Hormazdyar Minocher Dalal

Person

Milton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shielded semiconductor device structure
- Patent number 8,536,685
- Issue date Sep 17, 2013
- Semiconductor Components Industries, LLC
- Hormazdyar M. Dalal
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of forming a shielded semiconductor device and structure the...
- Patent number 8,129,266
- Issue date Mar 6, 2012
- Semiconductor Componenets Industries, LLC
- Hormazdyar M. Dalal
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Thick metal interconnect with metal pad caps at selective sites and...
- Patent number 7,947,592
- Issue date May 24, 2011
- Semiconductor Components Industries, LLC
- Hormazdyar Minocher Dalal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thick metal interconnect with metal pad caps at selective sites and...
- Patent number 7,800,239
- Issue date Sep 21, 2010
- Semiconductor Components Industries, LLC
- Hormazdyar Minocher Dalal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Edge seal for a semiconductor device
- Patent number 7,163,883
- Issue date Jan 16, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via-stud with improved reliability in copper metallurgy
- Patent number 6,972,209
- Issue date Dec 6, 2005
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an edge seal for a semiconductor device
- Patent number 6,734,090
- Issue date May 11, 2004
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level electronic package and method for making same
- Patent number 6,618,267
- Issue date Sep 9, 2003
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-aligned, lateral diffusion barrier in metal lines to eliminate...
- Patent number 6,597,067
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Glenn Allen Biery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnections with enhanced electromigration resistance a...
- Patent number 6,348,731
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Leon Ashley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming reflowed solder ball with low melting point meta...
- Patent number 6,344,234
- Issue date Feb 5, 2002
- International Business Machines Corportion
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming a capacitor with multi-level interconnection tec...
- Patent number 6,336,262
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Refractory metal capped low resistivity metal conductor lines and v...
- Patent number 6,323,554
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Rajiv V. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned composite insulator with sub-half-micron multilevel hi...
- Patent number 6,294,835
- Issue date Sep 25, 2001
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnections with enhanced electromigr...
- Patent number 6,287,954
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Leon Ashley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-quarter-micron copper interconnections with improved electromig...
- Patent number 6,258,710
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Hazara S. Rathore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowed solder ball with low melting point metal cap
- Patent number 6,259,159
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-free multi-layer conductor
- Patent number 6,203,926
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Umar Moez Uddin Ahmad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Refractory metal capped low resistivity metal conductor lines and vias
- Patent number 6,147,402
- Issue date Nov 14, 2000
- International Business Machines Corporation
- Rajiv V. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned composite insulator with sub-half-micron multilevel hi...
- Patent number 6,133,139
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnections with enhanced electromigr...
- Patent number 6,130,161
- Issue date Oct 10, 2000
- International Business Machines Corporation
- Leon Ashley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-quarter-micron copper interconnections with improved electromig...
- Patent number 6,069,068
- Issue date May 30, 2000
- International Business Machines Corporation
- Hazara S. Rathore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming features upon a substrate
- Patent number 6,051,273
- Issue date Apr 18, 2000
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing electrically fusible links in copper interconn...
- Patent number 6,033,939
- Issue date Mar 7, 2000
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-half-micron multi-level interconnection structure and process t...
- Patent number 5,981,374
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Refractory metal capped low resistivity metal conductor lines and vias
- Patent number 5,976,975
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Rajiv V. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making and laterally filling key hole structure for ultra...
- Patent number 5,976,970
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition mask and method for making the same
- Patent number 5,922,496
- Issue date Jul 13, 1999
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Refractory metal capped low resistivity metal conductor lines and vias
- Patent number 5,889,328
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Rajiv V. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multi-level interconnection technology
- Patent number 5,808,853
- Issue date Sep 15, 1998
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20120119340
- Publication date May 17, 2012
- Hormazdyar M. Dalal
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF FORMING A SHIELDED SEMICONDUCTOR DEVICE AND STRUCTURE THE...
- Publication number 20100006989
- Publication date Jan 14, 2010
- Hormazdyar M. Dalal
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Thick metal interconnect with metal pad caps at selective sites and...
- Publication number 20090152100
- Publication date Jun 18, 2009
- AMI Semiconductor, Inc.
- Hormazdyar Minocher Dalal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Thick metal interconnect with metal pad caps at selective sites and...
- Publication number 20090152725
- Publication date Jun 18, 2009
- AMI Semiconductor, Inc.
- Hormazdyar Minocher Dalal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20040101663
- Publication date May 27, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge seal for a semiconductor device
- Publication number 20040087078
- Publication date May 6, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge seal for a semiconductor device
- Publication number 20030157794
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...
- Publication number 20010013423
- Publication date Aug 16, 2001
- HORMAZDYAR M. DALAL
- H01 - BASIC ELECTRIC ELEMENTS

Hormazdyar Minocher Dalal

Person

Patents Grantslast 30 patents

Shielded semiconductor device structure

Method of forming a shielded semiconductor device and structure the...

Thick metal interconnect with metal pad caps at selective sites and...

Thick metal interconnect with metal pad caps at selective sites and...

Edge seal for a semiconductor device

Stacked via-stud with improved reliability in copper metallurgy

Method of making an edge seal for a semiconductor device

Multi-level electronic package and method for making same

Self-aligned, lateral diffusion barrier in metal lines to eliminate...

Copper interconnections with enhanced electromigration resistance a...

Method for forming reflowed solder ball with low melting point meta...

Process of forming a capacitor with multi-level interconnection tec...

Refractory metal capped low resistivity metal conductor lines and v...

Self-aligned composite insulator with sub-half-micron multilevel hi...

Method of forming copper interconnections with enhanced electromigr...

Sub-quarter-micron copper interconnections with improved electromig...

Reflowed solder ball with low melting point metal cap

Corrosion-free multi-layer conductor

Refractory metal capped low resistivity metal conductor lines and vias

Self-aligned composite insulator with sub-half-micron multilevel hi...

Method of forming copper interconnections with enhanced electromigr...

Sub-quarter-micron copper interconnections with improved electromig...

Method for forming features upon a substrate

Method for providing electrically fusible links in copper interconn...

Sub-half-micron multi-level interconnection structure and process t...

Refractory metal capped low resistivity metal conductor lines and vias

Method of making and laterally filling key hole structure for ultra...

Selective deposition mask and method for making the same

Refractory metal capped low resistivity metal conductor lines and vias

Capacitor with multi-level interconnection technology

Patents Applicationslast 30 patents

SHIELDED SEMICONDUCTOR DEVICE STRUCTURE

METHOD OF FORMING A SHIELDED SEMICONDUCTOR DEVICE AND STRUCTURE THE...

Thick metal interconnect with metal pad caps at selective sites and...

Thick metal interconnect with metal pad caps at selective sites and...

Stacked via-stud with improved reliability in copper metallurgy

Stacked via-stud with improved reliability in copper metallurgy

Edge seal for a semiconductor device

Edge seal for a semiconductor device

FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...