Claims
- 1. A method for manufacturing a flip-chip type semiconductor device, comprising the steps of:forming a plurality of pad electrodes on a semiconductor substrate; forming an insulating stress-absorbing resin layer on said semiconductor substrate, said insulating stress-absorbing resin layer having openings corresponding to said pad electrodes; adhering a resin coated conductive layer on said semiconductor substrate, said resin coated conductive layer comprising a photosensitive insulating stress-absorbing resin layer made of thermosetting resin laminated by a first conductive layer, said insulating stress-absorbing resin layer having openings corresponding to said pad electrodes; forming a second conductive layer having a pattern on said first conductive layer; perforating said first conductive layer by using said second conductive layer as a mask, so that said first and second conductive layers have openings; irradiating said photosensitive insulating stress-absorbing resin layer with light by using an exposure mask and said patterned first and second conductive layers so that irradiated portions of said photosensitive stress-absorbing resin layer are hardened; developing said photosensitive insulating stress-absorbing resin layer so that unirradiated portions of said photosensitive insulating stress-absorbing resin layer are removed, so that said photosensitive insulating stress-absorbing resin layer has openings corresponding to said pad electrodes; forming flexible conductive members each filled in one of said openings and electrically connecting said first and second conductive layers to respective ones of said pad electrodes; and forming a plurality of metal bumps formed on said second conductive layer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-313684 |
Nov 1999 |
JP |
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CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
This application is a division of application Ser. No. 09/704,521, filed Nov. 3, 2000, now U.S. Pat. No. 6,696,317 and based on Japanese Patent Application No. 11-313684, filed Nov. 4, 1999, by Hirokazu HONDA. This application claims only subject matter disclosed in the parent application and therefore presents no new matter.
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