Hideya Murai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,975,150
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Functional element built-in substrate and wiring substrate
- Patent number 8,929,090
- Issue date Jan 6, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element-embedded substrate, and method of manufacturi...
- Patent number 8,810,008
- Issue date Aug 19, 2014
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in semiconductor element
- Patent number 8,766,440
- Issue date Jul 1, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element-embedded wiring substrate
- Patent number 8,710,639
- Issue date Apr 29, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,569,892
- Issue date Oct 29, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,536,691
- Issue date Sep 17, 2013
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,344,498
- Issue date Jan 1, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,304,915
- Issue date Nov 6, 2012
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including an LSI chip and a method for manufac...
- Patent number 8,043,953
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,035,217
- Issue date Oct 11, 2011
- NEC Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,999,401
- Issue date Aug 16, 2011
- NEC Corporation
- Hideya Murai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring board, semiconductor device using wiring board and their man...
- Patent number 7,911,038
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 7,816,782
- Issue date Oct 19, 2010
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 7,674,989
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,566,834
- Issue date Jul 28, 2009
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-plane-switching liquid crystal display unit
- Patent number 7,495,734
- Issue date Feb 24, 2009
- NEC Corporation
- Teruaki Suzuki
- G02 - OPTICS
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,397,000
- Issue date Jul 8, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,348,673
- Issue date Mar 25, 2008
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet material and wiring board
- Patent number 7,294,393
- Issue date Nov 13, 2007
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-plane switching liquid crystal display unit having tinting compe...
- Patent number 6,987,551
- Issue date Jan 17, 2006
- NEC Corporation
- Teruaki Suzuki
- G02 - OPTICS
Information Patent Grant
In-plane-switching liquid crystal display unit having tinting compe...
- Patent number 6,583,839
- Issue date Jun 24, 2003
- NEC Corporation
- Teruaki Suzuki
- G02 - OPTICS
Information Patent Grant
Liquid crystal display with a liquid crystal orientation controllin...
- Patent number 6,466,293
- Issue date Oct 15, 2002
- NEC Corporation
- Masayoshi Suzuki
- G02 - OPTICS
Information Patent Grant
Liquid crystal display device
- Patent number 6,456,352
- Issue date Sep 24, 2002
- NEC Corporation
- Hiroaki Matsuyama
- G02 - OPTICS
Information Patent Grant
Liquid crystal display apparatus
- Patent number 6,300,996
- Issue date Oct 9, 2001
- NEC Coporation
- Hiroaki Matsuyama
- G02 - OPTICS
Information Patent Grant
Liquid crystal display with a liquid crystal orientation controllin...
- Patent number 6,256,082
- Issue date Jul 3, 2001
- NEC Corporation
- Masayoshi Suzuki
- G02 - OPTICS
Information Patent Grant
Multiple domain-divided twisted nematic liquid crystal display with...
- Patent number 6,195,144
- Issue date Feb 27, 2001
- NEC Corporation
- Hideya Murai
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE
- Publication number 20150053474
- Publication date Feb 26, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140367863
- Publication date Dec 18, 2014
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140024177
- Publication date Jan 23, 2014
- NEC Corporation
- KENTARO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE
- Publication number 20130127037
- Publication date May 23, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIMEDIA PROVIDING SERVICE
- Publication number 20130087927
- Publication date Apr 11, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20130026632
- Publication date Jan 31, 2013
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...
- Publication number 20130009325
- Publication date Jan 10, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT
- Publication number 20120319254
- Publication date Dec 20, 2012
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE
- Publication number 20120300425
- Publication date Nov 29, 2012
- NEC Corporation
- Yoshiki Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120153501
- Publication date Jun 21, 2012
- Renesas Electronics Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110281401
- Publication date Nov 17, 2011
- RENESAS ELECTRONICS CORPORATION
- Kentaro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20110215478
- Publication date Sep 8, 2011
- NEC Corporation
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110175213
- Publication date Jul 21, 2011
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110121445
- Publication date May 26, 2011
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...
- Publication number 20110003472
- Publication date Jan 6, 2011
- NEC Corporation
- Hideya MURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20100314778
- Publication date Dec 16, 2010
- NEC Corporation
- Hideya Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100244231
- Publication date Sep 30, 2010
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...
- Publication number 20100232127
- Publication date Sep 16, 2010
- NEC ELECTRONICS CORPORATION
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20100103634
- Publication date Apr 29, 2010
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...
- Publication number 20090315190
- Publication date Dec 24, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090294951
- Publication date Dec 3, 2009
- NEC CORPORATION
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090283895
- Publication date Nov 19, 2009
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHO...
- Publication number 20090046441
- Publication date Feb 19, 2009
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20090026636
- Publication date Jan 29, 2009
- NEC Corporation
- Hideya MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Producing Same
- Publication number 20090001604
- Publication date Jan 1, 2009
- Daisuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080303136
- Publication date Dec 11, 2008
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20080258283
- Publication date Oct 23, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and method for manufacturing the same
- Publication number 20060283629
- Publication date Dec 21, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method for manufacturing same, and semiconductor package
- Publication number 20060283625
- Publication date Dec 21, 2006
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hideya Murai

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Functional element built-in substrate and wiring substrate

Semiconductor element-embedded substrate, and method of manufacturi...

Wiring board with built-in semiconductor element

Semiconductor element-embedded wiring substrate

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Method of manufacturing a wiring board

Semiconductor device

Semiconductor device and method for manufacturing the same

Wiring substrate for mounting semiconductors, method of manufacturi...

Semiconductor device including an LSI chip and a method for manufac...

Semiconductor device and method for manufacturing same

Semiconductor device and method of manufacturing same

Wiring board, semiconductor device using wiring board and their man...

Wiring board, method for manufacturing same, and semiconductor package

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring board and method for manufacturing the same

Wiring board and semiconductor package using the same

In-plane-switching liquid crystal display unit

Wiring board and semiconductor package using the same

Semiconductor device

Sheet material and wiring board

In-plane switching liquid crystal display unit having tinting compe...

In-plane-switching liquid crystal display unit having tinting compe...

Liquid crystal display with a liquid crystal orientation controllin...

Liquid crystal display device

Liquid crystal display apparatus

Liquid crystal display with a liquid crystal orientation controllin...

Multiple domain-divided twisted nematic liquid crystal display with...

Patents Applicationslast 30 patents

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE

MULTIMEDIA PROVIDING SERVICE

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...

WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A WIRING BOARD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING...

WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Semiconductor Package and Method for Producing Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

Wiring board and method for manufacturing the same

Wiring board, method for manufacturing same, and semiconductor package