumper Connections

PACKAGED LEADLESS SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...

SELF-DEFINING, LOW CAPACITANCE WIRE BOND PAD

METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE