Hosadurga Shobha

Person

Niskayuna, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside floating metal for increased capacitance
- Patent number 11,756,887
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming high carbon content flowable dielectric film with low proce...
- Patent number 11,756,786
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside engineering for wafer stress control
- Patent number 11,569,134
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Nikhil Jain
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Skip via connection between metallization levels
- Patent number 11,315,827
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 11,177,167
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trapezoidal interconnect at tight BEOL pitch
- Patent number 11,177,162
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with gouged vias
- Patent number 11,177,169
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 11,164,815
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,152,257
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid selective dielectric deposition for aligned via integration
- Patent number 11,152,299
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall trenches for via chamferless and self forming barrier
- Patent number 11,101,175
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization interconnect structure formation
- Patent number 11,056,426
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 10,964,588
- Issue date Mar 30, 2021
- Tessera, Inc.
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to construct cylindrical interconnects to redu...
- Patent number 10,943,866
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,903,116
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to improve critical dimension width and depth uniformity...
- Patent number 10,832,945
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Nicole Saulnier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to construct cylindrical interconnects to redu...
- Patent number 10,784,197
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,770,347
- Issue date Sep 8, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selective insulator for improved capacitance
- Patent number 10,763,160
- Issue date Sep 1, 2020
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of dielectrics on ultra-low k dielectrics
- Patent number 10,692,755
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Hosadurga Shobha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction in sea of lines BEOL metallization
- Patent number 10,679,934
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-buried ULK field in BEOL structure
- Patent number 10,679,892
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 10,651,078
- Issue date May 12, 2020
- Tessera, Inc.
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 10,643,890
- Issue date May 5, 2020
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual-damascene formation with dielectric spacer and thin liner
- Patent number 10,629,478
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OFFSET VIA FORMATION FOR FLEXIBLE ROUTING
- Publication number 20240332165
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT
- Publication number 20240321687
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...
- Publication number 20240234316
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
- Publication number 20240234248
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER
- Publication number 20240203904
- Publication date Jun 20, 2024
- International Business Machines Corporation
- FEE LI LIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR POWER DELIVERY ON SEMICONDUCTOR DEVICE
- Publication number 20240204067
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER VIA WITH SIDEWALL SPACER
- Publication number 20240194585
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED SIGNAL LINE INTERCONNECT STRUCTURE
- Publication number 20240170395
- Publication date May 23, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP SPACER AND LOCAL INTERCONNECT CONFIGURATION WITH DIRECT BACK...
- Publication number 20240170545
- Publication date May 23, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACT...
- Publication number 20240162139
- Publication date May 16, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
- Publication number 20240136253
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...
- Publication number 20240136287
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
- Publication number 20240113013
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY
- Publication number 20240088036
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL STRUCTURED BURIED RAIL
- Publication number 20240079333
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL POWER LINES WITH ALIGNED SIGNAL WIRES
- Publication number 20240079295
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE DIELECTRIC FOR CLOCK AND POWER WIRES
- Publication number 20240079325
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING
- Publication number 20240071929
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BURIED POWER RAIL STRUCTURE WITH DUAL FRONT SIDE AND BACKSID...
- Publication number 20240006314
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PLANES AND PASS-THROUGH VIAS
- Publication number 20230420366
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP-LEVEL TSV WITH HYBRID DIELECTRIC SCHEME FOR BACKSIDE POWER DEL...
- Publication number 20230402381
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER PLANE
- Publication number 20230369219
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BEOL DIELECTRIC FOR INCREASED DECOUPLING CAPACITANCE
- Publication number 20230260892
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT INTERCONNECT STRUCTURE
- Publication number 20230207330
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS
- Publication number 20230163039
- Publication date May 25, 2023
- International Business Machines Corporation
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION ON METALS USING POROUS LOW-K MATERIALS
- Publication number 20230154757
- Publication date May 18, 2023
- International Business Machines Corporation
- Krystelle Lionti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETC...
- Publication number 20230146512
- Publication date May 11, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS

Hosadurga Shobha

Person

Patents Grantslast 30 patents

High aspect ratio buried power rail metallization

Method of forming copper interconnect structure with manganese barr...

Backside floating metal for increased capacitance

Forming high carbon content flowable dielectric film with low proce...

Selective ILD deposition for fully aligned via with airgap

Barrier-less prefilled via formation

Wafer backside engineering for wafer stress control

Skip via connection between metallization levels

Copper interconnect structure with manganese barrier layer

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Trapezoidal interconnect at tight BEOL pitch

Interconnects with gouged vias

Bottom barrier free interconnects without voids

Barrier-less prefilled via formation

Hybrid selective dielectric deposition for aligned via integration

Tall trenches for via chamferless and self forming barrier

Metallization interconnect structure formation

Selective ILD deposition for fully aligned via with airgap

Method and structure to construct cylindrical interconnects to redu...

Void-free metallic interconnect structures with self-formed diffusi...

Techniques to improve critical dimension width and depth uniformity...

Method and structure to construct cylindrical interconnects to redu...

Interconnect structure

Semiconductor device with selective insulator for improved capacitance

Selective deposition of dielectrics on ultra-low k dielectrics

Capacitance reduction in sea of lines BEOL metallization

Multi-buried ULK field in BEOL structure

Selective ILD deposition for fully aligned via with airgap

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Dual-damascene formation with dielectric spacer and thin liner

Patents Applicationslast 30 patents

OFFSET VIA FORMATION FOR FLEXIBLE ROUTING

BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT

Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER

CONTACT STRUCTURE FOR POWER DELIVERY ON SEMICONDUCTOR DEVICE

SUPER VIA WITH SIDEWALL SPACER

STAGGERED SIGNAL LINE INTERCONNECT STRUCTURE

AIRGAP SPACER AND LOCAL INTERCONNECT CONFIGURATION WITH DIRECT BACK...

METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACT...

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...

SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY

DUAL STRUCTURED BURIED RAIL

TALL POWER LINES WITH ALIGNED SIGNAL WIRES

HYBRID BACKSIDE DIELECTRIC FOR CLOCK AND POWER WIRES

DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING

HYBRID BURIED POWER RAIL STRUCTURE WITH DUAL FRONT SIDE AND BACKSID...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

POWER PLANES AND PASS-THROUGH VIAS

HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION

SKIP-LEVEL TSV WITH HYBRID DIELECTRIC SCHEME FOR BACKSIDE POWER DEL...

BACKSIDE POWER PLANE

HYBRID BEOL DIELECTRIC FOR INCREASED DECOUPLING CAPACITANCE

CIRCUIT INTERCONNECT STRUCTURE

DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS

SELECTIVE DEPOSITION ON METALS USING POROUS LOW-K MATERIALS

INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETC...