Giles Humpston

Person

Buckinghamshire, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Rear-face illuminated solid state image sensors
- Patent number 10,249,673
- Issue date Apr 2, 2019
- Invensas Corporation
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with multi-layer support structure
- Patent number 9,548,145
- Issue date Jan 17, 2017
- Invensas Corporation
- Michael J. Nystrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rear-face illuminated solid state image sensors
- Patent number 9,484,379
- Issue date Nov 1, 2016
- Invensas Corporation
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact camera modules with features for reducing Z-height and faci...
- Patent number 9,029,759
- Issue date May 12, 2015
- Nan Chang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Rear-face illuminated solid state image sensors
- Patent number 8,900,910
- Issue date Dec 2, 2014
- Invensas Corporation
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer stack packaging with after-applied pad extensions
- Patent number 8,883,562
- Issue date Nov 11, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging process using through silicon vias
- Patent number 8,735,287
- Issue date May 27, 2014
- Invensas Corp.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rear-face illuminated solid state image sensors
- Patent number 8,624,342
- Issue date Jan 7, 2014
- Invensas Corporation
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with multi-layer support structure
- Patent number 8,604,605
- Issue date Dec 10, 2013
- Invensas Corp.
- Michael J. Nystrom
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stack packages using reconstituted wafers
- Patent number 8,551,815
- Issue date Oct 8, 2013
- Tessera, Inc.
- Osher Avsian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrohydrodynamic device components employing solid solutions
- Patent number 8,545,599
- Issue date Oct 1, 2013
- Tessera, Inc.
- Giles Humpston
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Grant
Stacked microelectronic assemblies having vias extending through bo...
- Patent number 8,466,542
- Issue date Jun 18, 2013
- Tessera, Inc.
- Moshe Kriman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer stack packaging with after-applied pad extensions
- Patent number 8,461,672
- Issue date Jun 11, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages fabricated at the wafer level and methods...
- Patent number 8,241,959
- Issue date Aug 14, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging process using through silicon vias
- Patent number 8,193,615
- Issue date Jun 5, 2012
- DigitalOptics Corporation Europe Limited
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,935,568
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip packaging
- Patent number 7,936,062
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire bonded wafer level cavity package
- Patent number 7,858,445
- Issue date Dec 28, 2010
- Tessera, Inc.
- Kenneth Allen Honer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for forming connection structures for microelectronic devices
- Patent number 7,793,414
- Issue date Sep 14, 2010
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages fabricated at the wafer level and methods...
- Patent number 7,759,166
- Issue date Jul 20, 2010
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,719,121
- Issue date May 18, 2010
- Tessera, Inc.
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin referenced image sensor to reduce tilt in a camera module
- Patent number 7,593,636
- Issue date Sep 22, 2009
- Tessera, Inc.
- Michael J. Nystrom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming a wall structure in a microelectronic assembly
- Patent number 7,569,424
- Issue date Aug 4, 2009
- Tessera, Inc.
- Michael J. Nystrom
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stack microelectronic assemblies
- Patent number 7,545,029
- Issue date Jun 9, 2009
- Tessera, Inc.
- Stuart E. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant terminal mountings with vented spaces and methods
- Patent number 7,521,276
- Issue date Apr 21, 2009
- Tessera, Inc.
- Michael J. Nystrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component with foam-metal posts
- Patent number 7,510,401
- Issue date Mar 31, 2009
- Tessera, Inc.
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant terminal mountings with vented spaces and methods
- Patent number 7,453,139
- Issue date Nov 18, 2008
- Tessera, Inc.
- Michael J. Nystrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded wafer level cavity package
- Patent number 7,449,779
- Issue date Nov 11, 2008
- Tessera, Inc.
- Kenneth Allen Honer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Liquid lens with piezoelectric voltage converter
- Patent number 7,443,597
- Issue date Oct 28, 2008
- Tessera, Inc.
- Giles Humpston
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Remote control and power system
- Patent number 7,026,744
- Issue date Apr 11, 2006
- Bookham Technology, PLC
- Giles Humpston
- G08 - SIGNALLING

Patents Applicationslast 30 patents

Information Patent Application
Rear-face illuminated solid state image sensors
- Publication number 20170117318
- Publication date Apr 27, 2017
- TESSERA NORTH AMERICA, INC.
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
- Publication number 20150091120
- Publication date Apr 2, 2015
- Invensas Corporation
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH MULTI-LAYER SUPPORT STRUCTURE
- Publication number 20140224419
- Publication date Aug 14, 2014
- Invensas Corporation
- Michael J. Nystrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
- Publication number 20140120650
- Publication date May 1, 2014
- Invensas Corporation
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES USING RECONSTITUTED WAFERS
- Publication number 20140027931
- Publication date Jan 30, 2014
- Tessera, Inc.
- Osher Avsian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROHYDRODYNAMIC (EHD) AIR MOVER CONFIGURATION WITH FLOW PATH EX...
- Publication number 20130340981
- Publication date Dec 26, 2013
- Tessera, Inc.
- Nels Jewell-Larsen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
- Publication number 20130344652
- Publication date Dec 26, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-State Electrostatic Actuator and Digital Camera Therewith
- Publication number 20130314587
- Publication date Nov 28, 2013
- DIGITALOPTICS CORPORATION MEMS
- Moshe Kriman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Compact Camera Module
- Publication number 20130270419
- Publication date Oct 17, 2013
- DigitalOptics Corporation
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTER WIRE WITH LAYERED CROSS-SECTION
- Publication number 20130056241
- Publication date Mar 7, 2013
- Tessera, Inc.
- Guilian Gao
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
SEMICONDUCTOR PACKAGING PROCESS USING THROUGH SILICON VIAS
- Publication number 20120241976
- Publication date Sep 27, 2012
- DigitalOptics Corporation Europe Limited
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Scale Emitter Package Including Thermal Vias
- Publication number 20120199857
- Publication date Aug 9, 2012
- DigitalOptics Corporation East
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
- Publication number 20120112301
- Publication date May 10, 2012
- TESSERA NORTH AMERICA, INC.
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrohydrodynamic Device Components Employing Solid Solutions
- Publication number 20120103196
- Publication date May 3, 2012
- Tessera, Inc.
- Giles Humpston
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STACK PACKAGES USING RECONSTITUTED WAFERS
- Publication number 20110248410
- Publication date Oct 13, 2011
- Tessera, Inc.
- Osher Avsian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
- Publication number 20110006432
- Publication date Jan 13, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES FABRICATED AT THE WAFER LEVEL AND METHODS...
- Publication number 20100270679
- Publication date Oct 28, 2010
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT LENS TURRET ASSEMBLY
- Publication number 20100242269
- Publication date Sep 30, 2010
- Tessera, Inc.
- Giles Humpston
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BO...
- Publication number 20100230795
- Publication date Sep 16, 2010
- Tessera Technologies Hungary Kft.
- Moshe Kriman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging process using through silicon vias
- Publication number 20090065907
- Publication date Mar 12, 2009
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonded wafer level cavity package
- Publication number 20090023249
- Publication date Jan 22, 2009
- Tessera, Inc.
- Kenneth Allen Honer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packages and assemblies including lidded chips
- Publication number 20080296717
- Publication date Dec 4, 2008
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin referenced image sensor to reduce tilt in a camera module
- Publication number 20080191300
- Publication date Aug 14, 2008
- Tessera, Inc.
- Michael J. Nystrom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20080185705
- Publication date Aug 7, 2008
- Tessera, Inc.
- Philip R. Osborn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly with multi-layer support structure
- Publication number 20080165519
- Publication date Jul 10, 2008
- Tessera, Inc.
- Michael J. Nystrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a wall structure in a microelectronic assembly
- Publication number 20080113470
- Publication date May 15, 2008
- Tessera, Inc.
- Michael J. Nystrom
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099900
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages fabricated at the wafer level and methods...
- Publication number 20080090333
- Publication date Apr 17, 2008
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20080088033
- Publication date Apr 17, 2008
- Tessera, Inc.
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic component with foam-metal posts
- Publication number 20080090427
- Publication date Apr 17, 2008
- Tessera, Inc.
- Giles Humpston
- H01 - BASIC ELECTRIC ELEMENTS

Giles Humpston

Person

Patents Grantslast 30 patents

Rear-face illuminated solid state image sensors

Microelectronic assembly with multi-layer support structure

Rear-face illuminated solid state image sensors

Compact camera modules with features for reducing Z-height and faci...

Rear-face illuminated solid state image sensors

Reconstituted wafer stack packaging with after-applied pad extensions

Semiconductor packaging process using through silicon vias

Rear-face illuminated solid state image sensors

Microelectronic assembly with multi-layer support structure

Stack packages using reconstituted wafers

Electrohydrodynamic device components employing solid solutions

Stacked microelectronic assemblies having vias extending through bo...

Reconstituted wafer stack packaging with after-applied pad extensions

Microelectronic packages fabricated at the wafer level and methods...

Semiconductor packaging process using through silicon vias

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer level chip packaging

Wire bonded wafer level cavity package

Methods for forming connection structures for microelectronic devices

Microelectronic packages fabricated at the wafer level and methods...

Microelectronic packages and methods therefor

Pin referenced image sensor to reduce tilt in a camera module

Method of forming a wall structure in a microelectronic assembly

Stack microelectronic assemblies

Compliant terminal mountings with vented spaces and methods

Microelectronic component with foam-metal posts

Compliant terminal mountings with vented spaces and methods

Wire bonded wafer level cavity package

Liquid lens with piezoelectric voltage converter

Remote control and power system

Patents Applicationslast 30 patents

Rear-face illuminated solid state image sensors

REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

MICROELECTRONIC ASSEMBLY WITH MULTI-LAYER SUPPORT STRUCTURE

REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

STACK PACKAGES USING RECONSTITUTED WAFERS

ELECTROHYDRODYNAMIC (EHD) AIR MOVER CONFIGURATION WITH FLOW PATH EX...

RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS

Multi-State Electrostatic Actuator and Digital Camera Therewith

Compact Camera Module

EMITTER WIRE WITH LAYERED CROSS-SECTION

SEMICONDUCTOR PACKAGING PROCESS USING THROUGH SILICON VIAS

Wafer-Scale Emitter Package Including Thermal Vias

REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

Electrohydrodynamic Device Components Employing Solid Solutions

STACK PACKAGES USING RECONSTITUTED WAFERS

RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS

MICROELECTRONIC PACKAGES FABRICATED AT THE WAFER LEVEL AND METHODS...

COMPACT LENS TURRET ASSEMBLY

STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BO...

Semiconductor packaging process using through silicon vias

Wire bonded wafer level cavity package

Packages and assemblies including lidded chips

Pin referenced image sensor to reduce tilt in a camera module

Microelectronic packages and methods therefor

Microelectronic assembly with multi-layer support structure

Method of forming a wall structure in a microelectronic assembly

Wafer-level fabrication of lidded chips with electrodeposited diele...

Microelectronic packages fabricated at the wafer level and methods...

Microelectronic packages and methods therefor

Microelectronic component with foam-metal posts