Hirokazu Ezawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,673,147
- Issue date Jun 6, 2017
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fan-in and fan-out redistribution layers
- Patent number 9,396,998
- Issue date Jul 19, 2016
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,287,225
- Issue date Mar 15, 2016
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with underbump metallization structure and integrate...
- Patent number 9,190,373
- Issue date Nov 17, 2015
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of connecting with multi-profile bumps
- Patent number 8,703,600
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,704,367
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 8,569,181
- Issue date Oct 29, 2013
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 8,314,491
- Issue date Nov 20, 2012
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device from which damage la...
- Patent number 8,232,197
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 8,063,487
- Issue date Nov 22, 2011
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral processing method and method of manufacturing a semicond...
- Patent number 7,638,439
- Issue date Dec 29, 2009
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device from which damage la...
- Patent number 7,605,076
- Issue date Oct 20, 2009
- Kabushiki Kaisha Toshiba
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 7,531,876
- Issue date May 12, 2009
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 7,473,628
- Issue date Jan 6, 2009
- Kabushiki Kaisha Toshiba
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,399,706
- Issue date Jul 15, 2008
- Kabushiki Kaisha Toshiba
- Seiichi Omoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating element movement bonding method for semiconductor components
- Patent number 7,238,919
- Issue date Jul 3, 2007
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless Ni-B plating liquid, electronic device and method for m...
- Patent number 6,936,302
- Issue date Aug 30, 2005
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having semiconductor element with copper pad m...
- Patent number 6,798,050
- Issue date Sep 28, 2004
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,734,568
- Issue date May 11, 2004
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless Ni—B plating liquid, electronic device and meth...
- Patent number 6,706,422
- Issue date Mar 16, 2004
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor integrated circuit device having interposer and metho...
- Patent number 6,661,088
- Issue date Dec 9, 2003
- Kabushiki Kaisha Toshiba
- Takashi Yoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device having a protruding...
- Patent number 6,605,522
- Issue date Aug 12, 2003
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and fabricating method thereof
- Patent number 6,569,752
- Issue date May 27, 2003
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number RE37882
- Issue date Oct 15, 2002
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,407,453
- Issue date Jun 18, 2002
- Kabushiki Kaisha Toshiba
- Tadayoshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protruding bump electrode
- Patent number 6,404,051
- Issue date Jun 11, 2002
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for producing electronic elements
- Patent number 5,992,725
- Issue date Nov 30, 1999
- Kabushiki Kaisha Toshiba
- Hidemitsu Egawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,885,891
- Issue date Mar 23, 1999
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling small holes or covering small recesses in the su...
- Patent number 5,705,230
- Issue date Jan 6, 1998
- Ebara Corporation
- Toru Matanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring in groove
- Patent number 5,656,542
- Issue date Aug 12, 1997
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160141247
- Publication date May 19, 2016
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150262877
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150028493
- Publication date Jan 29, 2015
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120068334
- Publication date Mar 22, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120056320
- Publication date Mar 8, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120049367
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120049356
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20120028463
- Publication date Feb 2, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20110049707
- Publication date Mar 3, 2011
- Kabushiki Kaisha Toshiba
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110024901
- Publication date Feb 3, 2011
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20100301472
- Publication date Dec 2, 2010
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device from which damage la...
- Publication number 20100003816
- Publication date Jan 7, 2010
- Kabushiki Kaisha Toshiba
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20090200664
- Publication date Aug 13, 2009
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20090134516
- Publication date May 28, 2009
- KABUSHIKI KAISHA TOSHIBA,
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080272494
- Publication date Nov 6, 2008
- Kabushiki Kaisha Toshiba
- Seiichi Omoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peripheral processing method and method of manufacturing a semicond...
- Publication number 20070264822
- Publication date Nov 15, 2007
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and bonding apparatus
- Publication number 20060207985
- Publication date Sep 21, 2006
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20060189114
- Publication date Aug 24, 2006
- Kabushiki Kaisha Toshiba
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device from which damage la...
- Publication number 20060189145
- Publication date Aug 24, 2006
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support plate, holding method of thin wafer, and manufacturin...
- Publication number 20060102290
- Publication date May 18, 2006
- Susumu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20060071271
- Publication date Apr 6, 2006
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060055050
- Publication date Mar 16, 2006
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20050186793
- Publication date Aug 25, 2005
- Seiichi Omoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040251550
- Publication date Dec 16, 2004
- Takashi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20040238955
- Publication date Dec 2, 2004
- KABUSHIKI KAISHA TOSHIBA
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Ni-B plating liquid, electronic device and method for m...
- Publication number 20040182277
- Publication date Sep 23, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030052409
- Publication date Mar 20, 2003
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020140099
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Kaori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Ni-B plating liquid, electronic device and method for m...
- Publication number 20020100391
- Publication date Aug 1, 2002
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hirokazu Ezawa

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device having fan-in and fan-out redistribution layers

Semiconductor device and manufacturing method thereof

Bump structure with underbump metallization structure and integrate...

Electronic component and method of connecting with multi-profile bumps

Semiconductor device and manufacturing method of semiconductor device

Manufacturing method of semiconductor apparatus and semiconductor a...

Manufacturing method of semiconductor device and semiconductor device

Method of manufacturing a semiconductor device from which damage la...

Manufacturing method of semiconductor apparatus and semiconductor a...

Peripheral processing method and method of manufacturing a semicond...

Method of manufacturing a semiconductor device from which damage la...

Semiconductor device having power semiconductor elements

Method of manufacturing semiconductor device and semiconductor device

Manufacturing method of semiconductor device

Heating element movement bonding method for semiconductor components

Electroless Ni-B plating liquid, electronic device and method for m...

Semiconductor device having semiconductor element with copper pad m...

Semiconductor device and method of manufacturing the same

Electroless Ni&#x02014;B plating liquid, electronic device and meth...

Semiconductor integrated circuit device having interposer and metho...

Method of manufacturing a semiconductor device having a protruding...

Semiconductor element and fabricating method thereof

Semiconductor device manufacturing method

Semiconductor device and method of manufacturing the same

Semiconductor device having a protruding bump electrode

Apparatus and method for producing electronic elements

Method of manufacturing semiconductor device

Method for filling small holes or covering small recesses in the su...

Method for manufacturing wiring in groove

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Method of manufacturing a semiconductor device from which damage la...

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device

Peripheral processing method and method of manufacturing a semicond...

Bonding method and bonding apparatus

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing a semiconductor device from which damage la...

Wafer support plate, holding method of thin wafer, and manufacturin...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Electroless Ni-B plating liquid, electronic device and method for m...

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Electroless Ni-B plating liquid, electronic device and method for m...

Electroless Ni—B plating liquid, electronic device and meth...