Huai Huang

Person

Saratoga, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction device with minimum stray field
- Patent number 11,944,013
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside floating metal for increased capacitance
- Patent number 11,756,887
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide formation for source/drain contact in a vertical transport...
- Patent number 11,621,199
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,574,864
- Issue date Feb 7, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via connection between metallization levels
- Patent number 11,315,827
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for forming fully-aligned via
- Patent number 11,244,861
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine learning enhanced optical-based screening for in-line wafer...
- Patent number 11,199,505
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Robin Hsin Kuo Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Trapezoidal interconnect at tight BEOL pitch
- Patent number 11,177,162
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide formation for source/drain contact in a vertical transport...
- Patent number 11,158,543
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,152,257
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,056,429
- Issue date Jul 6, 2021
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with self-forming wrap-all-around barrier layer
- Patent number 10,978,342
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 10,964,588
- Issue date Mar 30, 2021
- Tessera, Inc.
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to construct cylindrical interconnects to redu...
- Patent number 10,943,866
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to construct cylindrical interconnects to redu...
- Patent number 10,784,197
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned airgaps with conductive lines and vias
- Patent number 10,784,156
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selective dielectric deposition
- Patent number 10,777,411
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selective insulator for improved capacitance
- Patent number 10,763,160
- Issue date Sep 1, 2020
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring defectivity by equipping model-less scatterometry with co...
- Patent number 10,692,203
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Dexin Kong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitance reduction in sea of lines BEOL metallization
- Patent number 10,679,934
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 10,651,078
- Issue date May 12, 2020
- Tessera, Inc.
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene formation with dielectric spacer and thin liner
- Patent number 10,629,478
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 10,629,529
- Issue date Apr 21, 2020
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to construct cylindrical interconnects to redu...
- Patent number 10,529,662
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 10,366,952
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 10,361,117
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density MIM capacitors
- Patent number 10,229,967
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...
- Publication number 20240136287
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside BPR/BSPDN Intergration with Backside Local Interconnect.
- Publication number 20240120256
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
- Publication number 20240113013
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY
- Publication number 20240088036
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL STRUCTURED BURIED RAIL
- Publication number 20240079333
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL POWER LINES WITH ALIGNED SIGNAL WIRES
- Publication number 20240079295
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE DIELECTRIC FOR CLOCK AND POWER WIRES
- Publication number 20240079325
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING
- Publication number 20240071929
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BURIED POWER RAIL STRUCTURE WITH DUAL FRONT SIDE AND BACKSID...
- Publication number 20240006314
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH TWO-DIMENSIONAL FREE ZERO LINE END ENCLOSURE
- Publication number 20230420296
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PLANES AND PASS-THROUGH VIAS
- Publication number 20230420366
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP-LEVEL TSV WITH HYBRID DIELECTRIC SCHEME FOR BACKSIDE POWER DEL...
- Publication number 20230402381
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER PLANE
- Publication number 20230369219
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BEOL DIELECTRIC FOR INCREASED DECOUPLING CAPACITANCE
- Publication number 20230260892
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETC...
- Publication number 20230146512
- Publication date May 11, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Subtractive Skip-Level Power via Adjacent Recessed Damascene Signal...
- Publication number 20230098433
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION DEVICE WITH MINIMUM STRAY FIELD
- Publication number 20230091345
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA PATTERNING USING METAL AS HARD MASK AND VIA CONDUCTOR
- Publication number 20230067493
- Publication date Mar 2, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FLOATING METAL FOR INCREASED CAPACITANCE
- Publication number 20220406717
- Publication date Dec 22, 2022
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BIT MEMORY DEVICE WITH NANOWIRE STRUCTURE
- Publication number 20220399351
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trapezoidal Interconnect at Tight BEOL Pitch
- Publication number 20220013406
- Publication date Jan 13, 2022
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE FORMATION FOR SOURCE/DRAIN CONTACT IN A VERTICAL TRANSPORT...
- Publication number 20210391224
- Publication date Dec 16, 2021
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER-LESS PREFILLED VIA FORMATION
- Publication number 20210343589
- Publication date Nov 4, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20210335706
- Publication date Oct 28, 2021
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FORMING FULLY-ALIGNED VIA
- Publication number 20210327756
- Publication date Oct 21, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA CONNECTION BETWEEN METALLIZATION LEVELS
- Publication number 20210280456
- Publication date Sep 9, 2021
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER-LESS PREFILLED VIA FORMATION
- Publication number 20210225700
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20210217653
- Publication date Jul 15, 2021
- Tessera, Inc.
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device including a porous dielectric layer, and metho...

Magnetic tunnel junction device with minimum stray field

Backside floating metal for increased capacitance

Selective ILD deposition for fully aligned via with airgap

Barrier-less prefilled via formation

Silicide formation for source/drain contact in a vertical transport...

Semiconductor device including a porous dielectric layer, and metho...

Skip via connection between metallization levels

Method and structure for forming fully-aligned via

Machine learning enhanced optical-based screening for in-line wafer...

Trapezoidal interconnect at tight BEOL pitch

Silicide formation for source/drain contact in a vertical transport...

Barrier-less prefilled via formation

Semiconductor device including a porous dielectric layer, and metho...

Interconnect with self-forming wrap-all-around barrier layer

Selective ILD deposition for fully aligned via with airgap

Method and structure to construct cylindrical interconnects to redu...

Method and structure to construct cylindrical interconnects to redu...

Self-aligned airgaps with conductive lines and vias

Semiconductor device with selective dielectric deposition

Semiconductor device with selective insulator for improved capacitance

Measuring defectivity by equipping model-less scatterometry with co...

Capacitance reduction in sea of lines BEOL metallization

Selective ILD deposition for fully aligned via with airgap

Dual-damascene formation with dielectric spacer and thin liner

Semiconductor device including a porous dielectric layer, and metho...

Method and structure to construct cylindrical interconnects to redu...

Semiconductor device including a porous dielectric layer, and metho...

Selective ILD deposition for fully aligned via with airgap

High-density MIM capacitors

Patents Applicationslast 30 patents

Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...

Backside BPR/BSPDN Intergration with Backside Local Interconnect.

SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY

DUAL STRUCTURED BURIED RAIL

TALL POWER LINES WITH ALIGNED SIGNAL WIRES

HYBRID BACKSIDE DIELECTRIC FOR CLOCK AND POWER WIRES

DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING

HYBRID BURIED POWER RAIL STRUCTURE WITH DUAL FRONT SIDE AND BACKSID...

INTERCONNECT WITH TWO-DIMENSIONAL FREE ZERO LINE END ENCLOSURE

POWER PLANES AND PASS-THROUGH VIAS

SKIP-LEVEL TSV WITH HYBRID DIELECTRIC SCHEME FOR BACKSIDE POWER DEL...

BACKSIDE POWER PLANE

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

HYBRID BEOL DIELECTRIC FOR INCREASED DECOUPLING CAPACITANCE

INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETC...

Subtractive Skip-Level Power via Adjacent Recessed Damascene Signal...

MAGNETIC TUNNEL JUNCTION DEVICE WITH MINIMUM STRAY FIELD

TOP VIA PATTERNING USING METAL AS HARD MASK AND VIA CONDUCTOR

BACKSIDE FLOATING METAL FOR INCREASED CAPACITANCE

MULTI-BIT MEMORY DEVICE WITH NANOWIRE STRUCTURE

Trapezoidal Interconnect at Tight BEOL Pitch

SILICIDE FORMATION FOR SOURCE/DRAIN CONTACT IN A VERTICAL TRANSPORT...

BARRIER-LESS PREFILLED VIA FORMATION

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

METHOD AND STRUCTURE FOR FORMING FULLY-ALIGNED VIA

SKIP VIA CONNECTION BETWEEN METALLIZATION LEVELS

BARRIER-LESS PREFILLED VIA FORMATION

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP