Frank Edward Anderson

Person

Sadieville, KY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laminate constructs for micro-fluid ejection devices
- Patent number 9,707,758
- Issue date Jul 18, 2017
- Funai Electric Co., Ltd.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Laminate constructs for micro-fluid ejection devices
- Patent number 9,144,969
- Issue date Sep 29, 2015
- Funai Electric Co., Ltd.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Skewed nozzle arrays on ejection chips for micro-fluid applications
- Patent number 8,777,376
- Issue date Jul 15, 2014
- Funai Electric Co., Ltd.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate, includin...
- Patent number 8,727,500
- Issue date May 20, 2014
- Funai Electric Co., Ltd.
- Frank Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid ejection device and method for fabricating fluid ejection device
- Patent number 8,657,411
- Issue date Feb 25, 2014
- Funai Electric Co., Ltd.
- Frank Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection devices with a polymeric layer having an embed...
- Patent number 8,642,249
- Issue date Feb 4, 2014
- Funai Electric Co., Ltd.
- Frank E Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printheads and method for assembling printheads
- Patent number 8,636,340
- Issue date Jan 28, 2014
- Funai Electric Co., Ltd.
- Michael J. Dixon
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Laminate constructs for micro-fluid ejection devices
- Patent number 8,622,524
- Issue date Jan 7, 2014
- Funai Electric Co., Ltd.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection head
- Patent number 8,500,242
- Issue date Aug 6, 2013
- Funai Electric Co., Ltd.
- Frank Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate, includin...
- Patent number 8,459,779
- Issue date Jun 11, 2013
- Lexmark International, Inc.
- Burton Joyner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Systems for priming fluid jetting devices
- Patent number 8,414,114
- Issue date Apr 9, 2013
- Lexmark International, Inc.
- Jiandong Fang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Chevron ejection chips for micro-fluid applications
- Patent number 8,393,712
- Issue date Mar 12, 2013
- Lexmark International, Inc.
- Jiandong Fang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Low ejection energy micro-fluid ejection heads
- Patent number 8,366,952
- Issue date Feb 5, 2013
- Lexmark International, Inc.
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Tiled manifold for a page wide printhead
- Patent number 8,313,167
- Issue date Nov 20, 2012
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
High volume ink delivery manifold for a page wide printhead
- Patent number 8,210,660
- Issue date Jul 3, 2012
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate
- Patent number 8,087,756
- Issue date Jan 3, 2012
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection heads with chips in pockets
- Patent number 8,061,811
- Issue date Nov 22, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection heads with chips in pockets
- Patent number 8,029,100
- Issue date Oct 4, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection devices having reduced input/output addressabl...
- Patent number 7,959,261
- Issue date Jun 14, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Low profile printhead
- Patent number 7,938,508
- Issue date May 10, 2011
- Lexmark International, Inc.
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate and metho...
- Patent number 7,938,513
- Issue date May 10, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Composite ceramic substrate for micro-fluid ejection head
- Patent number 7,937,835
- Issue date May 10, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet printing of layers
- Patent number 7,842,347
- Issue date Nov 30, 2010
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink jetting structure having protected connections
- Patent number 7,784,909
- Issue date Aug 31, 2010
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Low ejection energy micro-fluid ejection heads
- Patent number 7,749,397
- Issue date Jul 6, 2010
- Lexmark International, Inc.
- Frank E. Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Composite ceramic substrate for micro-fluid ejection head
- Patent number 7,681,991
- Issue date Mar 23, 2010
- Lexmark International, Inc.
- Frank Edward Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroluminescent displays, media, and members, and methods associ...
- Patent number 7,629,742
- Issue date Dec 8, 2009
- Lexmark International, Inc.
- Frank Edward Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of multi-layer circuits
- Patent number 7,624,500
- Issue date Dec 1, 2009
- Lexmark International, Inc.
- Xiaorong Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for selecting ink ejection nozzles in multi-ch...
- Patent number 7,452,044
- Issue date Nov 18, 2008
- Lexmark International, Inc.
- Frank Edward Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Customizable electroluminescent displays
- Patent number 7,425,795
- Issue date Sep 16, 2008
- Lexmark International, Inc.
- Frank Edward Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Large Area Printing
- Publication number 20160239727
- Publication date Aug 18, 2016
- Tungsten IP
- Ronald Trissel
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES
- Publication number 20160016406
- Publication date Jan 21, 2016
- Funai Electric Co., Ltd.
- Frank Edward ANDERSON
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES
- Publication number 20140092171
- Publication date Apr 3, 2014
- Funai Electric Co., Ltd.
- Frank Edward ANDERSON
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE, INCLUDIN...
- Publication number 20130250004
- Publication date Sep 26, 2013
- Funai Electric Co., Ltd.
- Burton JOYNER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FLUID EJECTION DEVICE AND METHOD FOR FABRICATING FLUID EJECTION DEVICE
- Publication number 20120320130
- Publication date Dec 20, 2012
- FRANK E. ANDERSON
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS
- Publication number 20120236076
- Publication date Sep 20, 2012
- Michael J. Dixon
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Head
- Publication number 20120154486
- Publication date Jun 21, 2012
- Frank Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Heater Chips with Silicon Die Bonded on Silicon Substrate, Includin...
- Publication number 20120133710
- Publication date May 31, 2012
- Burton Joyner, II
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SYSTEMS FOR PRIMING FLUID JETTING DEVICES
- Publication number 20120127241
- Publication date May 24, 2012
- JIANDONG FANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
TRAPEZOID EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS
- Publication number 20120050408
- Publication date Mar 1, 2012
- Jiandong FANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SKEWED NOZZLE ARRAYS ON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS
- Publication number 20110292122
- Publication date Dec 1, 2011
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CHEVRON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS
- Publication number 20110292123
- Publication date Dec 1, 2011
- Jiandong Fang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES
- Publication number 20110292124
- Publication date Dec 1, 2011
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE
- Publication number 20110205305
- Publication date Aug 25, 2011
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
High Volume Ink Delivery Manifold for a Page Wide Printhead
- Publication number 20110122194
- Publication date May 26, 2011
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
TILED MANIFOLD FOR A PAGE WIDE PRINTHEAD
- Publication number 20110074879
- Publication date Mar 31, 2011
- Frank Edwards Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBED...
- Publication number 20100285411
- Publication date Nov 11, 2010
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LOW EJECTION ENERGY MICRO-FLUID EJECTION HEADS
- Publication number 20100213165
- Publication date Aug 26, 2010
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Heads with Chips in Pockets
- Publication number 20100199497
- Publication date Aug 12, 2010
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Composite Ceramic Substrate for Micro-Fluid Ejection Head
- Publication number 20100132874
- Publication date Jun 3, 2010
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHO...
- Publication number 20090256891
- Publication date Oct 15, 2009
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS
- Publication number 20090189954
- Publication date Jul 30, 2009
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Low Profile Printhead
- Publication number 20090153616
- Publication date Jun 18, 2009
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTING INCENTIVE AND OTHER INCENTIVE METHODS AND SYSTEMS
- Publication number 20080319845
- Publication date Dec 25, 2008
- Lexmark International, Inc.
- Christopher Alan Adkins
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Composite Ceramic Substrate For Micro-Fluid Ejection Head
- Publication number 20080299361
- Publication date Dec 4, 2008
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Devices Having Reduced Input/Output Addressabl...
- Publication number 20080278542
- Publication date Nov 13, 2008
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20080268584
- Publication date Oct 30, 2008
- Lexmark International Inc.
- Frank E. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING OF MULTI-LAYER CIRCUITS
- Publication number 20080084449
- Publication date Apr 10, 2008
- Lexmark International, Inc.
- Xiaorong Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-Fluid Ejection Heads with Chips in Pockets
- Publication number 20080079776
- Publication date Apr 3, 2008
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embed...
- Publication number 20070296767
- Publication date Dec 27, 2007
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Frank Edward Anderson

Person

Patents Grantslast 30 patents

Laminate constructs for micro-fluid ejection devices

Laminate constructs for micro-fluid ejection devices

Skewed nozzle arrays on ejection chips for micro-fluid applications

Heater chips with silicon die bonded on silicon substrate, includin...

Fluid ejection device and method for fabricating fluid ejection device

Micro-fluid ejection devices with a polymeric layer having an embed...

Printheads and method for assembling printheads

Laminate constructs for micro-fluid ejection devices

Micro-fluid ejection head

Heater chips with silicon die bonded on silicon substrate, includin...

Systems for priming fluid jetting devices

Chevron ejection chips for micro-fluid applications

Low ejection energy micro-fluid ejection heads

Tiled manifold for a page wide printhead

High volume ink delivery manifold for a page wide printhead

Heater chips with silicon die bonded on silicon substrate

Micro-fluid ejection heads with chips in pockets

Micro-fluid ejection heads with chips in pockets

Micro-fluid ejection devices having reduced input/output addressabl...

Low profile printhead

Heater chips with silicon die bonded on silicon substrate and metho...

Composite ceramic substrate for micro-fluid ejection head

Inkjet printing of layers

Ink jetting structure having protected connections

Low ejection energy micro-fluid ejection heads

Composite ceramic substrate for micro-fluid ejection head

Electroluminescent displays, media, and members, and methods associ...

Printing of multi-layer circuits

Method and apparatus for selecting ink ejection nozzles in multi-ch...

Customizable electroluminescent displays

Patents Applicationslast 30 patents

Apparatus and Method for Large Area Printing

LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES

LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE, INCLUDIN...

FLUID EJECTION DEVICE AND METHOD FOR FABRICATING FLUID EJECTION DEVICE

PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS

Micro-Fluid Ejection Head

Heater Chips with Silicon Die Bonded on Silicon Substrate, Includin...

SYSTEMS FOR PRIMING FLUID JETTING DEVICES

TRAPEZOID EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS

SKEWED NOZZLE ARRAYS ON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS

CHEVRON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS

LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE

High Volume Ink Delivery Manifold for a Page Wide Printhead

TILED MANIFOLD FOR A PAGE WIDE PRINTHEAD

MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBED...

LOW EJECTION ENERGY MICRO-FLUID EJECTION HEADS

Micro-Fluid Ejection Heads with Chips in Pockets

Composite Ceramic Substrate for Micro-Fluid Ejection Head

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHO...

INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS

Low Profile Printhead

PRINTING INCENTIVE AND OTHER INCENTIVE METHODS AND SYSTEMS

Composite Ceramic Substrate For Micro-Fluid Ejection Head

Micro-Fluid Ejection Devices Having Reduced Input/Output Addressabl...

ELECTRONIC DEVICES AND METHODS FOR FORMING THE SAME

PRINTING OF MULTI-LAYER CIRCUITS

Micro-Fluid Ejection Heads with Chips in Pockets

Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embed...