Hui-Jung Wu

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 12,094,711
- Issue date Sep 17, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfer-less via integration scheme
- Patent number 11,987,876
- Issue date May 21, 2024
- Lam Research Corporation
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned vertical integration of three-terminal memory devices
- Patent number 11,792,987
- Issue date Oct 17, 2023
- Lam Research Corporation
- Thorsten Lill
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 11,355,353
- Issue date Jun 7, 2022
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 11,322,351
- Issue date May 3, 2022
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 10,546,748
- Issue date Jan 28, 2020
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 10,199,235
- Issue date Feb 5, 2019
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 9,899,234
- Issue date Feb 20, 2018
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective formation of dielectric barriers for metal interconnects...
- Patent number 9,418,889
- Issue date Aug 16, 2016
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal and silicon containing capping layers for interconnects
- Patent number 8,753,978
- Issue date Jun 17, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial capping layers for interconnects
- Patent number 8,268,722
- Issue date Sep 18, 2012
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing UV and dielectric diffusion barrier interaction
- Patent number 8,173,537
- Issue date May 8, 2012
- Novellus Systems, Inc.
- Kaushik Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing UV and dielectric diffusion barrier interaction through th...
- Patent number 8,124,522
- Issue date Feb 28, 2012
- Novellus Systems, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 8,021,486
- Issue date Sep 20, 2011
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of doped copper seed layers having improved reliability
- Patent number 8,017,523
- Issue date Sep 13, 2011
- Novellus Systems, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 7,704,873
- Issue date Apr 27, 2010
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 7,576,006
- Issue date Aug 18, 2009
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Absorbing compounds for spin-on-glass anti-reflective coatings for...
- Patent number 6,914,114
- Issue date Jul 5, 2005
- Honeywell International Inc.
- Teresa Baldwin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Low dielectric constant polyorganosilicon materials generated from...
- Patent number 6,841,256
- Issue date Jan 11, 2005
- Honeywell International Inc.
- Paul Apen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Polycarbosilane adhesion promoters for low dielectric constant poly...
- Patent number 6,780,517
- Issue date Aug 24, 2004
- Honeywell International Inc.
- Tian-An Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of multifunctional si-based oligomer/polymer for the surface mo...
- Patent number 6,770,572
- Issue date Aug 3, 2004
- AlliedSignal Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbosilane adhesion promoters for low dielectric constant poly...
- Patent number 6,761,975
- Issue date Jul 13, 2004
- Honeywell International Inc.
- Tian-An Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Absorbing compounds for spin-on-glass anti-reflective coatings for...
- Patent number 6,605,362
- Issue date Aug 12, 2003
- Honeywell International Inc.
- Teresa Baldwin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multifunctional reagents for the surface modification of nanoporous...
- Patent number 6,518,205
- Issue date Feb 11, 2003
- AlliedSignal Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified method to produce nanoporous silicon-based films
- Patent number 6,495,479
- Issue date Dec 17, 2002
- Honeywell International, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified process for producing nanoporous silica
- Patent number 6,495,906
- Issue date Dec 17, 2002
- AlliedSignal Inc.
- Douglas M. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric constant films used as copper diffusion barrier
- Patent number 6,489,030
- Issue date Dec 3, 2002
- Honeywell International, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric constant polyorganosilicon coatings generated from p...
- Patent number 6,395,649
- Issue date May 28, 2002
- Honeywell International Inc.
- Hui-Jung Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMFER-LESS VIA INTEGRATION SCHEME
- Publication number 20240263301
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20220270877
- Publication date Aug 25, 2022
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20220165571
- Publication date May 26, 2022
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20220051938
- Publication date Feb 17, 2022
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VERTICAL INTEGRATION OF THREE-TERMINAL MEMORY DEVICES
- Publication number 20210391355
- Publication date Dec 16, 2021
- LAM RESEARCH CORPORATION
- Thorsten LILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20210265163
- Publication date Aug 26, 2021
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE MANDRELS IN PATTERNING
- Publication number 20210265173
- Publication date Aug 26, 2021
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMFER-LESS VIA INTEGRATION SCHEME
- Publication number 20210017643
- Publication date Jan 21, 2021
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20200083044
- Publication date Mar 12, 2020
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE MANDRELS IN PATTERNING
- Publication number 20190237341
- Publication date Aug 1, 2019
- LAM RESEARCH CORPORATION
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20180240667
- Publication date Aug 23, 2018
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20180211846
- Publication date Jul 26, 2018
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...
- Publication number 20150380302
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20150380272
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20140216336
- Publication date Aug 7, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20130143401
- Publication date Jun 6, 2013
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MITIGATING SUBSTRATE DAMAGE DURING DEPOSITION PROCESSES
- Publication number 20120083134
- Publication date Apr 5, 2012
- Hui-Jung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20100308463
- Publication date Dec 9, 2010
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sequential chemical vapor deposition - spin-on dielectric depositio...
- Publication number 20060068540
- Publication date Mar 30, 2006
- Kyu S. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low dielectric constant polyorganosilicon materials generated from...
- Publication number 20050182151
- Publication date Aug 18, 2005
- Paul Apen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Absorbing compounds for spin-on-glass anti-reflective coatings for...
- Publication number 20030199659
- Publication date Oct 23, 2003
- Teresa Baldwin
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Simplified method to produce nanoporous silicon-based films
- Publication number 20030077918
- Publication date Apr 24, 2003
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for optimizing mechanical strength of nanoporous silica
- Publication number 20030062600
- Publication date Apr 3, 2003
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low dielectric constant polyorganosilicon materials generated from...
- Publication number 20030017635
- Publication date Jan 23, 2003
- Paul Apen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polycarbosilane adhesion promoters for low dielectric constant poly...
- Publication number 20020198353
- Publication date Dec 26, 2002
- Honeywell International Inc.
- Tian-An Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Simplified process for producing nanoporous silica
- Publication number 20020123242
- Publication date Sep 5, 2002
- Douglas M. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Absorbing compounds for spin-on-glass anti-reflective coatings for...
- Publication number 20020068181
- Publication date Jun 6, 2002
- Teresa Baldwin
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Low dielectric constant polyorganosilicon coatings generated from p...
- Publication number 20020064965
- Publication date May 30, 2002
- Hui-Jung Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Use of multifunctional si-based oligomer/polymer for the surface mo...
- Publication number 20020001973
- Publication date Jan 3, 2002
- Hui-Jung Wu
- C01 - INORGANIC CHEMISTRY

Hui-Jung Wu

Person

Patents Grantslast 30 patents

Tin oxide mandrels in patterning

Tin oxide films in semiconductor device manufacturing

Film stack simplification for high aspect ratio patterning and vert...

Chamfer-less via integration scheme

Self-aligned vertical integration of three-terminal memory devices

Tin oxide mandrels in patterning

Tin oxide films in semiconductor device manufacturing

Tin oxide films in semiconductor device manufacturing

Liner and barrier applications for subtractive metal integration

Liner and barrier applications for subtractive metal integration

Selective formation of dielectric barriers for metal interconnects...

Metal and silicon containing capping layers for interconnects

Interfacial capping layers for interconnects

Methods for reducing UV and dielectric diffusion barrier interaction

Reducing UV and dielectric diffusion barrier interaction through th...

Protective self-aligned buffer layers for damascene interconnects

Deposition of doped copper seed layers having improved reliability

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

Absorbing compounds for spin-on-glass anti-reflective coatings for...

Low dielectric constant polyorganosilicon materials generated from...

Polycarbosilane adhesion promoters for low dielectric constant poly...

Use of multifunctional si-based oligomer/polymer for the surface mo...

Polycarbosilane adhesion promoters for low dielectric constant poly...

Absorbing compounds for spin-on-glass anti-reflective coatings for...

Multifunctional reagents for the surface modification of nanoporous...

Simplified method to produce nanoporous silicon-based films

Simplified process for producing nanoporous silica

Low dielectric constant films used as copper diffusion barrier

Low dielectric constant polyorganosilicon coatings generated from p...

Patents Applicationslast 30 patents

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

CHAMFER-LESS VIA INTEGRATION SCHEME

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

SELF-ALIGNED VERTICAL INTEGRATION OF THREE-TERMINAL MEMORY DEVICES

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

TIN OXIDE MANDRELS IN PATTERNING

CHAMFER-LESS VIA INTEGRATION SCHEME

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

TIN OXIDE MANDRELS IN PATTERNING

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS

METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS

METHOD OF MITIGATING SUBSTRATE DAMAGE DURING DEPOSITION PROCESSES

INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS

Sequential chemical vapor deposition - spin-on dielectric depositio...

Low dielectric constant polyorganosilicon materials generated from...

Absorbing compounds for spin-on-glass anti-reflective coatings for...

Simplified method to produce nanoporous silicon-based films

Process for optimizing mechanical strength of nanoporous silica

Low dielectric constant polyorganosilicon materials generated from...

Polycarbosilane adhesion promoters for low dielectric constant poly...

Simplified process for producing nanoporous silica

Absorbing compounds for spin-on-glass anti-reflective coatings for...

Low dielectric constant polyorganosilicon coatings generated from p...

Use of multifunctional si-based oligomer/polymer for the surface mo...