Hoe Ku Jung

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Composition containing jetbead extracts
- Patent number 9,114,155
- Issue date Aug 25, 2015
- Korea Research Institute of Bioscience & Biotechnology
- Won Gon Kim
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Pharmaceutical composition for the prevention or treatment of a neu...
- Patent number 9,034,916
- Issue date May 19, 2015
- Korea Research Institute of Bioscience & Biotechnology
- Won Gon Kim
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit board with high-density circuit patterns
- Patent number 8,633,392
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 8,418,355
- Issue date Apr 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Duck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 8,124,880
- Issue date Feb 28, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board on chip package and manufacturing method thereof
- Patent number 8,003,439
- Issue date Aug 23, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 7,992,291
- Issue date Aug 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 7,937,833
- Issue date May 10, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a substrate with cavity
- Patent number 7,858,437
- Issue date Dec 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flexible printed circuit board manufacturing method for packa...
- Patent number 7,802,358
- Issue date Sep 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with cavity
- Patent number 7,562,446
- Issue date Jul 21, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board on chip package and manufacturing method thereof
- Patent number 7,550,316
- Issue date Jun 23, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board having landless via hole
- Patent number 7,516,545
- Issue date Apr 14, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with cavity
- Patent number 7,498,205
- Issue date Mar 3, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with cavity
- Patent number 7,494,844
- Issue date Feb 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BATTERY PACK FRAME, BATTERY RACK AND ENERGY STORAGE SYSTEM COMPRISI...
- Publication number 20230293920
- Publication date Sep 21, 2023
- LG ENERGY SOLUTION, LTD.
- Min-Seok KWON
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Application
COMPOSITION CONTAIING JETBEAD EXTRACTS
- Publication number 20140370132
- Publication date Dec 18, 2014
- Korea Research Institute of Bioscience and Biotechnology
- Won Gon Kim
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PHARMACEUTICAL COMPOSITION FOR THE PREVENTION OR TREATMENT OF A NEU...
- Publication number 20140142173
- Publication date May 22, 2014
- Won Gon Kim
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS
- Publication number 20120111607
- Publication date May 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with buried circuit pattern
- Publication number 20110259627
- Publication date Oct 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board on chip package
- Publication number 20110221074
- Publication date Sep 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of bottom substrate of package
- Publication number 20100255634
- Publication date Oct 7, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried pattern substrate
- Publication number 20090242238
- Publication date Oct 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rigid-flexible printed circuit board manufacturing method for packa...
- Publication number 20090233400
- Publication date Sep 17, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board on chip package and manufacturing method thereof
- Publication number 20090206468
- Publication date Aug 20, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and method for manufaturing thereof
- Publication number 20080264676
- Publication date Oct 30, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and manufacturing method thereof
- Publication number 20080101045
- Publication date May 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20080102410
- Publication date May 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Ji-Eun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming transcriptional circuit and method for manufactu...
- Publication number 20080098596
- Publication date May 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Duck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing circuit board
- Publication number 20080098597
- Publication date May 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bottom substrate of package on package and manufacturing method the...
- Publication number 20080006942
- Publication date Jan 10, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried pattern substrate and manufacturing method thereof
- Publication number 20080009128
- Publication date Jan 10, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of a package substrate
- Publication number 20070281390
- Publication date Dec 6, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board on chip package and manufacturing method thereof
- Publication number 20070210439
- Publication date Sep 13, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a substrate with cavity
- Publication number 20070190764
- Publication date Aug 16, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board having landless via hole
- Publication number 20070130761
- Publication date Jun 14, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing substrate with cavity
- Publication number 20070065988
- Publication date Mar 22, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing substrate with cavity
- Publication number 20070066045
- Publication date Mar 22, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hoe Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing substrate with cavity
- Publication number 20070065986
- Publication date Mar 22, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rigid-flexible printed circuit board for package on package and man...
- Publication number 20070059918
- Publication date Mar 15, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hoe Ku Jung

Person

Patents Grantslast 30 patents

Composition containing jetbead extracts

Pharmaceutical composition for the prevention or treatment of a neu...

Circuit board with high-density circuit patterns

Method for manufacturing circuit board

Circuit board and method for manufacturing thereof

Board on chip package and manufacturing method thereof

Method of manufacturing a circuit board

Method of manufacturing circuit board

Method for manufacturing a substrate with cavity

Rigid-flexible printed circuit board manufacturing method for packa...

Method for manufacturing substrate with cavity

Board on chip package and manufacturing method thereof

Method of manufacturing printed circuit board having landless via hole

Method for manufacturing substrate with cavity

Method for manufacturing substrate with cavity

Patents Applicationslast 30 patents

BATTERY PACK FRAME, BATTERY RACK AND ENERGY STORAGE SYSTEM COMPRISI...

COMPOSITION CONTAIING JETBEAD EXTRACTS

PHARMACEUTICAL COMPOSITION FOR THE PREVENTION OR TREATMENT OF A NEU...

CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS

Circuit board with buried circuit pattern

Board on chip package

Manufacturing method of bottom substrate of package

Buried pattern substrate

Rigid-flexible printed circuit board manufacturing method for packa...

Board on chip package and manufacturing method thereof

Circuit board and method for manufaturing thereof

Circuit board and manufacturing method thereof

Method of manufacturing printed circuit board

Method for forming transcriptional circuit and method for manufactu...

Method of manufacturing circuit board

Bottom substrate of package on package and manufacturing method the...

Buried pattern substrate and manufacturing method thereof

Manufacturing method of a package substrate

Board on chip package and manufacturing method thereof

Method for manufacturing a substrate with cavity

Method of manufacturing printed circuit board having landless via hole

Method for manufacturing substrate with cavity

Method for manufacturing substrate with cavity

Method for manufacturing substrate with cavity

Rigid-flexible printed circuit board for package on package and man...