Ho-Yi Tsai

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and a substrate for packaging
- Patent number 10,679,932
- Issue date Jun 9, 2020
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a substrate for packaging
- Patent number 9,666,453
- Issue date May 30, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package using the same
- Patent number 9,368,467
- Issue date Jun 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection structure for semiconductor package
- Patent number 9,013,042
- Issue date Apr 21, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 8,895,366
- Issue date Nov 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Wen-Home Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,698,326
- Issue date Apr 15, 2014
- Silconware Precision Industries Co., Ltd.
- Wen-Home Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack structure of semiconductor packages
- Patent number 8,420,521
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating heat dissipation package structure
- Patent number 8,361,843
- Issue date Jan 29, 2013
- Siliconware Precision Industries Co., Ltd.
- Min-Shun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating semiconductor package structure and method for man...
- Patent number 8,008,769
- Issue date Aug 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic carrier board applicable to surface mount technology
- Patent number 7,889,511
- Issue date Feb 15, 2011
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of semiconductor packages and method for fabricatin...
- Patent number 7,855,443
- Issue date Dec 21, 2010
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic carrier board and package structure thereof
- Patent number 7,696,623
- Issue date Apr 13, 2010
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation semiconductor package
- Patent number 7,608,915
- Issue date Oct 27, 2009
- Siliconware Precision Industries Co., Ltd.
- Chun-Ming Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic carrier board applicable to surface mounted technology (...
- Patent number 7,573,722
- Issue date Aug 11, 2009
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor package with heat sink
- Patent number 7,371,617
- Issue date May 13, 2008
- Siliconware Precision Industries Co., Ltd.
- Ho-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor packages
- Patent number 7,348,211
- Issue date Mar 25, 2008
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure of semiconductor package and method for fabricating...
- Patent number 7,271,483
- Issue date Sep 18, 2007
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with reinforced under-support structure and me...
- Patent number 7,180,183
- Issue date Feb 20, 2007
- Siliconware Precision Industries Co., Ltd.
- Ho-Yi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground pad structure for preventing solder extrusion and semiconduc...
- Patent number 7,173,828
- Issue date Feb 6, 2007
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with heat sink and method for fabricating same
- Patent number 7,164,210
- Issue date Jan 16, 2007
- Siliconware Precision Industries Co., Ltd.
- Ho-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor packages
- Patent number 7,129,119
- Issue date Oct 31, 2006
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with EMI shielding
- Patent number 6,865,084
- Issue date Mar 8, 2005
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based semiconductor package for multi-media card
- Patent number 6,861,736
- Issue date Mar 1, 2005
- Siliconware Precision Industries Co., Ltd.
- Ming-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having vertically mounted passive devices und...
- Patent number 6,781,222
- Issue date Aug 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based semiconductor package for multi-media card
- Patent number 6,603,196
- Issue date Aug 5, 2003
- Siliconware Precision Industries Co., Ltd.
- Ming-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING
- Publication number 20170294371
- Publication date Oct 12, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140179067
- Publication date Jun 26, 2014
- Siliconware Precision Industries Co., Ltd.
- Wen-Home Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20140061928
- Publication date Mar 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20130341806
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING
- Publication number 20130299968
- Publication date Nov 14, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE
- Publication number 20110287587
- Publication date Nov 24, 2011
- Siliconware Precision Industries Co., Ltd.
- Min-Shun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STR...
- Publication number 20110287588
- Publication date Nov 24, 2011
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK STRUCTURE OF SEMICONDUCTOR PACKAGES
- Publication number 20110070697
- Publication date Mar 24, 2011
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF
- Publication number 20100170709
- Publication date Jul 8, 2010
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC CARRIER BOARD
- Publication number 20090288866
- Publication date Nov 26, 2009
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20090096115
- Publication date Apr 16, 2009
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation package structure and method for fabricating the same
- Publication number 20080308926
- Publication date Dec 18, 2008
- Siliconware Precision Industries Co., Ltd.
- Min-Shun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure and fabrication method thereof
- Publication number 20080283994
- Publication date Nov 20, 2008
- Siliconware Precision Industries Co., Ltd.
- Ho-Yi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat dissipation semiconductor package
- Publication number 20080277777
- Publication date Nov 13, 2008
- Siliconware Precision Industries Co., Ltd.
- Chun-Ming Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-dissipating semiconductor package structure and method for man...
- Publication number 20080258294
- Publication date Oct 23, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating method of semiconductor package and heat-dissipating st...
- Publication number 20080251910
- Publication date Oct 16, 2008
- Siliconware Precision Industries Co., Ltd.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor device and carrier applied the...
- Publication number 20080213942
- Publication date Sep 4, 2008
- Siliconware Precision Industries Co., Ltd.
- Min-Shun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating heat-dissipating package and heat-dissipatin...
- Publication number 20080157346
- Publication date Jul 3, 2008
- Siliconware Precision Industries Co., Ltd.
- Min-Shun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating semiconductor package and fabrication method therefor
- Publication number 20080122070
- Publication date May 29, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating semiconductor package and fabrication method therefor
- Publication number 20080122071
- Publication date May 29, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and fabrication method thereof
- Publication number 20080061451
- Publication date Mar 13, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Home Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating semiconductor package and heat dissipating structu...
- Publication number 20080017977
- Publication date Jan 24, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-dissipating package structure and fabrication method thereof
- Publication number 20080006933
- Publication date Jan 10, 2008
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating structure and method for fabricating the same
- Publication number 20070296079
- Publication date Dec 27, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, chip carrier structure thereof, and method f...
- Publication number 20070273019
- Publication date Nov 29, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack structure of semiconductor packages and method for fabricatin...
- Publication number 20070246811
- Publication date Oct 25, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20070202633
- Publication date Aug 30, 2007
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic carrier board
- Publication number 20070164084
- Publication date Jul 19, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic carrier board and package structure thereof
- Publication number 20070145561
- Publication date Jun 28, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating semiconductor packages, and structure and me...
- Publication number 20070141761
- Publication date Jun 21, 2007
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and a substrate for packaging

Semiconductor package and a substrate for packaging

Substrate structure and semiconductor package using the same

Interconnection structure for semiconductor package

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Method for fabricating stack structure of semiconductor packages

Method for fabricating heat dissipation package structure

Heat-dissipating semiconductor package structure and method for man...

Electronic carrier board applicable to surface mount technology

Stack structure of semiconductor packages and method for fabricatin...

Electronic carrier board and package structure thereof

Heat dissipation semiconductor package

Electronic carrier board applicable to surface mounted technology (...

Method for fabricating semiconductor package with heat sink

Method for fabricating semiconductor packages

Bump structure of semiconductor package and method for fabricating...

Semiconductor device with reinforced under-support structure and me...

Ground pad structure for preventing solder extrusion and semiconduc...

Semiconductor package with heat sink and method for fabricating same

Method for fabricating semiconductor packages

Thermally enhanced semiconductor package with EMI shielding

Leadframe-based semiconductor package for multi-media card

Semiconductor package having vertically mounted passive devices und...

Leadframe-based semiconductor package for multi-media card

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME

SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING

METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE

METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STR...

METHOD FOR FABRICATING STACK STRUCTURE OF SEMICONDUCTOR PACKAGES

ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF

ELECTRONIC CARRIER BOARD

Semiconductor package and method for fabricating the same

Heat dissipation package structure and method for fabricating the same

Stacked package structure and fabrication method thereof

Heat dissipation semiconductor package

Heat-dissipating semiconductor package structure and method for man...

Fabricating method of semiconductor package and heat-dissipating st...

Method for fabricating semiconductor device and carrier applied the...

Method for fabricating heat-dissipating package and heat-dissipatin...

Heat dissipating semiconductor package and fabrication method therefor

Heat dissipating semiconductor package and fabrication method therefor

Semiconductor package and fabrication method thereof

Heat dissipating semiconductor package and heat dissipating structu...

Heat-dissipating package structure and fabrication method thereof

Heat dissipating structure and method for fabricating the same

Semiconductor package, chip carrier structure thereof, and method f...

Stack structure of semiconductor packages and method for fabricatin...

Semiconductor package and method for fabricating the same

Electronic carrier board

Electronic carrier board and package structure thereof

Method for fabricating semiconductor packages, and structure and me...