Hirokazu Honda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 10,098,179
- Issue date Oct 9, 2018
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 9,368,474
- Issue date Jun 14, 2016
- J-DEVICES CORPORATION
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,362,262
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,117,814
- Issue date Aug 25, 2015
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Warp-suppressed semiconductor device
- Patent number 8,324,718
- Issue date Dec 4, 2012
- Renesas Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,304,905
- Issue date Nov 6, 2012
- Renesas Electronics Corporation
- Satoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection board, semiconductor device having the s...
- Patent number 8,008,130
- Issue date Aug 30, 2011
- Renesas Electronics Corporation
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device using wiring board and their man...
- Patent number 7,911,038
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 7,816,782
- Issue date Oct 19, 2010
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Warp-suppressed semiconductor device
- Patent number 7,728,440
- Issue date Jun 1, 2010
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 7,674,989
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,566,834
- Issue date Jul 28, 2009
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a connecting conductor and wirings of a semicondu...
- Patent number 7,498,249
- Issue date Mar 3, 2009
- NEC Electronics Corp.
- Shinichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,397,000
- Issue date Jul 8, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,348,673
- Issue date Mar 25, 2008
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,233,066
- Issue date Jun 19, 2007
- NEC Electronics Corporation
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection board, semiconductor device having the s...
- Patent number 7,217,999
- Issue date May 15, 2007
- NEC Electronics Corporation
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,138,064
- Issue date Nov 21, 2006
- NEC Electronics Corporation
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip type semiconductor device and method of manufacturing the...
- Patent number 7,074,650
- Issue date Jul 11, 2006
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,060,604
- Issue date Jun 13, 2006
- NGK Spark Plug Co., Ltd.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flip-chip semiconductor device with a str...
- Patent number 6,767,761
- Issue date Jul 27, 2004
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable flip-chip semiconductor device
- Patent number 6,734,566
- Issue date May 11, 2004
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,723,627
- Issue date Apr 20, 2004
- NEC Corporation
- Syuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip type semiconductor device and method of manufacturing the...
- Patent number 6,696,764
- Issue date Feb 24, 2004
- NEC Electronics Corporation
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flip-chip semiconductor device with a str...
- Patent number 6,696,317
- Issue date Feb 24, 2004
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20160079204
- Publication date Mar 17, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160027715
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150371934
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Hirokazu HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150333048
- Publication date Nov 19, 2015
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361410
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140329476
- Publication date Nov 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120025371
- Publication date Feb 2, 2012
- RENESAS ELECTRONICS CORPORATION
- Satoshi MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...
- Publication number 20110003472
- Publication date Jan 6, 2011
- NEC Corporation
- Hideya MURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...
- Publication number 20100232127
- Publication date Sep 16, 2010
- NEC ELECTRONICS CORPORATION
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARP-SUPPRESSED SEMICONDUCTOR DEVICE
- Publication number 20100230797
- Publication date Sep 16, 2010
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...
- Publication number 20090315190
- Publication date Dec 24, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHO...
- Publication number 20090046441
- Publication date Feb 19, 2009
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DE...
- Publication number 20090017613
- Publication date Jan 15, 2009
- NEC ELECTRONICS CORPORATION
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20080258283
- Publication date Oct 23, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having stress alleviating portion positioned a...
- Publication number 20080203564
- Publication date Aug 28, 2008
- NEC Electronics Corporation
- Souichirou Motoyoshi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer interconnection board, semiconductor device having the s...
- Publication number 20070184604
- Publication date Aug 9, 2007
- NEC ELECTRONICS CORPORATION
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect substrate, semiconductor device, and method of manufac...
- Publication number 20070178686
- Publication date Aug 2, 2007
- NEC ELECTRONICS CORPORATION
- Hirokazu Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming a connecting conductor and wirings of a semicondu...
- Publication number 20070020907
- Publication date Jan 25, 2007
- NEC Corporation
- Shinichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method for manufacturing the same
- Publication number 20060283629
- Publication date Dec 21, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method for manufacturing same, and semiconductor package
- Publication number 20060283625
- Publication date Dec 21, 2006
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20060189125
- Publication date Aug 24, 2006
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20060012029
- Publication date Jan 19, 2006
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate for mounting semiconductors, method of manufacturi...
- Publication number 20060012048
- Publication date Jan 19, 2006
- NEC CORPORATION AND NEC ELECTRONICS CORPORATION
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and semiconductor package using the same
- Publication number 20050252682
- Publication date Nov 17, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chip type semiconductor device and method of manufacturing the...
- Publication number 20040169287
- Publication date Sep 2, 2004
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a connecting conductor and wirings of a semicondu...
- Publication number 20040154163
- Publication date Aug 12, 2004
- Shinichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warp-suppressed semiconductor device
- Publication number 20040150118
- Publication date Aug 5, 2004
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board, semiconductor package, base insulating film,...
- Publication number 20040089470
- Publication date May 13, 2004
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a flip-chip semiconductor device with a str...
- Publication number 20040082101
- Publication date Apr 29, 2004
- NEC Electronics Corporation
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS

Hirokazu Honda

Person

Patents Grantslast 30 patents

Electronic device

Semiconductor package

Manufacturing method for semiconductor device

Heat sink in the aperture of substrate

Semiconductor device

Semiconductor device

Method of manufacturing a wiring board

Warp-suppressed semiconductor device

Semiconductor device

Wiring substrate for mounting semiconductors, method of manufacturi...

Multilayer interconnection board, semiconductor device having the s...

Wiring board, semiconductor device using wiring board and their man...

Wiring board, method for manufacturing same, and semiconductor package

Wiring substrate for mounting semiconductors, method of manufacturi...

Warp-suppressed semiconductor device

Wiring board and method for manufacturing the same

Wiring board and semiconductor package using the same

Method of forming a connecting conductor and wirings of a semicondu...

Wiring board and semiconductor package using the same

Semiconductor device

Multilayer wiring substrate, and method of producing same

Multilayer interconnection board, semiconductor device having the s...

Semiconductor device and method of manufacturing the same

Flip-chip type semiconductor device and method of manufacturing the...

Multilayer wiring substrate, and method of producing same

Method of manufacturing a flip-chip semiconductor device with a str...

Recyclable flip-chip semiconductor device

Method for manufacturing semiconductor devices

Flip chip type semiconductor device and method of manufacturing the...

Method of manufacturing a flip-chip semiconductor device with a str...

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A WIRING BOARD

WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...

WARP-SUPPRESSED SEMICONDUCTOR DEVICE

WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHO...

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DE...

WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor device having stress alleviating portion positioned a...

Multilayer interconnection board, semiconductor device having the s...

Interconnect substrate, semiconductor device, and method of manufac...

Method of forming a connecting conductor and wirings of a semicondu...

Wiring board and method for manufacturing the same

Wiring board, method for manufacturing same, and semiconductor package

Multilayer wiring substrate, and method of producing same

Semiconductor device

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring board and semiconductor package using the same

Flip-chip type semiconductor device and method of manufacturing the...

Method of forming a connecting conductor and wirings of a semicondu...

Warp-suppressed semiconductor device

Printed circuit board, semiconductor package, base insulating film,...

Method of manufacturing a flip-chip semiconductor device with a str...