Gann Keith

Person

Tustin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 8,835,218
- Issue date Sep 16, 2014
- Aprolase Development Co., LLC
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked pre-packaged integrated circuit chips
- Patent number 8,012,803
- Issue date Sep 6, 2011
- Aprolase Development Co., LLC
- Keith Gann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 7,982,300
- Issue date Jul 19, 2011
- Aprolase Development Co., LLC
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array utilizing dedicated memory stacks in...
- Patent number 7,902,879
- Issue date Mar 8, 2011
- Aprolase Development Co., LLC
- Volkan H. Ozguz
- G01 - MEASURING TESTING
Information Patent Grant
Vertically stacked pre-packaged integrated circuit chips
- Patent number 7,872,339
- Issue date Jan 18, 2011
- Keith Gann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked microelectronic layer and module with three-axis channel T-...
- Patent number 7,777,321
- Issue date Aug 17, 2010
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package format layers and structure
- Patent number 7,714,426
- Issue date May 11, 2010
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array utilizing dedicated memory stacks in...
- Patent number 7,649,386
- Issue date Jan 19, 2010
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
BGA-scale stacks comprised of layers containing integrated circuit...
- Patent number 7,511,369
- Issue date Mar 31, 2009
- Irvine Sensors Corp.
- Gann Keith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array incorporating dedicated memory stacks
- Patent number 7,265,579
- Issue date Sep 4, 2007
- Irvine Sensors Corp.
- Randolph Stuart Carlson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating known good dies from packaged integrated circ...
- Patent number 7,174,627
- Issue date Feb 13, 2007
- Irvine Sensors Corporation
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Field programmable gate array with a variably wide word width memory
- Patent number 6,856,167
- Issue date Feb 15, 2005
- Irvine Sensors Corporation
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for connecting vertically stacked integrated c...
- Patent number 6,806,559
- Issue date Oct 19, 2004
- Irvine Sensors Corporation
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Patent number 6,706,971
- Issue date Mar 16, 2004
- Irvine Sensors Corporation
- Douglas M. Albert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE
- Publication number 20110269270
- Publication date Nov 3, 2011
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS
- Publication number 20110045635
- Publication date Feb 24, 2011
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE
- Publication number 20100181662
- Publication date Jul 22, 2010
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD PROGRAMMABLE GATE ARRAY UTILIZING DEDICATED MEMORY STACKS IN...
- Publication number 20100148822
- Publication date Jun 17, 2010
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED MICROELECTRONIC LAYER AND MODULE WITH THREE-AXIS CHANNEL T-...
- Publication number 20100009499
- Publication date Jan 14, 2010
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field programmable gate array utilizing dedicated memory stacks in...
- Publication number 20080074144
- Publication date Mar 27, 2008
- Volkan Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BGA-scale stacks comprised of layers containing integrated circuit...
- Publication number 20070158805
- Publication date Jul 12, 2007
- Gann Keith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making stacked integrated circuits (ICs) using prepackag...
- Publication number 20070102803
- Publication date May 10, 2007
- Irvine Sensors Corporation
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked microelectronic layer and module with three-axis channel T-...
- Publication number 20060043563
- Publication date Mar 2, 2006
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field programmable gate array incorporating dedicated memory stacks
- Publication number 20050122758
- Publication date Jun 9, 2005
- Randolph Stuart Carlson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Vertically stacked pre-packaged integrated circuit chips
- Publication number 20050077621
- Publication date Apr 14, 2005
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field programmable gate array with a variably wide word width memory
- Publication number 20030223295
- Publication date Dec 4, 2003
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for making stacked integrated circuits (ICs) using prepackag...
- Publication number 20030221313
- Publication date Dec 4, 2003
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for connecting vertically stacked integrated c...
- Publication number 20030197253
- Publication date Oct 23, 2003
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating known good dies from packaged integrated circ...
- Publication number 20030094704
- Publication date May 22, 2003
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Publication number 20020126459
- Publication date Sep 12, 2002
- Douglas M. Albert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Publication number 20020100600
- Publication date Aug 1, 2002
- Douglas M. Albert
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Stackable layer containing ball grid array package

Vertically stacked pre-packaged integrated circuit chips

Stackable layer containing ball grid array package

Field programmable gate array utilizing dedicated memory stacks in...

Vertically stacked pre-packaged integrated circuit chips

Stacked microelectronic layer and module with three-axis channel T-...

Ball grid array package format layers and structure

Field programmable gate array utilizing dedicated memory stacks in...

BGA-scale stacks comprised of layers containing integrated circuit...

Field programmable gate array incorporating dedicated memory stacks

Method of fabricating known good dies from packaged integrated circ...

Field programmable gate array with a variably wide word width memory

Method and apparatus for connecting vertically stacked integrated c...

Stackable microcircuit layer formed from a plastic encapsulated mic...

Patents Applicationslast 30 patents

STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS

STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

FIELD PROGRAMMABLE GATE ARRAY UTILIZING DEDICATED MEMORY STACKS IN...

STACKED MICROELECTRONIC LAYER AND MODULE WITH THREE-AXIS CHANNEL T-...

Field programmable gate array utilizing dedicated memory stacks in...

BGA-scale stacks comprised of layers containing integrated circuit...

Method for making stacked integrated circuits (ICs) using prepackag...

Stacked microelectronic layer and module with three-axis channel T-...

Field programmable gate array incorporating dedicated memory stacks

Vertically stacked pre-packaged integrated circuit chips

Field programmable gate array with a variably wide word width memory

Method for making stacked integrated circuits (ICs) using prepackag...

Method and apparatus for connecting vertically stacked integrated c...

Method of fabricating known good dies from packaged integrated circ...

Stackable microcircuit layer formed from a plastic encapsulated mic...

Stackable microcircuit layer formed from a plastic encapsulated mic...