Frederic Maurer

Person

Valhalla, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for filling high aspect ratio via holes in ele...
- Patent number 6,708,873
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for filling high aspect ratio via holes in electronic substr...
- Patent number 6,581,280
- Issue date Jun 24, 2003
- International Business Machines Corporation
- Brian Eugene Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support and alignment device for enabling chemical mechanical polis...
- Patent number 6,579,149
- Issue date Jun 17, 2003
- International Business Machines Corporation
- Richard J. Lebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,527,158
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Guy Paul Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for filling high aspect ratio via holes in electronic sub...
- Patent number 6,461,136
- Issue date Oct 8, 2002
- International Business Machines Corp.
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling high aspect ratio via holes in electronic substr...
- Patent number 6,452,117
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Brian Eugene Curcio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,394,334
- Issue date May 28, 2002
- International Business Machines Corporation
- Guy Paul Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic method and actuator for inducing motion of an object
- Patent number 6,362,557
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing system and method for integrated spin...
- Patent number 6,319,093
- Issue date Nov 20, 2001
- International Business Machines Corporation
- Richard J. Lebel
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,056,191
- Issue date May 2, 2000
- International Business Machines Corporation
- Guy Paul Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for filling high aspect ratio via holes in electronic substr...
- Publication number 20020179335
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Brian Eugene Curcio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for filling high aspect ratio via holes in ele...
- Publication number 20020175438
- Publication date Nov 28, 2002
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support and alignment device for enabling chemical mechanical polis...
- Publication number 20020106972
- Publication date Aug 8, 2002
- International Business Machines Corporation
- Richard J. Lebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for filling high aspect ratio via holes in electronic substr...
- Publication number 20010027842
- Publication date Oct 11, 2001
- International Business Machines Corporation
- Brian E. Curcio
- H01 - BASIC ELECTRIC ELEMENTS

Frederic Maurer

Person

Patents Grantslast 30 patents

Apparatus and method for filling high aspect ratio via holes in ele...

Method for filling high aspect ratio via holes in electronic substr...

Support and alignment device for enabling chemical mechanical polis...

Method and apparatus for forming solder bumps

Apparatus for filling high aspect ratio via holes in electronic sub...

Method for filling high aspect ratio via holes in electronic substr...

Method and apparatus for forming solder bumps

Ultrasonic method and actuator for inducing motion of an object

Chemical-mechanical polishing system and method for integrated spin...

Method and apparatus for forming solder bumps

Patents Applicationslast 30 patents

Method for filling high aspect ratio via holes in electronic substr...

Apparatus and method for filling high aspect ratio via holes in ele...

Support and alignment device for enabling chemical mechanical polis...

Method for filling high aspect ratio via holes in electronic substr...