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Hsinchu City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Pre-process before cutting a wafer and method of cutting a wafer
Patent number
7,211,500
Issue date
May 1, 2007
United Microelectronics Corp.
Kuo-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing wafer level chip scale package structure
Patent number
7,170,167
Issue date
Jan 30, 2007
United Microelectronics Corp.
Min-Chih Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser repair operation
Patent number
6,794,606
Issue date
Sep 21, 2004
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser repair operation
Patent number
6,667,195
Issue date
Dec 23, 2003
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser repair operation
Patent number
6,664,142
Issue date
Dec 16, 2003
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad structure of semiconductor device having improved bonda...
Patent number
6,455,943
Issue date
Sep 24, 2002
United Microelectronics Corp.
Shing-Ren Sheu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cross grid array package structure and method of manufacture
Patent number
6,424,025
Issue date
Jul 23, 2002
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad on a semiconductor chip
Patent number
6,388,326
Issue date
May 14, 2002
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a bonding pad on a semiconductor chip
Patent number
6,372,621
Issue date
Apr 16, 2002
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor package
Patent number
6,316,727
Issue date
Nov 13, 2001
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip
Patent number
6,297,561
Issue date
Oct 2, 2001
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of testing and packaging a semiconductor chip
Patent number
6,251,694
Issue date
Jun 26, 2001
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench style bump and application of the same
Patent number
6,228,689
Issue date
May 8, 2001
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cross grid array package structure and method of manufacture
Patent number
6,190,938
Issue date
Feb 20, 2001
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of testing a ball grid array IC
Patent number
6,121,063
Issue date
Sep 19, 2000
United Microelectronics Corp.
Hermen Liu
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
Pre-process before cutting a wafer and method of cutting a wafer
Publication number
20060073676
Publication date
Apr 6, 2006
Kuo-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE
Publication number
20060065976
Publication date
Mar 30, 2006
Min-Chih Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laser repair operation
Publication number
20030160036
Publication date
Aug 28, 2003
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laser repair operation
Publication number
20030036211
Publication date
Feb 20, 2003
United Microelectronics Corp.
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laser repair operation
Publication number
20030027379
Publication date
Feb 6, 2003
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding pad on a semiconductor chip
Publication number
20010009297
Publication date
Jul 26, 2001
Hermen Liu
H01 - BASIC ELECTRIC ELEMENTS