Hsien-Wen Hsu

Person

Lujhou City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having a back side protective scheme
- Patent number 7,687,923
- Issue date Mar 30, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-chips with side-by-side c...
- Patent number 7,525,185
- Issue date Apr 28, 2009
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for image sensor protection
- Patent number 7,335,870
- Issue date Feb 26, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacking die package structure for semiconductor devices and method...
- Publication number 20090127686
- Publication date May 21, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...
- Publication number 20090096098
- Publication date Apr 16, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...
- Publication number 20090096093
- Publication date Apr 16, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
- Publication number 20090039497
- Publication date Feb 12, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
- Publication number 20090039532
- Publication date Feb 12, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME
- Publication number 20080265462
- Publication date Oct 30, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self chip redistribution apparatus and method for the same
- Publication number 20080229574
- Publication date Sep 25, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package having multi-chips with side-by-side c...
- Publication number 20080230884
- Publication date Sep 25, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of semiconductor device package and method of the same
- Publication number 20080217761
- Publication date Sep 11, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND...
- Publication number 20080211075
- Publication date Sep 4, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chips package with reduced structure and method for forming t...
- Publication number 20080197469
- Publication date Aug 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CO...
- Publication number 20080197478
- Publication date Aug 21, 2008
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package with die receiving opening and method of the same
- Publication number 20080191333
- Publication date Aug 14, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND...
- Publication number 20080191335
- Publication date Aug 14, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module and the method of the same
- Publication number 20080173792
- Publication date Jul 24, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOL...
- Publication number 20080083980
- Publication date Apr 10, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP PACKAGE ARRAY
- Publication number 20080073774
- Publication date Mar 27, 2008
- ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING PACKAGE OF WLP
- Publication number 20080029877
- Publication date Feb 7, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for separating package of WLP
- Publication number 20070072338
- Publication date Mar 29, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Hsien-Wen Hsu

Person

Patents Grantslast 30 patents

Semiconductor device package having a back side protective scheme

Semiconductor device package having multi-chips with side-by-side c...

Method for image sensor protection

Patents Applicationslast 30 patents

Stacking die package structure for semiconductor devices and method...

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...

SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME

SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME

PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME

Self chip redistribution apparatus and method for the same

Semiconductor device package having multi-chips with side-by-side c...

Structure of semiconductor device package and method of the same

IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND...

Multi-chips package with reduced structure and method for forming t...

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CO...

Image sensor package with die receiving opening and method of the same

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND...

Image sensor module and the method of the same

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOL...

CHIP PACKAGE AND CHIP PACKAGE ARRAY

METHOD FOR SEPARATING PACKAGE OF WLP

Method for separating package of WLP