Number | Date | Country | Kind |
---|---|---|---|
44 00 532.6 | Jan 1994 | DEX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/DE95/00009 | 1/3/1995 | 7/10/1996 | 7/10/1996 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO95/19045 | 7/13/1995 |
Number | Name | Date | Kind |
---|---|---|---|
5468681 | Pasch | Nov 1995 | |
5547530 | Nakamura et al. | Aug 1996 | |
5587342 | Lin et al. | Dec 1996 |
Number | Date | Country |
---|---|---|
0435187 | Jul 1991 | EPX |
0610709 | Aug 1994 | EPX |
2644011 | Sep 1990 | FRX |
04-105353 | Apr 1992 | JPX |
WO 9214260 | Aug 1992 | WOX |
Entry |
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Patent Abstracts of Japan (E-1235), Jul. 16, 1992, No. 326, Manufacture of Semiconductor Device, Matsuchita Electric Ind Co Ltd., M. Nakatani, JP 4-97530 (30 Mar. 1992). |
Patent Abstracts of Japan (E-867), Dec. 27, 1989, No. 594, Method of Filling Through-Hole With Conductor Paste, Hitachi Ltd. K. Takashi et al., JP 12-48592 (04 Oct. 1989). |