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Holger Hubner
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Baldham, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Connecting element for a multi-chip module and multi-chip module
Patent number
9,301,396
Issue date
Mar 29, 2016
Osram GmbH
Holger Hübner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Protected chip stack
Patent number
7,436,072
Issue date
Oct 14, 2008
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for soldering contacts on semiconductor chips
Patent number
7,389,903
Issue date
Jun 24, 2008
Infineon Technologies AG
Robert Bergmann
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Component
Patent number
7,335,582
Issue date
Feb 26, 2008
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing chip stacks
Patent number
7,253,530
Issue date
Aug 7, 2007
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip stack
Patent number
7,229,851
Issue date
Jun 12, 2007
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component including a housing and a substrate
Patent number
6,930,383
Issue date
Aug 16, 2005
Infineon Technologies AG
Hans-Jürgen Hacke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for contact-connecting an electrical component to a substrat...
Patent number
6,915,945
Issue date
Jul 12, 2005
Infineon Technologies AG
Holger Hübner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component having a material reinforced contact area
Patent number
6,906,370
Issue date
Jun 14, 2005
Infineon Technologies AG
Holger Hübner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soldering agent for use in diffusion soldering processes, and metho...
Patent number
6,872,464
Issue date
Mar 29, 2005
Infineon Technologies AG
Holger Hübner
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for aligning structures on a semiconductor substrate
Patent number
6,709,949
Issue date
Mar 23, 2004
Infineon Technologies AG
Holger Hübner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit arrangement with a number of structural elements...
Patent number
6,597,053
Issue date
Jul 22, 2003
Siemens Aktiengesellschaft
Anton Anthofer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor testing apparatus
Patent number
5,969,534
Issue date
Oct 19, 1999
Siemens Aktiengesellschaft
Holger Hubner
G01 - MEASURING TESTING
Information
Patent Grant
Method for producing a three-dimensional circuit arrangement
Patent number
5,943,563
Issue date
Aug 24, 1999
Siemens Aktiengesellschaft
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component for vertical integration and manufacturing...
Patent number
5,930,596
Issue date
Jul 27, 1999
Siemens Aktiengesellschaft
Helmut Klose
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for production of a three-dimensional circuit arrangement
Patent number
5,902,118
Issue date
May 11, 1999
Siemens Aktiengesellschaft
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for filling contact holes using a doctor blade
Patent number
5,830,803
Issue date
Nov 3, 1998
Siemens Aktiengesellschaft
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a three-dimensional circuit arrangement
Patent number
5,706,578
Issue date
Jan 13, 1998
Siemens Aktiengesellschaft
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Connecting Element for a Multi-Chip Module and Multi-Chip Module
Publication number
20140291003
Publication date
Oct 2, 2014
OSRAM GMBH
Holger Hübner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for diffusion soldering
Publication number
20070205253
Publication date
Sep 6, 2007
Infineon Technologies AG
Holger Hubner
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Protected chip stack
Publication number
20060279002
Publication date
Dec 14, 2006
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing chip stacks
Publication number
20060055051
Publication date
Mar 16, 2006
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip stack
Publication number
20060001177
Publication date
Jan 5, 2006
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component
Publication number
20050121801
Publication date
Jun 9, 2005
Infineon Technologies AG
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device and method for soldering contacts on semiconductor chips
Publication number
20040240865
Publication date
Dec 2, 2004
Infineon Technologies AG
Robert Bergmann
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for contact-connecting an electrical component to a substrat...
Publication number
20040099366
Publication date
May 27, 2004
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Soldering agent for use in diffusion soldering processes, and metho...
Publication number
20040025976
Publication date
Feb 12, 2004
Holger Hubner
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for aligning structures on a semiconductor substrate
Publication number
20030171008
Publication date
Sep 11, 2003
Holger Hubner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component including a housing and a substrate
Publication number
20030116840
Publication date
Jun 26, 2003
Hans-Jurgen Hacke
H01 - BASIC ELECTRIC ELEMENTS