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Fifin Sweeney
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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated voltage regulator with embedded passive device(s) for a...
Patent number
9,349,692
Issue date
May 24, 2016
QUALCOMM Incorporated
Yuan-cheng Christopher Pan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated voltage regulator with embedded passive device(s) for a...
Patent number
9,048,112
Issue date
Jun 2, 2015
QUALCOMM Incorporated
Yuancheng Christopher Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectromechanical systems embedded in a substrate
Patent number
8,847,375
Issue date
Sep 30, 2014
QUALCOMM Incorporated
Milind P. Shah
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Thermal vias in an integrated circuit package with an embedded die
Patent number
8,633,597
Issue date
Jan 21, 2014
QUALCOMM Incorporated
Fifin Sweeney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board having embedded dies and method of forming same
Patent number
8,476,750
Issue date
Jul 2, 2013
QUALCOMM Incorporated
Fifin Sweeney
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED VOLTAGE REGULATOR WITH EMBEDDED PASSIVE DEVICE(S) FOR A...
Publication number
20150235952
Publication date
Aug 20, 2015
QUALCOMM Incorporated
Yuancheng Christopher Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD HAVING EMBEDDED DIES AND METHOD OF FORMING SAME
Publication number
20130270718
Publication date
Oct 17, 2013
Fifin Sweeney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Voltage Regulator with Embedded Passive Device(s) for a...
Publication number
20110317387
Publication date
Dec 29, 2011
QUALCOMM Incorporated
Yuancheng Christopher Pan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Thermal Vias In An Integrated Circuit Package With An Embedded Die
Publication number
20110210438
Publication date
Sep 1, 2011
QUALCOMM Incorporated
Fifin Sweeney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectromechanical Systems Embedded in a Substrate
Publication number
20110180926
Publication date
Jul 28, 2011
QUALCOMM Incorporated
Milind P. Shah
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Printed Circuit Board having Embedded Dies and Method of Forming Same
Publication number
20110140257
Publication date
Jun 16, 2011
QUALCOMM Incorporated
Fifin Sweeney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Density MIM Capacitor Embedded in a Substrate
Publication number
20100327433
Publication date
Dec 30, 2010
QUALCOMM Incorporated
Fifin Sweeney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Embedded Through Silicon Stack 3-D Die In A Package Substrate
Publication number
20100155931
Publication date
Jun 24, 2010
QUALCOMM Incorporated
Urmi Ray
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Capacitor Die Design for Small Form Factors
Publication number
20100123215
Publication date
May 20, 2010
QUALCOMM Incorporated
Yuancheng Christopher Pan
H01 - BASIC ELECTRIC ELEMENTS