Greg M. Chrysler

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus to minimize thermal impedance using copper on die backside
- Patent number 9,406,582
- Issue date Aug 2, 2016
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly including built-in thermoelectric cooler a...
- Patent number 8,686,277
- Issue date Apr 1, 2014
- Intel Corporation
- Mohammad M. Farahani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotube based vapor chamber for die level cooling
- Patent number 8,623,705
- Issue date Jan 7, 2014
- Intel Corporation
- Unnikrishnan Vadakkanmaruveedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,518,750
- Issue date Aug 27, 2013
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die having a via filled with a heat-dissipating material
- Patent number 8,505,613
- Issue date Aug 13, 2013
- Intel Corporation
- Gregory M. Chrysler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,409,924
- Issue date Apr 2, 2013
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process that includes assembling together first and second substrat...
- Patent number 8,404,519
- Issue date Mar 26, 2013
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for two-phase start-up operation
- Patent number 8,333,569
- Issue date Dec 18, 2012
- Intel Corporation
- Ioan Sauciuc
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,227,907
- Issue date Jul 24, 2012
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microarchitecture control for thermoelectric cooling
- Patent number 8,209,989
- Issue date Jul 3, 2012
- Intel Corporation
- Pedro Chaparro Monferrer
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Cooling devices in semiconductor packages
- Patent number 8,164,169
- Issue date Apr 24, 2012
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube micro-chimney and thermo siphon die-level cooling
- Patent number 8,125,075
- Issue date Feb 28, 2012
- Intel Corporation
- James G. Maveety
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Micro-chimney and thermosiphon die-level cooling
- Patent number 8,006,747
- Issue date Aug 30, 2011
- Intel Corporation
- Gregory M. Chrysler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Process of making carbon nanotube array that includes impregnating...
- Patent number 7,964,447
- Issue date Jun 21, 2011
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 7,915,081
- Issue date Mar 29, 2011
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotube based vapor chamber for die level cooling
- Patent number 7,911,052
- Issue date Mar 22, 2011
- Intel Corporation
- Unnikrishnan Vadakkanmaruveedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package and method of cooling an interconnect featu...
- Patent number 7,851,905
- Issue date Dec 14, 2010
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Covered devices in a semiconductor package
- Patent number 7,825,503
- Issue date Nov 2, 2010
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic cooling apparatus and associated method
- Patent number 7,795,711
- Issue date Sep 14, 2010
- Intel Corporation
- Ioan Sauciuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized microelectronic cooling apparatuses and associated method...
- Patent number 7,779,638
- Issue date Aug 24, 2010
- Intel Corporation
- Ioan Sauciuc
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Diamond substrate formation for electronic assemblies
- Patent number 7,713,839
- Issue date May 11, 2010
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric air jet augmented cooling for electronic devices
- Patent number 7,633,753
- Issue date Dec 15, 2009
- Intel Corporation
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Covered devices in a semiconductor package
- Patent number 7,622,327
- Issue date Nov 24, 2009
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
- Patent number 7,589,417
- Issue date Sep 15, 2009
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling mechanism for stacked die package, and method of manufactur...
- Patent number 7,557,438
- Issue date Jul 7, 2009
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric fan, cooling device containing same, and method of co...
- Patent number 7,550,901
- Issue date Jun 23, 2009
- Intel Corporation
- Gregory M. Chrysler
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Article having metal impregnated within carbon nanotube array
- Patent number 7,545,030
- Issue date Jun 9, 2009
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer piezoelectric actuators with conductive polymer electrodes
- Patent number 7,538,476
- Issue date May 26, 2009
- Intel Corporation
- Gregory M. Chrysler
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
- Patent number 7,537,954
- Issue date May 26, 2009
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-carbon and/or metal-carbon fiber composite heat spreader
- Patent number 7,534,650
- Issue date May 19, 2009
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic Assembly including Built-In Thermoelectric Cooler a...
- Publication number 20150332987
- Publication date Nov 19, 2015
- Intel Corporation
- Mohammad M. Farahani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20130122656
- Publication date May 16, 2013
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20120289002
- Publication date Nov 15, 2012
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE MICRO-CHIMNEY AND THERMO SIPHON DIE-LEVEL COOLING
- Publication number 20120021566
- Publication date Jan 26, 2012
- James G. Maveety
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING
- Publication number 20110297362
- Publication date Dec 8, 2011
- Gregory M. Chrysler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING
- Publication number 20110269271
- Publication date Nov 3, 2011
- Unnikrishnan Vadakkanmaruveedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE AND METAL THERMAL INTERFACE MATERIAL, PROCESS OF MA...
- Publication number 20110214285
- Publication date Sep 8, 2011
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICES IN SEMICONDUCTOR PACKAGES
- Publication number 20110135015
- Publication date Jun 9, 2011
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20110103438
- Publication date May 5, 2011
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flow-Through Air Conditioning for Electronics Racks
- Publication number 20090310300
- Publication date Dec 17, 2009
- Minebea Co., Ltd
- Gregory M. Chrysler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERED DEVICES IN A SEMICONDUCTOR PACKAGE
- Publication number 20090289353
- Publication date Nov 26, 2009
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon nanotube and metal thermal interface material, process of ma...
- Publication number 20090218681
- Publication date Sep 3, 2009
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC AIR JET AUGMENTED COOLING FOR ELECTRONIC DEVICES
- Publication number 20090174999
- Publication date Jul 9, 2009
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flip-chip package
- Publication number 20090166890
- Publication date Jul 2, 2009
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL CO...
- Publication number 20090152713
- Publication date Jun 18, 2009
- Ioan Sauciuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-chimney and thermosiphon die-level cooling
- Publication number 20090129022
- Publication date May 21, 2009
- Intel Corporation
- Gregory M. Chrysler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME
- Publication number 20090096087
- Publication date Apr 16, 2009
- Ioan Sauciuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS
- Publication number 20090084931
- Publication date Apr 2, 2009
- Intel Corporation
- Ioan Sauciuc
- B22 - CASTING POWDER METALLURGY
Information Patent Application
NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING
- Publication number 20090085198
- Publication date Apr 2, 2009
- Unnikrishnan Vadakkanmaruveedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC FAN, COOLING DEVICE CONTAINING SAME, AND METHOD OF CO...
- Publication number 20090085438
- Publication date Apr 2, 2009
- Gregory M. Chrysler
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATU...
- Publication number 20090079063
- Publication date Mar 26, 2009
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE
- Publication number 20080296754
- Publication date Dec 4, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING
- Publication number 20080236175
- Publication date Oct 2, 2008
- Pedro Chaparro Monferrer
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
MULTI-LAYER PIEZOELECTRIC ACTUATORS WITH CONDUCTIVE POLYMER ELECTRODES
- Publication number 20080238248
- Publication date Oct 2, 2008
- Gregory M. Chrysler
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Method and system to cool memory
- Publication number 20080158812
- Publication date Jul 3, 2008
- Hakan Erturk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...
- Publication number 20080153210
- Publication date Jun 26, 2008
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH MANIFOLD MEMB...
- Publication number 20080068792
- Publication date Mar 20, 2008
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing burst-related hazards in microelectronic cooling systems
- Publication number 20080006389
- Publication date Jan 10, 2008
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method, apparatus and system for carbon nanotube wick structures
- Publication number 20070284089
- Publication date Dec 13, 2007
- Intel Corporation
- Unnikrishnan Vadakkanmaruveedu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Cooling mechanism for stacked die package, and method of manufactur...
- Publication number 20070252253
- Publication date Nov 1, 2007
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS

Greg M. Chrysler

Person

Patents Grantslast 30 patents

Apparatus to minimize thermal impedance using copper on die backside

Microelectronic assembly including built-in thermoelectric cooler a...

Nanotube based vapor chamber for die level cooling

Flexible interconnect pattern on semiconductor package

Die having a via filled with a heat-dissipating material

Flexible interconnect pattern on semiconductor package

Process that includes assembling together first and second substrat...

Method and apparatus for two-phase start-up operation

Flexible interconnect pattern on semiconductor package

Microarchitecture control for thermoelectric cooling

Cooling devices in semiconductor packages

Carbon nanotube micro-chimney and thermo siphon die-level cooling

Micro-chimney and thermosiphon die-level cooling

Process of making carbon nanotube array that includes impregnating...

Flexible interconnect pattern on semiconductor package

Nanotube based vapor chamber for die level cooling

Microelectronic package and method of cooling an interconnect featu...

Covered devices in a semiconductor package

Microelectronic cooling apparatus and associated method

Localized microelectronic cooling apparatuses and associated method...

Diamond substrate formation for electronic assemblies

Piezoelectric air jet augmented cooling for electronic devices

Covered devices in a semiconductor package

Microelectronic assembly having thermoelectric elements to cool a d...

Cooling mechanism for stacked die package, and method of manufactur...

Piezoelectric fan, cooling device containing same, and method of co...

Article having metal impregnated within carbon nanotube array

Multi-layer piezoelectric actuators with conductive polymer electrodes

Microelectronic assembly having thermoelectric elements to cool a d...

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Patents Applicationslast 30 patents

Microelectronic Assembly including Built-In Thermoelectric Cooler a...

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

CARBON NANOTUBE MICRO-CHIMNEY AND THERMO SIPHON DIE-LEVEL COOLING

MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING

NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING

CARBON NANOTUBE AND METAL THERMAL INTERFACE MATERIAL, PROCESS OF MA...

COOLING DEVICES IN SEMICONDUCTOR PACKAGES

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

Flow-Through Air Conditioning for Electronics Racks

COVERED DEVICES IN A SEMICONDUCTOR PACKAGE

Carbon nanotube and metal thermal interface material, process of ma...

PIEZOELECTRIC AIR JET AUGMENTED COOLING FOR ELECTRONIC DEVICES

Flip-chip package

INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL CO...

Micro-chimney and thermosiphon die-level cooling

MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME

ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS

NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING

PIEZOELECTRIC FAN, COOLING DEVICE CONTAINING SAME, AND METHOD OF CO...

MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATU...

APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE

MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING

MULTI-LAYER PIEZOELECTRIC ACTUATORS WITH CONDUCTIVE POLYMER ELECTRODES

Method and system to cool memory

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...

INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH MANIFOLD MEMB...

Preventing burst-related hazards in microelectronic cooling systems

Method, apparatus and system for carbon nanotube wick structures

Cooling mechanism for stacked die package, and method of manufactur...