Giback Park

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package core assembly and fabrication methods
- Patent number 12,087,679
- Issue date Sep 10, 2024
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization methods for packaging substrates
- Patent number 11,931,855
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,887,934
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 11,881,447
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 11,862,546
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structuring methods
- Patent number 11,837,680
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High connectivity device stacking
- Patent number 11,742,330
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,715,700
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of micro-via formation for advanced packaging
- Patent number 11,705,365
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation system for package fabrication
- Patent number 11,676,832
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structures with built-in EMI shielding
- Patent number 11,521,937
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Steven Verhaverbeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,521,935
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,476,202
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation for package fabrication
- Patent number 11,400,545
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,398,433
- Issue date Jul 26, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved polymer-copper adhesion
- Patent number 11,388,822
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate structuring methods
- Patent number 11,362,235
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via formation by micro-imprinting
- Patent number 11,281,094
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Roman Gouk
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,264,333
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,264,331
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High connectivity device stacking
- Patent number 11,257,790
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- Kurtis Leschkies
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structuring methods
- Patent number 11,063,169
- Issue date Jul 13, 2021
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with embedded core
- Patent number 10,937,726
- Issue date Mar 2, 2021
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 10,886,232
- Issue date Jan 5, 2021
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy storage device having an interlayer between electrode and el...
- Patent number 10,547,040
- Issue date Jan 28, 2020
- Applied Materials, Inc.
- Giback Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR LASER MACHINING OF A SUBSTRATE
- Publication number 20240123551
- Publication date Apr 18, 2024
- APPLIED MATERIALS ITALIA S.R.L.
- Jeffrey L. FRANKLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20240021533
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20240021582
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
- Publication number 20230282498
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20230187370
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER FRAME FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20230070053
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING
- Publication number 20220375787
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Wei-Sheng LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURING METHODS
- Publication number 20220278248
- Publication date Sep 1, 2022
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
- Publication number 20220171281
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Roman GOUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH BUILT-IN EMI SHIELDING
- Publication number 20220157740
- Publication date May 19, 2022
- Applied Materials, Inc.
- Steven VERHAVERBEKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20220139884
- Publication date May 5, 2022
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Improved Polymer-Copper Adhesion
- Publication number 20220071023
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
- Publication number 20220028709
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ABLATION FOR PACKAGE FABRICATION
- Publication number 20210346983
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20210288027
- Publication date Sep 16, 2021
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210257289
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20210257306
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20210257307
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210249345
- Publication date Aug 12, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURING METHODS
- Publication number 20210234060
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210159160
- Publication date May 27, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210159158
- Publication date May 27, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20200395306
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20200395305
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHODS FOR PACKAGING SUBSTRATES
- Publication number 20200391343
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- B24 - GRINDING POLISHING
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20200395304
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20200357749
- Publication date Nov 12, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURING METHODS
- Publication number 20200357947
- Publication date Nov 12, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20200357750
- Publication date Nov 12, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
- Publication number 20200159113
- Publication date May 21, 2020
- Applied Materials, Inc.
- Roman GOUK
- H01 - BASIC ELECTRIC ELEMENTS

Giback Park

Person

Patents Grantslast 30 patents

Package core assembly and fabrication methods

Planarization methods for packaging substrates

Package structure and fabrication methods

Package core assembly and fabrication methods

Package core assembly and fabrication methods

Substrate structuring methods

High connectivity device stacking

Reconstituted substrate structure and fabrication methods for heter...

Methods of micro-via formation for advanced packaging

Laser ablation system for package fabrication

Package structures with built-in EMI shielding

Package structure and fabrication methods

Reconstituted substrate structure and fabrication methods for heter...

Laser ablation for package fabrication

Reconstituted substrate structure and fabrication methods for heter...

Methods for improved polymer-copper adhesion

Substrate structuring methods

Method for via formation by micro-imprinting

Reconstituted substrate structure and fabrication methods for heter...

Package structure and fabrication methods

High connectivity device stacking

Substrate structuring methods

Package structure with embedded core

Package structure and fabrication methods

Energy storage device having an interlayer between electrode and el...

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR LASER MACHINING OF A SUBSTRATE

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

HIGH CONNECTIVITY DEVICE STACKING

LASER ABLATION SYSTEM FOR PACKAGE FABRICATION

PACKAGE STRUCTURE AND FABRICATION METHODS

STIFFENER FRAME FOR SEMICONDUCTOR DEVICE PACKAGES

METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING

SUBSTRATE STRUCTURING METHODS

METHOD FOR VIA FORMATION BY MICRO-IMPRINTING

PACKAGE STRUCTURES WITH BUILT-IN EMI SHIELDING

HIGH CONNECTIVITY DEVICE STACKING

Methods for Improved Polymer-Copper Adhesion

LASER ABLATION SYSTEM FOR PACKAGE FABRICATION

LASER ABLATION FOR PACKAGE FABRICATION

HIGH CONNECTIVITY DEVICE STACKING

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PACKAGE STRUCTURE AND FABRICATION METHODS

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

SUBSTRATE STRUCTURING METHODS

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

PLANARIZATION METHODS FOR PACKAGING SUBSTRATES

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

PACKAGE STRUCTURE AND FABRICATION METHODS

SUBSTRATE STRUCTURING METHODS

PACKAGE STRUCTURE AND FABRICATION METHODS

METHOD FOR VIA FORMATION BY MICRO-IMPRINTING