Hideaki Tsugane

Person

Fussa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device and sputtering apparatus
- Patent number 9,748,081
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Takashi Hamaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dry cleaning silicon surface prior to forming self-aligne...
- Patent number 7,566,662
- Issue date Jul 28, 2009
- Renesas Technology Corp.
- Takuya Futase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device with a metallization structure
- Patent number 7,088,001
- Issue date Aug 8, 2006
- Hitachi, Ltd.
- Hiroshi Ashihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,780,757
- Issue date Aug 24, 2004
- Renesas Technology Corp.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multilayer metallization structure with n...
- Patent number 6,764,945
- Issue date Jul 20, 2004
- Renesas Technology Corp.
- Hiroshi Ashihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,583,049
- Issue date Jun 24, 2003
- Hitachi, Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,538,329
- Issue date Mar 25, 2003
- Hitachi, Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for production o...
- Patent number 6,372,554
- Issue date Apr 16, 2002
- Hitachi, Ltd.
- Keizo Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,300,237
- Issue date Oct 9, 2001
- Hitachi Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor integrated circuit device having in...
- Patent number 5,904,556
- Issue date May 18, 1999
- Hitachi, Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS
- Publication number 20170345629
- Publication date Nov 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Takashi HAMAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS
- Publication number 20160086779
- Publication date Mar 24, 2016
- RENESAS ELECTRONICS CORPORATION
- Takashi HAMAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20070238321
- Publication date Oct 11, 2007
- Takuya Futase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method for making the same
- Publication number 20040235289
- Publication date Nov 25, 2004
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device with a metallization structure
- Publication number 20040207095
- Publication date Oct 21, 2004
- Hiroshi Ashihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20030199161
- Publication date Oct 23, 2003
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method for making the same
- Publication number 20020115281
- Publication date Aug 22, 2002
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and fabrication method for...
- Publication number 20020098670
- Publication date Jul 25, 2002
- Hiroshi Ashihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method for making the same
- Publication number 20020019124
- Publication date Feb 14, 2002
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Hideaki Tsugane

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device and sputtering apparatus

Method of dry cleaning silicon surface prior to forming self-aligne...

Semiconductor integrated circuit device with a metallization structure

Semiconductor integrated circuit device and method for making the same

Method of manufacturing a multilayer metallization structure with n...

Semiconductor integrated circuit device and method for making the same

Semiconductor integrated circuit device and method for making the same

Semiconductor integrated circuit device and method for production o...

Semiconductor integrated circuit device and method for making the same

Method for making semiconductor integrated circuit device having in...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor integrated circuit device and method for making the same

Semiconductor integrated circuit device with a metallization structure

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor integrated circuit device and method for making the same

Semiconductor integrated circuit device and fabrication method for...

Semiconductor integrated circuit device and method for making the same