Hidehiro Nakamura

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
CO2 concentration reducing device
- Patent number 10,456,731
- Issue date Oct 29, 2019
- Hitachi Chemical Company, Ltd.
- Kohei Yoshikawa
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Exhaust-gas treatment equipment and gas-capture-material deteriorat...
- Patent number 10,456,743
- Issue date Oct 29, 2019
- Hitachi Chemical Company, Ltd.
- Kohei Yoshikawa
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
CO2 removal device
- Patent number 10,035,099
- Issue date Jul 31, 2018
- Hitachi Chemical Company, Ltd.
- Kouhei Yoshikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Concave connector substrate, method of manufacturing the same, meas...
- Patent number 8,839,513
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor, sensor system, portable sensor system, method of analyzing...
- Patent number 8,648,605
- Issue date Feb 11, 2014
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Concave connector substrate, method of manufacturing the same, meas...
- Patent number 8,535,623
- Issue date Sep 17, 2013
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection board, and multi-layer wiring board, substrate for semic...
- Patent number 8,028,402
- Issue date Oct 4, 2011
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for inserting wiring board, and method for manufacturing...
- Patent number 7,874,848
- Issue date Jan 25, 2011
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 7,704,799
- Issue date Apr 27, 2010
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 7,205,645
- Issue date Apr 17, 2007
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the fabrication of wiring board for electrical tests
- Patent number 6,568,073
- Issue date May 27, 2003
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board for electrical tests with bumps having polymeric coating
- Patent number 6,133,534
- Issue date Oct 17, 2000
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density wired circuit board using insulated wires
- Patent number 4,791,238
- Issue date Dec 13, 1988
- Hitachi Chemical Company, Ltd.
- Masao Kanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
AIR CONDITIONER, AIR CONDITIONING SYSTEM, METHOD FOR REMOVING CARBO...
- Publication number 20190301754
- Publication date Oct 3, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro AOSHIMA
- F24 - HEATING RANGES VENTILATING
Information Patent Application
ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, CARBON DIOXIDE REMOV...
- Publication number 20190262795
- Publication date Aug 29, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro AOSHIMA
- F24 - HEATING RANGES VENTILATING
Information Patent Application
ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, DEVICE FOR REMOVING...
- Publication number 20190255509
- Publication date Aug 22, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro AOSHIMA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, CARBON DIOXIDE REMOV...
- Publication number 20190217241
- Publication date Jul 18, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro AOSHIMA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ADSORBENT, METHOD FOR PRODUCING SAME, METHOD FOR REMOVING CARBON DI...
- Publication number 20190217242
- Publication date Jul 18, 2019
- Hitachi Chemical Company, Ltd.
- Toshikatsu SHIMAZAKI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ADSORBENT AND METHOD FOR PRODUCING SAME, METHOD FOR REMOVING CARBON...
- Publication number 20190201832
- Publication date Jul 4, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro AOSHIMA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, DEVICE FOR REMOVING...
- Publication number 20190151821
- Publication date May 23, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro AOSHIMA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Carbon Dioxide Separation/Recovery Device, Combustion System Using...
- Publication number 20190022572
- Publication date Jan 24, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Kohei YOSHIKAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
EXHAUST-GAS TREATMENT EQUIPMENT AND GAS-CAPTURE-MATERIAL DETERIORAT...
- Publication number 20180250629
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Kohei YOSHIKAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CO2 CONCENTRATION REDUCING DEVICE
- Publication number 20180021717
- Publication date Jan 25, 2018
- Hitachi Chemical Company, Ltd.
- Kohei YOSHIKAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CO2 REMOVAL DEVICE
- Publication number 20170014750
- Publication date Jan 19, 2017
- Hitachi Chemical Company, Ltd.
- Kouhei YOSHIKAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CARBON-DIOXIDE RECOVERY APPARATUS, AND CARBON-DIOXIDE RECOVERY METHOD
- Publication number 20160220943
- Publication date Aug 4, 2016
- Hitachi Chemical Company, Ltd.
- Kouhei YOSHIKAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CARBON-DIOXIDE CAPTURING MATERIAL, AND CARBON-DIOXIDE RECOVERY APPA...
- Publication number 20160199808
- Publication date Jul 14, 2016
- Hitachi Chemical Company, Ltd.
- Kouhei YOSHIKAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SENSOR, SENSOR SYSTEM, PORTABLE SENSOR SYSTEM, METHOD OF ANALYZING...
- Publication number 20140158555
- Publication date Jun 12, 2014
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Hidehiro NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEAS...
- Publication number 20130318786
- Publication date Dec 5, 2013
- Hitachi Chemical Company, Ltd.
- Hidehiro NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
Concave connector substrate, method of manufacturing the same, meas...
- Publication number 20100263462
- Publication date Oct 21, 2010
- Hidehiro NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
SENSOR, SENSOR SYSTEM, PORTABLE SENSOR SYSTEM, METHOD OF ANALYZING...
- Publication number 20100253361
- Publication date Oct 7, 2010
- Hidehiro Nakamura
- G01 - MEASURING TESTING
Information Patent Application
CONNECTOR FOR INSERTING WIRING BOARD, AND METHOD FOR MANUFACTURING...
- Publication number 20100136803
- Publication date Jun 3, 2010
- Hitachi Chemical Company, Ltd.
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection board, and multi-layer wiring board, substrate for semic...
- Publication number 20090008141
- Publication date Jan 8, 2009
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080289868
- Publication date Nov 27, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080010819
- Publication date Jan 17, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...
- Publication number 20070161228
- Publication date Jul 12, 2007
- HITACHI CHEMICAL CO., Ltd.
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection substrate, multi-layer wiring board using the connection...
- Publication number 20060162956
- Publication date Jul 27, 2006
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and method of manufacturing wir...
- Publication number 20030141596
- Publication date Jul 31, 2003
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hidehiro Nakamura

Person

Patents Grantslast 30 patents

CO2 concentration reducing device

Exhaust-gas treatment equipment and gas-capture-material deteriorat...

CO2 removal device

Concave connector substrate, method of manufacturing the same, meas...

Sensor, sensor system, portable sensor system, method of analyzing...

Concave connector substrate, method of manufacturing the same, meas...

Connection board, and multi-layer wiring board, substrate for semic...

Connector for inserting wiring board, and method for manufacturing...

Method of manufacturing wiring substrate

Wiring board, semiconductor device, and method of manufacturing wir...

Process for the fabrication of wiring board for electrical tests

Substrate for holding a chip of semi-conductor package, semi-conduc...

Wiring board for electrical tests with bumps having polymeric coating

Substrate for holding a chip of semi-conductor package, semi-conduc...

High-density wired circuit board using insulated wires

Patents Applicationslast 30 patents

AIR CONDITIONER, AIR CONDITIONING SYSTEM, METHOD FOR REMOVING CARBO...

ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, CARBON DIOXIDE REMOV...

ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, DEVICE FOR REMOVING...

ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, CARBON DIOXIDE REMOV...

ADSORBENT, METHOD FOR PRODUCING SAME, METHOD FOR REMOVING CARBON DI...

ADSORBENT AND METHOD FOR PRODUCING SAME, METHOD FOR REMOVING CARBON...

ADSORBENT, METHOD FOR REMOVING CARBON DIOXIDE, DEVICE FOR REMOVING...

Carbon Dioxide Separation/Recovery Device, Combustion System Using...

EXHAUST-GAS TREATMENT EQUIPMENT AND GAS-CAPTURE-MATERIAL DETERIORAT...

CO2 CONCENTRATION REDUCING DEVICE

CO2 REMOVAL DEVICE

CARBON-DIOXIDE RECOVERY APPARATUS, AND CARBON-DIOXIDE RECOVERY METHOD

CARBON-DIOXIDE CAPTURING MATERIAL, AND CARBON-DIOXIDE RECOVERY APPA...

SENSOR, SENSOR SYSTEM, PORTABLE SENSOR SYSTEM, METHOD OF ANALYZING...

CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEAS...

Concave connector substrate, method of manufacturing the same, meas...

SENSOR, SENSOR SYSTEM, PORTABLE SENSOR SYSTEM, METHOD OF ANALYZING...

CONNECTOR FOR INSERTING WIRING BOARD, AND METHOD FOR MANUFACTURING...

Connection board, and multi-layer wiring board, substrate for semic...

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...

Connection substrate, multi-layer wiring board using the connection...

Wiring board, semiconductor device, and method of manufacturing wir...