Hai Cong

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing integrated circuits using isotropic and an...
- Patent number 10,847,711
- Issue date Nov 24, 2020
- EVERSPIN TECHNOLOGIES, INC.
- Sarin A. Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated two-terminal device with logic device for embedded appli...
- Patent number 10,608,046
- Issue date Mar 31, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wanbing Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor with improved time-dependent dielec...
- Patent number 10,510,825
- Issue date Dec 17, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zhehui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic random access memory with logic device having l...
- Patent number 10,461,247
- Issue date Oct 29, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated two-terminal device with logic device for embedded appli...
- Patent number 10,446,607
- Issue date Oct 15, 2019
- GLOBALFOUNDARIES SINGAPORE PTE. LTD.
- Wanbing Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removal of hard mask
- Patent number 10,115,625
- Issue date Oct 30, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CD control
- Patent number 10,103,097
- Issue date Oct 16, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic random access memory with logic device having l...
- Patent number 9,972,775
- Issue date May 15, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a via contact
- Patent number 9,805,971
- Issue date Oct 31, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Rui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual encapsulation integration scheme for fabricating integrated ci...
- Patent number 9,564,575
- Issue date Feb 7, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch bias control
- Patent number 9,520,299
- Issue date Dec 13, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wanbing Yi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
TSV without zero alignment marks
- Patent number 9,437,550
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shunqiang Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 9,230,886
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect for semiconductor device
- Patent number 8,987,134
- Issue date Mar 24, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zhehui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 8,940,637
- Issue date Jan 27, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CD control
- Patent number 8,836,139
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer profile engineering using films with continuously increased...
- Patent number 8,828,858
- Issue date Sep 9, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of fabrication thereof
- Patent number 8,546,873
- Issue date Oct 1, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jinping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of eNVM, RMG, and HKMG modules
- Patent number 8,518,775
- Issue date Aug 27, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step-like spacer profile
- Patent number 8,492,236
- Issue date Jul 23, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing with reduced line end shortening ratio
- Patent number 8,394,724
- Issue date Mar 12, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hai Cong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Critical dimension for trench and vias
- Patent number 8,293,545
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hai Cong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of fabrication thereof
- Patent number 8,058,123
- Issue date Nov 15, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jinping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing silicide defects in integrated circuits
- Patent number 7,960,283
- Issue date Jun 14, 2011
- Chartered Semiconductor Manufacturing, Ltd.
- Jeff Jianhui Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system employing sacrificial spacers
- Patent number 7,892,900
- Issue date Feb 22, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film etching method and semiconductor device fabrication using...
- Patent number 7,879,732
- Issue date Feb 1, 2011
- Chartered Semiconductor Manufacturing Ltd.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing silicide defects in integrated circuits
- Patent number 7,745,320
- Issue date Jun 29, 2010
- Chartered Semiconductor Manufacturing, Ltd.
- Jeff Jianhui Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to control dual damascene trench etch profile and trench dep...
- Patent number 7,247,555
- Issue date Jul 24, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Hai Cong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...
- Publication number 20190326352
- Publication date Oct 24, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wanbing YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING INTEGRATED CIRCUITS USING ISOTROPIC AND AN...
- Publication number 20190173004
- Publication date Jun 6, 2019
- EVERSPIN TECHNOLOGIES, INC.
- Sarin A. DESHPANDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH IMPROVED TIME-DEPENDENT DIELEC...
- Publication number 20190123130
- Publication date Apr 25, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Zhehui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC RANDOM ACCESS MEMORY WITH LOGIC DEVICE HAVING L...
- Publication number 20180233663
- Publication date Aug 16, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Danny Pak-Chum SHUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVAL OF HARD MASK
- Publication number 20180190537
- Publication date Jul 5, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...
- Publication number 20180182810
- Publication date Jun 28, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wanbing YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE CONTACTS
- Publication number 20160276213
- Publication date Sep 22, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Rui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC RANDOM ACCESS MEMORY WITH LOGIC DEVICE HAVING L...
- Publication number 20160268336
- Publication date Sep 15, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Danny Pak-Chum SHUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH BIAS CONTROL
- Publication number 20160189971
- Publication date Jun 30, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wanbing Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ENCAPSULATION INTEGRATION SCHEME FOR FABRICATING INTEGRATED CI...
- Publication number 20160190432
- Publication date Jun 30, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH NONVOLATILE MEMORY...
- Publication number 20150349095
- Publication date Dec 3, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chiew Wah Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV WITHOUT ZERO ALIGNMENT MARKS
- Publication number 20150170994
- Publication date Jun 18, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shunqiang GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20150137359
- Publication date May 21, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CD CONTROL
- Publication number 20140374920
- Publication date Dec 25, 2014
- Zheng ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CD CONTROL
- Publication number 20140110855
- Publication date Apr 24, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Zheng ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20140008810
- Publication date Jan 9, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20130328201
- Publication date Dec 12, 2013
- Zhehui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...
- Publication number 20130187202
- Publication date Jul 25, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEP-LIKE SPACER PROFILE
- Publication number 20130181259
- Publication date Jul 18, 2013
- Global Foundries Singapore PTE. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF eNVM, RMG, AND HKMG MODULES
- Publication number 20130082318
- Publication date Apr 4, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FABRICATION THEREOF
- Publication number 20120012940
- Publication date Jan 19, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jinping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS
- Publication number 20100267236
- Publication date Oct 21, 2010
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jianhui YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS
- Publication number 20090289309
- Publication date Nov 26, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Jianhui YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING SACRIFICIAL SPACERS
- Publication number 20090250762
- Publication date Oct 8, 2009
- Chartered Semiconductor Manufacturing LTD.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM ETCHING METHOD AND SEMICONDUCTOR DEVICE FABRICATION USING...
- Publication number 20090156010
- Publication date Jun 18, 2009
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FABRICATION THEREOF
- Publication number 20090140292
- Publication date Jun 4, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Jinping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRITICAL DIMENSION FOR TRENCH AND VIAS
- Publication number 20090108257
- Publication date Apr 30, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Hai Cong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing with Reduced Line End Shortening Ratio
- Publication number 20080054477
- Publication date Mar 6, 2008
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Hai CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method to control dual damascene trench etch profile and tren...
- Publication number 20050170625
- Publication date Aug 4, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Hai Cong
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods of manufacturing integrated circuits using isotropic and an...

Integrated two-terminal device with logic device for embedded appli...

Metal-insulator-metal capacitor with improved time-dependent dielec...

Integrated magnetic random access memory with logic device having l...

Integrated two-terminal device with logic device for embedded appli...

Methods for removal of hard mask

CD control

Integrated magnetic random access memory with logic device having l...

Method of forming a via contact

Dual encapsulation integration scheme for fabricating integrated ci...

Etch bias control

TSV without zero alignment marks

Method for forming through silicon via with wafer backside protection

Reliable interconnect for semiconductor device

Method for forming through silicon via with wafer backside protection

CD control

Spacer profile engineering using films with continuously increased...

Integrated circuit and method of fabrication thereof

Integration of eNVM, RMG, and HKMG modules

Step-like spacer profile

Processing with reduced line end shortening ratio

Critical dimension for trench and vias

Integrated circuit and method of fabrication thereof

Method for reducing silicide defects in integrated circuits

Integrated circuit system employing sacrificial spacers

Thin film etching method and semiconductor device fabrication using...

Method for reducing silicide defects in integrated circuits

Method to control dual damascene trench etch profile and trench dep...

Patents Applicationslast 30 patents

INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...

METHODS OF MANUFACTURING INTEGRATED CIRCUITS USING ISOTROPIC AND AN...

METAL-INSULATOR-METAL CAPACITOR WITH IMPROVED TIME-DEPENDENT DIELEC...

INTEGRATED MAGNETIC RANDOM ACCESS MEMORY WITH LOGIC DEVICE HAVING L...

METHODS FOR REMOVAL OF HARD MASK

INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...

RELIABLE CONTACTS

INTEGRATED MAGNETIC RANDOM ACCESS MEMORY WITH LOGIC DEVICE HAVING L...

ETCH BIAS CONTROL

DUAL ENCAPSULATION INTEGRATION SCHEME FOR FABRICATING INTEGRATED CI...

METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH NONVOLATILE MEMORY...

TSV WITHOUT ZERO ALIGNMENT MARKS

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

CD CONTROL

CD CONTROL

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE

SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...

STEP-LIKE SPACER PROFILE

INTEGRATION OF eNVM, RMG, AND HKMG MODULES

INTEGRATED CIRCUIT AND METHOD OF FABRICATION THEREOF

METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS

METHOD FOR REDUCING SILICIDE DEFECTS IN INTEGRATED CIRCUITS

INTEGRATED CIRCUIT SYSTEM EMPLOYING SACRIFICIAL SPACERS

THIN FILM ETCHING METHOD AND SEMICONDUCTOR DEVICE FABRICATION USING...

INTEGRATED CIRCUIT AND METHOD OF FABRICATION THEREOF

CRITICAL DIMENSION FOR TRENCH AND VIAS

Processing with Reduced Line End Shortening Ratio

Novel method to control dual damascene trench etch profile and tren...