Huong T. Do

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package embedded magnetic power transformers for SMPS
- Patent number 12,154,710
- Issue date Nov 26, 2024
- Intel Corporation
- Anuj Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,955,426
- Issue date Apr 9, 2024
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,690,165
- Issue date Jun 27, 2023
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-in-via structure for high density package integrated inductor
- Patent number 11,676,950
- Issue date Jun 13, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer embedded magnetic inductor coil
- Patent number 11,404,364
- Issue date Aug 2, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,393,751
- Issue date Jul 19, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,357,096
- Issue date Jun 7, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package inductor having thermal solution structures
- Patent number 11,335,620
- Issue date May 17, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid capacitor, circuit, and system
- Patent number 6,920,051
- Issue date Jul 19, 2005
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple tier array capacitor
- Patent number 6,532,143
- Issue date Mar 11, 2003
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor with extended surface lands and method of fabrication the...
- Patent number 6,483,692
- Issue date Nov 19, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-socket interposer and method of fabrication therefor
- Patent number 6,469,908
- Issue date Oct 22, 2002
- Intel Corporation
- P. R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid capacitor and method of fabrication therefor
- Patent number 6,446,317
- Issue date Sep 10, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-socket interposer and method of fabrication therefor
- Patent number 6,366,467
- Issue date Apr 2, 2002
- Intel Corporation
- P. R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Degassing hole design for olga trace impedance
- Patent number 6,303,871
- Issue date Oct 16, 2001
- Intel Corporation
- Longqiang Zu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
- Publication number 20220310512
- Publication date Sep 29, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
- Publication number 20220240370
- Publication date Jul 28, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS
- Publication number 20220093314
- Publication date Mar 24, 2022
- Intel Corporation
- Anuj MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC WIRES AND THEIR APPLICATIONS
- Publication number 20220085143
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-IN-VIA STRUCTURE FOR HIGH DENSITY PACKAGE INTEGRATED INDUCTOR
- Publication number 20210098436
- Publication date Apr 1, 2021
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER EMBEDDED MAGNETIC INDUCTOR COIL
- Publication number 20200066627
- Publication date Feb 27, 2020
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS ON PACKAGE SUBSTRATES
- Publication number 20200066830
- Publication date Feb 27, 2020
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
- Publication number 20200066634
- Publication date Feb 27, 2020
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INDUCTOR HAVING THERMAL SOLUTION STRUCTURES
- Publication number 20200020652
- Publication date Jan 16, 2020
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
- Publication number 20200015348
- Publication date Jan 9, 2020
- Intel Corporation
- Michael J. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid capacitor, circuit, and system
- Publication number 20020134581
- Publication date Sep 26, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-socket interposer and method of fabrication therefor
- Publication number 20020089833
- Publication date Jul 11, 2002
- Intel Corporation
- P.R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple tier array capacitor and methods of fabrication therefor
- Publication number 20020085334
- Publication date Jul 4, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor with extended surface lands and method of fabrication the...
- Publication number 20020075630
- Publication date Jun 20, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Huong T. Do

Person

Patents Grantslast 30 patents

Package embedded magnetic power transformers for SMPS

Package-integrated multi-turn coil embedded in a package magnetic core

Package substrate inductor having thermal interconnect structures

Via-in-via structure for high density package integrated inductor

Multi-layer embedded magnetic inductor coil

Package-integrated multi-turn coil embedded in a package magnetic core

Package substrate inductor having thermal interconnect structures

Package inductor having thermal solution structures

Hybrid capacitor, circuit, and system

Multiple tier array capacitor

Capacitor with extended surface lands and method of fabrication the...

Dual-socket interposer and method of fabrication therefor

Hybrid capacitor and method of fabrication therefor

Dual-socket interposer and method of fabrication therefor

Degassing hole design for olga trace impedance

Patents Applicationslast 30 patents

PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE

PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES

PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS

MAGNETIC WIRES AND THEIR APPLICATIONS

VIA-IN-VIA STRUCTURE FOR HIGH DENSITY PACKAGE INTEGRATED INDUCTOR

MULTI-LAYER EMBEDDED MAGNETIC INDUCTOR COIL

MAGNETIC CORE INDUCTORS ON PACKAGE SUBSTRATES

PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE

PACKAGE INDUCTOR HAVING THERMAL SOLUTION STRUCTURES

PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES

Hybrid capacitor, circuit, and system

Dual-socket interposer and method of fabrication therefor

Multiple tier array capacitor and methods of fabrication therefor

Capacitor with extended surface lands and method of fabrication the...