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Hosadurga Shobha
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Niskayuna, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming copper interconnect structure with manganese barr...
Patent number
11,804,405
Issue date
Oct 31, 2023
TESSERA LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside floating metal for increased capacitance
Patent number
11,756,887
Issue date
Sep 12, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming high carbon content flowable dielectric film with low proce...
Patent number
11,756,786
Issue date
Sep 12, 2023
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective ILD deposition for fully aligned via with airgap
Patent number
11,676,854
Issue date
Jun 13, 2023
TESSERA LLC
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier-less prefilled via formation
Patent number
11,621,189
Issue date
Apr 4, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer backside engineering for wafer stress control
Patent number
11,569,134
Issue date
Jan 31, 2023
International Business Machines Corporation
Nikhil Jain
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Skip via connection between metallization levels
Patent number
11,315,827
Issue date
Apr 26, 2022
International Business Machines Corporation
Huai Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper interconnect structure with manganese barrier layer
Patent number
11,232,983
Issue date
Jan 25, 2022
Tessera, Inc.
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
Patent number
11,177,167
Issue date
Nov 16, 2021
International Business Machines Corporation
Daniel Edelstein
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Trapezoidal interconnect at tight BEOL pitch
Patent number
11,177,162
Issue date
Nov 16, 2021
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnects with gouged vias
Patent number
11,177,169
Issue date
Nov 16, 2021
International Business Machines Corporation
Kenneth Chun Kuen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bottom barrier free interconnects without voids
Patent number
11,164,815
Issue date
Nov 2, 2021
International Business Machines Corporation
Kenneth Chun Kuen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier-less prefilled via formation
Patent number
11,152,257
Issue date
Oct 19, 2021
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid selective dielectric deposition for aligned via integration
Patent number
11,152,299
Issue date
Oct 19, 2021
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tall trenches for via chamferless and self forming barrier
Patent number
11,101,175
Issue date
Aug 24, 2021
International Business Machines Corporation
Yann Mignot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization interconnect structure formation
Patent number
11,056,426
Issue date
Jul 6, 2021
International Business Machines Corporation
Yann Mignot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective ILD deposition for fully aligned via with airgap
Patent number
10,964,588
Issue date
Mar 30, 2021
Tessera, Inc.
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure to construct cylindrical interconnects to redu...
Patent number
10,943,866
Issue date
Mar 9, 2021
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
Patent number
10,903,116
Issue date
Jan 26, 2021
International Business Machines Corporation
Joseph F. Maniscalco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques to improve critical dimension width and depth uniformity...
Patent number
10,832,945
Issue date
Nov 10, 2020
International Business Machines Corporation
Nicole Saulnier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure to construct cylindrical interconnects to redu...
Patent number
10,784,197
Issue date
Sep 22, 2020
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure
Patent number
10,770,347
Issue date
Sep 8, 2020
Tessera, Inc.
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with selective insulator for improved capacitance
Patent number
10,763,160
Issue date
Sep 1, 2020
International Business Machines Corporation
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition of dielectrics on ultra-low k dielectrics
Patent number
10,692,755
Issue date
Jun 23, 2020
International Business Machines Corporation
Hosadurga Shobha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitance reduction in sea of lines BEOL metallization
Patent number
10,679,934
Issue date
Jun 9, 2020
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-buried ULK field in BEOL structure
Patent number
10,679,892
Issue date
Jun 9, 2020
International Business Machines Corporation
Yann Mignot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective ILD deposition for fully aligned via with airgap
Patent number
10,651,078
Issue date
May 12, 2020
Tessera, Inc.
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
Patent number
10,643,890
Issue date
May 5, 2020
International Business Machines Corporation
Daniel Edelstein
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Dual-damascene formation with dielectric spacer and thin liner
Patent number
10,629,478
Issue date
Apr 21, 2020
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric gap fill evaluation for integrated circuits
Patent number
10,622,250
Issue date
Apr 14, 2020
International Business Machines Corporation
Isabel Cristina Chu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
Publication number
20240136253
Publication date
Apr 25, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...
Publication number
20240136287
Publication date
Apr 25, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
Publication number
20240113013
Publication date
Apr 4, 2024
International Business Machines Corporation
Huai Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
Publication number
20240096693
Publication date
Mar 21, 2024
TESSERA LLC
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY
Publication number
20240088036
Publication date
Mar 14, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL STRUCTURED BURIED RAIL
Publication number
20240079333
Publication date
Mar 7, 2024
International Business Machines Corporation
Huai Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TALL POWER LINES WITH ALIGNED SIGNAL WIRES
Publication number
20240079295
Publication date
Mar 7, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BACKSIDE DIELECTRIC FOR CLOCK AND POWER WIRES
Publication number
20240079325
Publication date
Mar 7, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING
Publication number
20240071929
Publication date
Feb 29, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BURIED POWER RAIL STRUCTURE WITH DUAL FRONT SIDE AND BACKSID...
Publication number
20240006314
Publication date
Jan 4, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
Publication number
20240006237
Publication date
Jan 4, 2024
Adeia Semiconductor Solutions LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER PLANES AND PASS-THROUGH VIAS
Publication number
20230420366
Publication date
Dec 28, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
Publication number
20230402378
Publication date
Dec 14, 2023
International Business Machines Corporation
Sagarika Mukesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SKIP-LEVEL TSV WITH HYBRID DIELECTRIC SCHEME FOR BACKSIDE POWER DEL...
Publication number
20230402381
Publication date
Dec 14, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE POWER PLANE
Publication number
20230369219
Publication date
Nov 16, 2023
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BEOL DIELECTRIC FOR INCREASED DECOUPLING CAPACITANCE
Publication number
20230260892
Publication date
Aug 17, 2023
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT INTERCONNECT STRUCTURE
Publication number
20230207330
Publication date
Jun 29, 2023
International Business Machines Corporation
Sagarika Mukesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS
Publication number
20230163039
Publication date
May 25, 2023
International Business Machines Corporation
Fee Li Lie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE DEPOSITION ON METALS USING POROUS LOW-K MATERIALS
Publication number
20230154757
Publication date
May 18, 2023
International Business Machines Corporation
Krystelle Lionti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETC...
Publication number
20230146512
Publication date
May 11, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Subtractive Skip-Level Power via Adjacent Recessed Damascene Signal...
Publication number
20230098433
Publication date
Mar 30, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TOP VIA PATTERNING USING METAL AS HARD MASK AND VIA CONDUCTOR
Publication number
20230067493
Publication date
Mar 2, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER DIELECTRIC STACK FOR DAMASCENE TOP-VIA INTEGRATION
Publication number
20230055600
Publication date
Feb 23, 2023
International Business Machines Corporation
Sagarika Mukesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE FLOATING METAL FOR INCREASED CAPACITANCE
Publication number
20220406717
Publication date
Dec 22, 2022
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
Publication number
20220115269
Publication date
Apr 14, 2022
Tessera, Inc.
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bottom Barrier Free Interconnects Without Voids
Publication number
20220028797
Publication date
Jan 27, 2022
International Business Machines Corporation
Kenneth Chun Kuen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Trapezoidal Interconnect at Tight BEOL Pitch
Publication number
20220013406
Publication date
Jan 13, 2022
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIER-LESS PREFILLED VIA FORMATION
Publication number
20210343589
Publication date
Nov 4, 2021
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BACKSIDE ENGINEERING FOR WAFER STRESS CONTROL
Publication number
20210320036
Publication date
Oct 14, 2021
International Business Machines Corporation
Nikhil JAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SELECTIVE DIELECTRIC DEPOSITION FOR ALIGNED VIA INTEGRATION
Publication number
20210280510
Publication date
Sep 9, 2021
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS