Heng-Sheng Huang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and chip package unit
- Patent number 11,973,010
- Issue date Apr 30, 2024
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of vertical heat conduction elements attached to metal film
- Patent number 11,469,162
- Issue date Oct 11, 2022
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing method of a hard mask
- Patent number 8,232,152
- Issue date Jul 31, 2012
- United Microelectronics Corp.
- Che-Hua Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring an effective channel length of a MOSFET
- Patent number 6,750,673
- Issue date Jun 15, 2004
- United Microelectronics Corp.
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring effective gate channel length during C-V method
- Patent number 6,514,778
- Issue date Feb 4, 2003
- United Microelectronics Corp.
- Heng-Seng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing gate terminal
- Patent number 6,197,642
- Issue date Mar 6, 2001
- United Microelectronics Corp.
- Wen-Kuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for spacer
- Patent number 6,165,913
- Issue date Dec 26, 2000
- United Microelectronics Corp.
- Tony Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
STI process for eliminating kink effect
- Patent number 6,153,478
- Issue date Nov 28, 2000
- United Microelectronics Corp.
- Tony Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure of a semiconductor device having an air gap
- Patent number 6,064,107
- Issue date May 16, 2000
- United Microelectronics Corp.
- Wen-Kuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shallow trench isolation
- Patent number 6,057,208
- Issue date May 2, 2000
- United Microelectronics Corp.
- Tony Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET device with two spacers
- Patent number 6,043,545
- Issue date Mar 28, 2000
- United Microelectronics Corp.
- H. C. Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with a gate-side air-gap...
- Patent number 6,015,746
- Issue date Jan 18, 2000
- United Microelectronics Corp.
- Wen-Kuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a barrier layer
- Patent number 6,008,118
- Issue date Dec 28, 1999
- United Microelectronics Corp.
- Wen-Kuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing etch removal rate of silicon oxynitride
- Patent number 6,004,632
- Issue date Dec 21, 1999
- United Microelectronics Corp.
- Shih-Ying Hsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing very narrow buried bit lines for non-volatile...
- Patent number 5,998,287
- Issue date Dec 7, 1999
- United Microelectronics Corp.
- Heng Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM capacitor process
- Patent number 5,989,956
- Issue date Nov 23, 1999
- United Microelectronics Corp.
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 5,985,717
- Issue date Nov 16, 1999
- United Microelectronics Corp.
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming gate oxide layers of various predefined thicknesses
- Patent number 5,926,729
- Issue date Jul 20, 1999
- United Microelectronics Corp.
- Meng-Jin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a self-aligned silicide MOSFET
- Patent number 5,920,783
- Issue date Jul 6, 1999
- United Microelectronics Corp.
- H. C. Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a shallow trench isolation structure
- Patent number 5,918,131
- Issue date Jun 29, 1999
- United Microelectronics Corp.
- Shih-Ying Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rugged polysilicon process for DRAM capacitors
- Patent number 5,837,579
- Issue date Nov 17, 1998
- United Microelectronics Corporation
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data sensing apparatus of a read only memory device
- Patent number 5,684,417
- Issue date Nov 4, 1997
- United Microelectronics Corporation
- Heng-Sheng Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Process for fabricating capacitor cells in dynamic random access me...
- Patent number 5,672,534
- Issue date Sep 30, 1997
- United Microelectronics Corporation
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating multi-level read-only memory device
- Patent number 5,668,029
- Issue date Sep 16, 1997
- United Microelectronics Corporation
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring the current leakage of a dynamic random access...
- Patent number 5,659,511
- Issue date Aug 19, 1997
- United Microelectronics Corporation
- Heng-Sheng Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
High coupling ratio flash memory cell
- Patent number 5,637,896
- Issue date Jun 10, 1997
- United Microelectronics Corporation
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply voltage detector
- Patent number 5,572,147
- Issue date Nov 5, 1996
- United Microelectronics Corporation
- Heng-Sheng Huang
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacture of high coupling ratio flash memory cell
- Patent number 5,480,819
- Issue date Jan 2, 1996
- United Microelectronics Corporation
- Heng-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing high density conductive lines
- Patent number 5,429,988
- Issue date Jul 4, 1995
- United Microelectronics Corporation
- Heng Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing non-volatile memory devices having closely sp...
- Patent number 5,378,649
- Issue date Jan 3, 1995
- United Microelectronics Corporation
- Heng S. Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20240234264
- Publication date Jul 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND PACKAGE METHOD
- Publication number 20240203840
- Publication date Jun 20, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Shih-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230163042
- Publication date May 25, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT
- Publication number 20230131821
- Publication date Apr 27, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND PACKAGING METHOD
- Publication number 20230098393
- Publication date Mar 30, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD
- Publication number 20220367309
- Publication date Nov 17, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE
- Publication number 20220208628
- Publication date Jun 30, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Shih-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220181237
- Publication date Jun 9, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220181238
- Publication date Jun 9, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220157622
- Publication date May 19, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING METHOD OF A HARD MASK
- Publication number 20120070952
- Publication date Mar 22, 2012
- United Microelectronics Corp.
- Che-Hua HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for measuring effective gate channel length during C-V method
- Publication number 20020102752
- Publication date Aug 1, 2002
- Heng-Seng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing inductor
- Publication number 20020066175
- Publication date Jun 6, 2002
- Heng-sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS

Heng-Sheng Huang

Person

Patents Grantslast 30 patents

Chip packaging method and chip package unit

Plurality of vertical heat conduction elements attached to metal film

Removing method of a hard mask

Method for measuring an effective channel length of a MOSFET

Method for measuring effective gate channel length during C-V method

Method for manufacturing gate terminal

Manufacturing method for spacer

STI process for eliminating kink effect

Gate structure of a semiconductor device having an air gap

Method of forming shallow trench isolation

MOSFET device with two spacers

Method of fabricating semiconductor device with a gate-side air-gap...

Method of fabricating a barrier layer

Method for increasing etch removal rate of silicon oxynitride

Process for producing very narrow buried bit lines for non-volatile...

DRAM capacitor process

Method of fabricating a semiconductor device

Method for forming gate oxide layers of various predefined thicknesses

Method of fabricating a self-aligned silicide MOSFET

Method of manufacturing a shallow trench isolation structure

Rugged polysilicon process for DRAM capacitors

Data sensing apparatus of a read only memory device

Process for fabricating capacitor cells in dynamic random access me...

Process for fabricating multi-level read-only memory device

Method for measuring the current leakage of a dynamic random access...

High coupling ratio flash memory cell

Power supply voltage detector

Method of manufacture of high coupling ratio flash memory cell

Process for producing high density conductive lines

Process for producing non-volatile memory devices having closely sp...

Patents Applicationslast 30 patents

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

LEAD FRAME AND PACKAGE METHOD

PACKAGE STRUCTURE AND PACKAGING METHOD

HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT

LEAD FRAME AND PACKAGING METHOD

CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD

CHIP PACKAGING STRUCTURE

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

REMOVING METHOD OF A HARD MASK

Method for measuring effective gate channel length during C-V method

Method of manufacturing inductor