Number | Date | Country | Kind |
---|---|---|---|
7-002551 | Jan 1995 | JPX |
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4017886 | Tomono et al. | Apr 1977 | |
4782380 | Shankar et al. | Nov 1988 | |
4994410 | Sun et al. | Feb 1991 | |
5143865 | Hideshima et al. | Sep 1992 | |
5407861 | Marangon et al. | Apr 1995 | |
5420070 | Matsuura et al. | May 1995 | |
5529955 | Hibino et al. | Jun 1996 | |
5567647 | Takahashi | Oct 1996 | |
5614765 | Avanzino et al. | Mar 1997 | |
5635763 | Inoue et al. | Jun 1997 |
Entry |
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Talieh, et al., "Novel Method for Aluminum Planarization for Submicron High Aspect Ratio Contacts", Jun. 8, 1993 VMIC conference, pp. 211-213. |
"An Advanced Multilevel Interconnection Technology for 0.35 Micron High Performance Devices" (1994) pp. 36-43. |