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Patents Grants
last 30 patents
Information
Patent Grant
Methods and apparatus for processing a substrate
Patent number
12,138,742
Issue date
Nov 12, 2024
Applied Materials, Inc.
Prayudi Lianto
B24 - GRINDING POLISHING
Information
Patent Grant
Methods, systems, and apparatus for tape-frame substrate cleaning a...
Patent number
12,087,571
Issue date
Sep 10, 2024
Applied Materials, Inc.
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate for radio frequency applications
Patent number
12,051,653
Issue date
Jul 30, 2024
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
Patent number
12,048,948
Issue date
Jul 30, 2024
Applied Materials, Inc.
Yueh Sheng Ow
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Methods and apparatus for processing a substrate
Patent number
12,020,992
Issue date
Jun 25, 2024
Applied Materials, Inc.
Prayudi Lianto
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus for environmental control of dies and substrates for hybr...
Patent number
12,001,193
Issue date
Jun 4, 2024
Applied Materials, Inc.
Ying Wang
G05 - CONTROLLING REGULATING
Information
Patent Grant
Methods for forming alignment marks
Patent number
11,899,376
Issue date
Feb 13, 2024
Applied Materials, Inc.
Prayudi Lianto
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Methods of TSV formation for advanced packaging
Patent number
11,854,886
Issue date
Dec 26, 2023
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods, systems, and apparatus for tape-frame substrate cleaning a...
Patent number
11,837,464
Issue date
Dec 5, 2023
Applied Materials, Inc.
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate having magnetic core inductor
Patent number
11,791,094
Issue date
Oct 17, 2023
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,715,700
Issue date
Aug 1, 2023
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,476,202
Issue date
Oct 18, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for controlling warpage in wafer level packag...
Patent number
11,421,316
Issue date
Aug 23, 2022
Applied Materials, Inc.
Prayudi Lianto
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Reconstituted substrate for radio frequency applications
Patent number
11,417,605
Issue date
Aug 16, 2022
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming through-silicon vias in substrates for advanced...
Patent number
11,404,318
Issue date
Aug 2, 2022
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,398,433
Issue date
Jul 26, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a magnetic core on a substrate
Patent number
11,373,803
Issue date
Jun 28, 2022
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of thinning silicon on epoxy mold compound for radio freque...
Patent number
11,355,358
Issue date
Jun 7, 2022
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fine redistribution interconnect formation for advanced p...
Patent number
11,342,256
Issue date
May 24, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for bonding substrates
Patent number
11,309,278
Issue date
Apr 19, 2022
Applied Materials, Inc.
Prayudi Lianto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and apparatus for backside via reveal processing
Patent number
11,289,387
Issue date
Mar 29, 2022
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,264,333
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming vias in polymer layers
Patent number
10,636,696
Issue date
Apr 28, 2020
Applied Materials, Inc.
Yu Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for semiconductor package processing
Patent number
10,515,927
Issue date
Dec 24, 2019
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for 3D MIM capacitor package processing
Patent number
10,475,735
Issue date
Nov 12, 2019
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Slurry for polishing of integrated circuit packaging
Patent number
10,319,601
Issue date
Jun 11, 2019
Applied Materials, Inc.
Ranga Rao Arnepalli
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method and apparatus for wafer level packaging
Patent number
10,276,424
Issue date
Apr 30, 2019
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of redistribution layer formation for advanced packaging app...
Patent number
10,229,827
Issue date
Mar 12, 2019
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of reconstituted substrate formation for advanced packaging...
Patent number
10,211,072
Issue date
Feb 19, 2019
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuits with deep and ultra shallow trench isolations a...
Patent number
10,062,710
Issue date
Aug 28, 2018
GLOBALFOUNDRIES Singapore Pte. Ltd.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
Publication number
20250062129
Publication date
Feb 20, 2025
Applied Materials, Inc.
Yin Wei LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
Publication number
20240404960
Publication date
Dec 5, 2024
Applied Materials, Inc.
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR SUBSTRATE CLEANING IN STACK-DIE HYBRID BON...
Publication number
20240390950
Publication date
Nov 28, 2024
Applied Materials, Inc.
Ke ZHENG
B08 - CLEANING
Information
Patent Application
EMBEDDING REDISTRIBUTION LAYER METAL TRACES IN A POLYMERIC DIELECTRIC
Publication number
20240379411
Publication date
Nov 14, 2024
Applied Materials, Inc.
Peng SOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Multi-layer Die Stacking with Die-to-Wafer Bonding
Publication number
20240266319
Publication date
Aug 8, 2024
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon (Si) Dry Etch for Die-to-Wafer Thinning
Publication number
20240213028
Publication date
Jun 27, 2024
Applied Materials, Inc.
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PROCESS FLOWS FOR HYBRID BONDING
Publication number
20240170443
Publication date
May 23, 2024
Ruiping WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective Deposition of Thin Films with Improved Stability
Publication number
20240110284
Publication date
Apr 4, 2024
Applied Materials, Inc.
Lulu XIONG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL
Publication number
20240096664
Publication date
Mar 21, 2024
Ruiping WANG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
Publication number
20240087958
Publication date
Mar 14, 2024
Applied Materials, Inc.
Peng SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, AND APPARATUS FOR TAPE-FRAME SUBSTRATE CLEANING A...
Publication number
20240071745
Publication date
Feb 29, 2024
Ying WANG
B08 - CLEANING
Information
Patent Application
METHODS FOR FORMING ALIGNMENT MARKS
Publication number
20240069448
Publication date
Feb 29, 2024
Applied Materials, Inc.
Prayudi LIANTO
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20240021533
Publication date
Jan 18, 2024
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR ENVIRONMENTAL CONTROL OF DIES AND SUBSTRATES FOR HYBR...
Publication number
20230288916
Publication date
Sep 14, 2023
Ying WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MACHINE LEARNING & INTEGRATED METROLOGY FOR RUN-TO-RUN OPTIMIZATION...
Publication number
20230274987
Publication date
Aug 31, 2023
Ruiping WANG
G05 - CONTROLLING REGULATING
Information
Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
Publication number
20230260955
Publication date
Aug 17, 2023
Ying WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Publication number
20230238287
Publication date
Jul 27, 2023
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, AND APPARATUS FOR TAPE-FRAME SUBSTRATE CLEANING A...
Publication number
20230215722
Publication date
Jul 6, 2023
Ying WANG
B08 - CLEANING
Information
Patent Application
WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
Publication number
20230100863
Publication date
Mar 30, 2023
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...
Publication number
20230064183
Publication date
Mar 2, 2023
Applied Materials, Inc.
Suketu Arun Parikh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE POWER RAIL TO DEEP VIAS
Publication number
20230068312
Publication date
Mar 2, 2023
Applied Materials, Inc.
Suketu Arun Parikh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ULTRA THINNING OF WAFER
Publication number
20230061392
Publication date
Mar 2, 2023
Applied Materials, Inc.
Suketu Arun Parikh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR MINIMIZING VOIDS FOR CHIP ON WAFER COMPON...
Publication number
20230045597
Publication date
Feb 9, 2023
Applied Materials, Inc.
Ying WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
Publication number
20220359409
Publication date
Nov 10, 2022
Applied Materials, Inc.
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
Publication number
20220328354
Publication date
Oct 13, 2022
Applied Materials, Inc.
Peng SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Publication number
20220258304
Publication date
Aug 18, 2022
National University of Singapore
Prayudi LIANTO
G01 - MEASURING TESTING
Information
Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Publication number
20220208996
Publication date
Jun 30, 2022
Shubneesh BATRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING THROUGH-SILICON VIAS IN SUBSTRATES FOR ADVANCED...
Publication number
20220165621
Publication date
May 26, 2022
Applied Materials, Inc.
Peng SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING
Publication number
20220037216
Publication date
Feb 3, 2022
Applied Materials, Inc.
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20210257307
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS