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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Glass core patch with in situ fabricated fan-out layer to enable di...
Patent number
11,978,685
Issue date
May 7, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,973,041
Issue date
Apr 30, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to form high capacitance thin film capacitors (TFCs) as embe...
Patent number
11,929,212
Issue date
Mar 12, 2024
Intel Corporation
Sameer Paital
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patternable die attach materials and processes for patterning
Patent number
11,923,312
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,923,307
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive route patterning for electronic substrates
Patent number
11,817,349
Issue date
Nov 14, 2023
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass dielectric layer with patterning
Patent number
11,780,210
Issue date
Oct 10, 2023
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,769,735
Issue date
Sep 26, 2023
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
Patent number
11,756,890
Issue date
Sep 12, 2023
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-package assemblies having foam structures for warpage control
Patent number
11,646,274
Issue date
May 9, 2023
Intel Corporation
Mufei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sandwich-molded cores for high-inductance architectures
Patent number
11,622,448
Issue date
Apr 4, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optimal signal routing performance through dielectric material conf...
Patent number
11,574,862
Issue date
Feb 7, 2023
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric filler material in conductive material that functions as...
Patent number
11,527,484
Issue date
Dec 13, 2022
Intel Corporation
Jesse C. Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,521,931
Issue date
Dec 6, 2022
Intel Corporation
Jason M. Gamba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
Patent number
11,355,438
Issue date
Jun 7, 2022
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate embedded magnetic core inductors and method of making
Patent number
11,348,718
Issue date
May 31, 2022
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroless-catalyst doped-mold materials for integrated-circuit di...
Patent number
11,227,849
Issue date
Jan 18, 2022
Intel Corporation
Brandon C Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
First layer interconnect first on carrier approach for EMIB patch
Patent number
11,088,103
Issue date
Aug 10, 2021
Intel Corporation
Changhua Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die placement and coupling apparatus
Patent number
11,062,933
Issue date
Jul 13, 2021
Intel Corporation
Jesse C. Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric filler material in conductive material that functions as...
Patent number
10,847,471
Issue date
Nov 24, 2020
Intel Corporation
Jesse C. Jones
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES
Publication number
20240162158
Publication date
May 16, 2024
Intel Corporation
Brandon C. Marin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
Publication number
20240153837
Publication date
May 9, 2024
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...
Publication number
20240128247
Publication date
Apr 18, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Publication number
20240114623
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
Publication number
20240113048
Publication date
Apr 4, 2024
Intel Corporation
Srinivasan Raman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112970
Publication date
Apr 4, 2024
Intel Corporation
Hanyu Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS
Publication number
20240112973
Publication date
Apr 4, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240113072
Publication date
Apr 4, 2024
Intel Corporation
Whitney Bryks
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE
Publication number
20240111092
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. MARIN
G02 - OPTICS
Information
Patent Application
MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDIS...
Publication number
20240113075
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112971
Publication date
Apr 4, 2024
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BO...
Publication number
20240113000
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING E...
Publication number
20240113047
Publication date
Apr 4, 2024
Intel Corporation
Srinivasan Raman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
Publication number
20240113087
Publication date
Apr 4, 2024
Intel Corporation
Brandon Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH...
Publication number
20240105571
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS
Publication number
20240105625
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
Publication number
20240105655
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH LEDS
Publication number
20240097079
Publication date
Mar 21, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
Publication number
20240096809
Publication date
Mar 21, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR GLASS CORE INDUCTOR
Publication number
20240088199
Publication date
Mar 14, 2024
Intel Corporation
Brandon Christian Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
Publication number
20240088052
Publication date
Mar 14, 2024
Intel Corporation
Bai NIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY F...
Publication number
20240087971
Publication date
Mar 14, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED BRIDGE DIES
Publication number
20240079339
Publication date
Mar 7, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATION OF DIES IN AN INTEGRATED CIRCUIT DEVICE
Publication number
20240079335
Publication date
Mar 7, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SEL...
Publication number
20240079334
Publication date
Mar 7, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A B...
Publication number
20240079337
Publication date
Mar 7, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR IMPROVED FIDUCIAL MARKER DETECTION
Publication number
20240078702
Publication date
Mar 7, 2024
Intel Corporation
Yi LI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES
Publication number
20240071933
Publication date
Feb 29, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE
Publication number
20240071935
Publication date
Feb 29, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS