Gabriel Z. Guevara

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stretchable film assembly with conductive traces
- Patent number 12,124,035
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,296,053
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable smart object system with methods of making modules and...
- Patent number 11,246,230
- Issue date Feb 8, 2022
- Xcelsis Corporation
- Belgacem Haba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable smart object system with clip-based connectors
- Patent number 11,239,587
- Issue date Feb 1, 2022
- Xcelsis Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable film assembly with conductive traces
- Patent number 10,955,671
- Issue date Mar 23, 2021
- Invensas Corporation
- Belgacem Haba
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Deformable electrical contacts with conformable target pads
- Patent number 10,750,614
- Issue date Aug 18, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable smart object system with magnetic contacts and magneti...
- Patent number 10,734,759
- Issue date Aug 4, 2020
- Xcelsis Corporation
- Belgacem Haba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnection substrates for interconnection between circuit modu...
- Patent number 10,586,759
- Issue date Mar 10, 2020
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage balancing in thin packages
- Patent number 10,483,217
- Issue date Nov 19, 2019
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anchoring structure of fine pitch bva
- Patent number 10,332,854
- Issue date Jun 25, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrates for interconnection between circuit modu...
- Patent number 10,014,243
- Issue date Jul 3, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 10,008,469
- Issue date Jun 26, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage balancing in thin packages
- Patent number 9,972,582
- Issue date May 15, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out wafer-level packaging using metal foil lamination
- Patent number 9,847,238
- Issue date Dec 19, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer-level packaging using metal foil lamination
- Patent number 9,646,946
- Issue date May 9, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrates suitable for interconnection between circuit...
- Patent number 9,583,426
- Issue date Feb 28, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages with mechanically decoupled fan-in and fan-out...
- Patent number 9,543,277
- Issue date Jan 10, 2017
- Invensas Corporation
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 9,502,372
- Issue date Nov 22, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading substrate
- Patent number 9,390,998
- Issue date Jul 12, 2016
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading substrate
- Patent number 8,785,961
- Issue date Jul 22, 2014
- Invensas Corporation
- Gabriel Z. Guevara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20240203948
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20230317591
- Publication date Oct 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230268300
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC DEVICES
- Publication number 20230142680
- Publication date May 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gabriel Z. Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING THIN SUBSTRATES
- Publication number 20230115122
- Publication date Apr 13, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20220293567
- Publication date Sep 15, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES
- Publication number 20210181511
- Publication date Jun 17, 2021
- Invensas Corporation
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20200411483
- Publication date Dec 31, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH CLIP-BASED CONNECTORS
- Publication number 20190280408
- Publication date Sep 12, 2019
- Xcelsis Corporation
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH MAGNETIC CONTACTS AND MAGNETI...
- Publication number 20190280428
- Publication date Sep 12, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH GRID OR FRAME-BASED CONNECTORS
- Publication number 20190280421
- Publication date Sep 12, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES
- Publication number 20190273016
- Publication date Sep 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH STANDARD CONNECTORS FOR ADDIN...
- Publication number 20190097362
- Publication date Mar 28, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH METHODS OF MAKING MODULES AND...
- Publication number 20190029132
- Publication date Jan 24, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Deformable Electrical Contacts With Conformable Target Pads
- Publication number 20180359855
- Publication date Dec 13, 2018
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection Substrates for Interconnection Between Circuit Modu...
- Publication number 20180337118
- Publication date Nov 22, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Balancing In Thin Packages
- Publication number 20180261556
- Publication date Sep 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20180190580
- Publication date Jul 5, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Balancing in Thin Packages
- Publication number 20180040572
- Publication date Feb 8, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
- Publication number 20170170031
- Publication date Jun 15, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION SUBSTRATES FOR INTERCONNECTION BETWEEN CIRCUIT MODU...
- Publication number 20170125331
- Publication date May 4, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORING STRUCTURE OF FINE PITCH BVA
- Publication number 20170117243
- Publication date Apr 27, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION
- Publication number 20170103957
- Publication date Apr 13, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20170069591
- Publication date Mar 9, 2017
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20160322326
- Publication date Nov 3, 2016
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES AND METHODS OF MANUFACTURE
- Publication number 20160126174
- Publication date May 5, 2016
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING SUBSTRATE
- Publication number 20130214295
- Publication date Aug 22, 2013
- Invensas Corporation
- Gabriel Z. Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING SUBSTRATE
- Publication number 20130215121
- Publication date Aug 22, 2013
- Invensas Corporation
- Gabriel Z. Guevara
- H01 - BASIC ELECTRIC ELEMENTS

Gabriel Z. Guevara

Person

Patents Grantslast 30 patents

Stretchable film assembly with conductive traces

Bonded structures with integrated passive component

Direct bonded stack structures for increased reliability and improv...

Bonded structures with integrated passive component

Direct bonded stack structures for increased reliability and improv...

Configurable smart object system with methods of making modules and...

Configurable smart object system with clip-based connectors

Stretchable film assembly with conductive traces

Deformable electrical contacts with conformable target pads

Configurable smart object system with magnetic contacts and magneti...

Interconnection substrates for interconnection between circuit modu...

Warpage balancing in thin packages

Anchoring structure of fine pitch bva

Interconnection substrates for interconnection between circuit modu...

Wafer-level packaging using wire bond wires in place of a redistrib...

Warpage balancing in thin packages

Fan-out wafer-level packaging using metal foil lamination

Fan-out wafer-level packaging using metal foil lamination

Multi-layer substrates suitable for interconnection between circuit...

Wafer level packages with mechanically decoupled fan-in and fan-out...

Wafer-level packaging using wire bond wires in place of a redistrib...

Heat spreading substrate

Heat spreading substrate

Patents Applicationslast 30 patents

DEBONDING REPAIR DEVICES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

BONDED STRUCTURES

STACKED ELECTRONIC DEVICES

METHOD OF BONDING THIN SUBSTRATES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

CONFIGURABLE SMART OBJECT SYSTEM WITH CLIP-BASED CONNECTORS

CONFIGURABLE SMART OBJECT SYSTEM WITH MAGNETIC CONTACTS AND MAGNETI...

CONFIGURABLE SMART OBJECT SYSTEM WITH GRID OR FRAME-BASED CONNECTORS

STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

CONFIGURABLE SMART OBJECT SYSTEM WITH STANDARD CONNECTORS FOR ADDIN...

CONFIGURABLE SMART OBJECT SYSTEM WITH METHODS OF MAKING MODULES AND...

Deformable Electrical Contacts With Conformable Target Pads

Interconnection Substrates for Interconnection Between Circuit Modu...

Warpage Balancing In Thin Packages

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

Warpage Balancing in Thin Packages

Fan-Out Wafer-Level Packaging Using Metal Foil Lamination

INTERCONNECTION SUBSTRATES FOR INTERCONNECTION BETWEEN CIRCUIT MODU...

ANCHORING STRUCTURE OF FINE PITCH BVA

FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

SUBSTRATES AND METHODS OF MANUFACTURE

HEAT SPREADING SUBSTRATE

HEAT SPREADING SUBSTRATE