Giulio DiGiacomo

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
- Patent number 6,678,949
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chandrika Prasad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal enhancement approach using solder compositions in the liqui...
- Patent number 6,656,770
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and heat-sink cap combination
- Patent number 6,373,133
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pb-In-Sn tall C-4 for fatigue enhancement
- Patent number 6,329,721
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhancement approach using solder compositions in the liqui...
- Patent number 6,281,573
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level thin-film electronic packaging structure and related me...
- Patent number 6,281,452
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding heatsink to multiple-height chip
- Patent number 6,214,647
- Issue date Apr 10, 2001
- International Business Machines Corporation
- Giulio Di Giacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pb-In-Sn tall C-4 for fatigue enhancement
- Patent number 6,196,443
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip-cooling through liquid vaporization heat exchange
- Patent number 6,085,831
- Issue date Jul 11, 2000
- International Business Machines Corporation
- Giulio DiGiacomo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pb-In-Sn tall C-4 for fatigue enhancement
- Patent number 6,025,649
- Issue date Feb 15, 2000
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip heat-sink cap assembly
- Patent number 5,981,310
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ternary solder for the enhancement of C-4 fatigue life
- Patent number 5,950,907
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Giulio DiGiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ternary solder for the enhancement of C-4 fatigue life
- Patent number 5,831,336
- Issue date Nov 3, 1998
- International Business Machines Corporation
- Giulio DiGiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature controlled multi-layer module
- Patent number 5,539,186
- Issue date Jul 23, 1996
- International Business Machines Corporation
- Anthony J. Abrami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for corrosion and stress-resistant interconnec...
- Patent number 5,442,239
- Issue date Aug 15, 1995
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a superbarrier to prevent diffusion betwee...
- Patent number 5,420,073
- Issue date May 30, 1995
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a superbarrier to prevent diffusion betwee...
- Patent number 5,367,195
- Issue date Nov 22, 1994
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for corrosion and stress-resistant interconnec...
- Patent number 5,266,522
- Issue date Nov 30, 1993
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost ternary composite for use in vias in glass-ceramic structures
- Patent number 5,192,622
- Issue date Mar 9, 1993
- International Business Machines Corporation
- Armando S. Cammarano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Structure and method for corrosion and stress-resistant interconnec...
- Patent number 5,175,609
- Issue date Dec 29, 1992
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for brazing
- Patent number 4,465,223
- Issue date Aug 14, 1984
- International Business Machines Corporation
- Armando S. Cammarano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin for brazing to a substrate and improved package resulting there...
- Patent number 4,360,289
- Issue date Nov 23, 1982
- International Business Machines Corporation
- Armando S. Cammarano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determination of electric current flow patterns
- Patent number 4,272,722
- Issue date Jun 9, 1981
- International Business Machines Corporation
- Armando S. Cammarano
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Process for forming a multi-level thin-film electronic packaging st...
- Publication number 20010037565
- Publication date Nov 8, 2001
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhancement approach using solder compositions in the liqui...
- Publication number 20010026957
- Publication date Oct 4, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS

Giulio DiGiacomo

Person

Patents Grantslast 30 patents

Process for forming a multi-level thin-film electronic packaging st...

Thermal enhancement approach using solder compositions in the liqui...

Multi-chip module and heat-sink cap combination

Pb-In-Sn tall C-4 for fatigue enhancement

Thermal enhancement approach using solder compositions in the liqui...

Multi-level thin-film electronic packaging structure and related me...

Method for bonding heatsink to multiple-height chip

Pb-In-Sn tall C-4 for fatigue enhancement

Direct chip-cooling through liquid vaporization heat exchange

Pb-In-Sn tall C-4 for fatigue enhancement

Multi-chip heat-sink cap assembly

Ternary solder for the enhancement of C-4 fatigue life

Ternary solder for the enhancement of C-4 fatigue life

Temperature controlled multi-layer module

Structure and method for corrosion and stress-resistant interconnec...

Structure and method for a superbarrier to prevent diffusion betwee...

Structure and method for a superbarrier to prevent diffusion betwee...

Structure and method for corrosion and stress-resistant interconnec...

Low-cost ternary composite for use in vias in glass-ceramic structures

Structure and method for corrosion and stress-resistant interconnec...

Process for brazing

Pin for brazing to a substrate and improved package resulting there...

Determination of electric current flow patterns

Patents Applicationslast 30 patents

Process for forming a multi-level thin-film electronic packaging st...

Thermal enhancement approach using solder compositions in the liqui...