Claims
- 1. An interposer comprising:
a first set of pins on a bottom surface of the interposer that insert into a first socket of a printed circuit board, wherein at least some of the first set of pins are designated to supply power to a step down converter (SDC) mounted on the interposer; a second set of pins on the bottom surface of the interposer that insert into a second socket of the printed circuit board, wherein at least some of the second set of pins are designated to provide inputs and outputs to an integrated circuit mounted on the interposer; and one or more conductive traces that electrically connect an output of the SDC to an input of the integrated circuit.
- 2. The interposer as claimed in claim 1, further comprising:
a set of pads on a top surface of the interposer that electrically connects the SDC to the one or more conductive traces and to the first set of pins.
- 3. The interposer as claimed in claim 2, wherein the SDC is mounted on an SDC package, and the set of pads electrically connects the SDC package to the one or more conductive traces and to the first set of pins.
- 4. The interposer as claimed in claim 1, wherein the SDC is mounted on a pinned SDC package, the interposer further comprising:
a socket on a top surface of the interposer that electrically connects the pinned SDC package to the one or more conductive traces and to the first set of pins.
- 5. The interposer as claimed in claim 1, further comprising:
a set of pads on a top surface of the interposer that electrically connects the integrated circuit to the one or more conductive traces and to the second set of pins.
- 6. The interposer as claimed in claim 5, wherein the integrated circuit is mounted on an integrated circuit package, and the set of pads electrically connects the integrated circuit package to the one or more conductive traces and to the second set of pins.
- 7. The interposer as claimed in claim 1, wherein the integrated circuit is mounted on a pinned package, the interposer further comprising:
a socket on a top surface of the interposer that electrically connects the pinned package to the one or more conductive traces and to the second set of pins.
- 8. An interposer comprising:
a first set of pins on a bottom surface of the interposer that insert into a first socket of a printed circuit board, wherein at least some of the first set of pins electrically connect an output of a step down converter (SDC) mounted on the printed circuit board to one or more conductive traces within the interposer; a second set of pins on the bottom surface of the interposer that insert into a second socket of the printed circuit board, wherein at least some of the second set of pins are designated to provide inputs and outputs to an integrated circuit mounted on the interposer; and the one or more conductive traces that electrically connect the first set of pins to a circuit within the integrated circuit.
- 9. The interposer as claimed in claim 8, further comprising:
a set of pads on a top surface of the interposer that electrically connects the integrated circuit to the one or more conductive traces and to the second set of pins.
- 10. The interposer as claimed in claim 9, wherein the integrated circuit is mounted on an integrated circuit package, and the set of pads electrically connects the integrated circuit package to the one or more conductive traces and to the second set of pins.
- 11. The interposer as claimed in claim 8, wherein the integrated circuit is mounted on a pinned package, the interposer further comprising:
a socket on a top surface of the interposer that electrically connects the pinned package to the one or more conductive traces and to the second set of pins.
- 12. A method for fabricating an interposer, the method comprising:
fabricating an interposer substrate having one or more conductive traces that electrically connect an output of a step down converter (SDC) mounted on the interposer substrate to an input of an integrated circuit mounted on the interposer substrate; attaching a first set of pins in a bottom surface of the interposer substrate, wherein the first set of pins insert into a first socket of a printed circuit board, and at least some of the first set of pins are designated to supply power to the SDC; and attaching a second set of pins in the bottom surface of the interposer substrate, wherein the second set of pins insert into a second socket of the printed circuit board, and at least some of the second set of pins are designated to provide inputs and outputs to the integrated circuit.
- 13. The method as claimed in claim 12, wherein fabricating the interposer substrate comprises:
forming a set of pads on a top surface of the interposer substrate, wherein the set of pads electrically connects the SDC to the interposer substrate.
- 14. The method as claimed in claim 12, wherein fabricating the interposer substrate comprises:
attaching a socket to a top surface of the interposer substrate, wherein the socket electrically connects the SDC to the interposer substrate.
- 15. The method as claimed in claim 12, wherein fabricating the interposer substrate comprises:
forming a set of pads on a top surface of the interposer substrate, wherein the set of pads electrically connects the integrated circuit to the interposer substrate.
- 16. The method as claimed in claim 12, wherein fabricating the interposer substrate comprises:
attaching a socket to a top surface of the interposer substrate, wherein the socket electrically connects the integrated circuit to the interposer substrate.
- 17. A method for fabricating an interposer, the method comprising:
fabricating an interposer substrate having one or more conductive traces that electrically connect a first set of pins to one or more inputs to an integrated circuit mounted on the interposer substrate; attaching the first set of pins in a bottom surface of the interposer substrate, wherein the first set of pins insert into a first socket of a printed circuit board, and at least some of the first set of pins are designated to carry an output of a step down converter (SDC) mounted on the printed circuit board; and attaching a second set of pins in the bottom surface of the interposer substrate, wherein the second set of pins insert into a second socket of the printed circuit board, and at least some of the second set of pins are designated to provide additional inputs and outputs to the integrated circuit.
- 18. The method as claimed in claim 17, wherein fabricating the interposer substrate comprises:
forming a set of pads on a top surface of the interposer substrate, wherein the set of pads electrically connects the integrated circuit to the interposer substrate.
- 19. The method as claimed in claim 17, wherein fabricating the interposer substrate comprises:
attaching a socket to a top surface of the interposer substrate, wherein the socket electrically connects the integrated circuit to the interposer substrate.
- 20. A computer system positioned on a printed circuit board, the computer system comprising:
a bus; a memory coupled to the bus; and an interposer coupled to the bus, the interposer including:
a first set of pins on a bottom surface of the interposer that insert into a first socket of the printed circuit board, wherein at least some of the first set of pins are designated to supply power to a step down converter (SDC) mounted on the interposer, a second set of pins on the bottom surface of the interposer that insert into a second socket of the printed circuit board, wherein at least some of the second set of pins are designated to provide inputs and outputs to a microprocessor mounted on the interposer, and one or more conductive traces that electrically connect an output of the SDC to an input of the microprocessor; the SDC located on the top surface of the interposer, wherein the SDC is electrically connected to the first set of pins and the one or more conductive traces; and the microprocessor located on the top surface of the interposer, the microprocessor containing a circuit, which is electrically connected to the one or more conductive traces.
- 21. The computer system as claimed in claim 20, wherein the interposer further comprises:
a set of pads on a top surface of the interposer that electrically connects the SDC to the one or more conductive traces and to the first set of pins.
- 22. The computer system as claimed in claim 20, wherein the SDC is mounted on a pinned SDC package, and the interposer further comprises:
a socket on a top surface of the interposer that electrically connects the pinned SDC package to the one or more conductive traces and to the first set of pins.
- 23. The computer system as claimed in claim 20, wherein the interposer further comprises:
a set of pads on a top surface of the interposer that electrically connects the integrated circuit to the one or more conductive traces and to the second set of pins.
- 24. The computer system as claimed in claim 20, wherein the integrated circuit is mounted on a pinned package, and the interposer further comprises:
a socket on a top surface of the interposer that electrically connects the pinned package to the one or more conductive traces and to the second set of pins.
- 25. A computer system positioned on a printed circuit board, the computer system comprising:
a bus; a memory coupled to the bus; and an interposer coupled to the bus, the interposer including:
a first set of pins on a bottom surface of the interposer that insert into a first socket of the printed circuit board, wherein at least some of the first set of pins electrically connect an output of a step down converter (SDC) mounted on the printed circuit board to one or more conductive traces within the interposer, a second set of pins on the bottom surface of the interposer that insert into a second socket of the printed circuit board, wherein at least some of the second set of pins are designated to provide inputs and outputs to a microprocessor mounted on the interposer, and the one or more conductive traces that electrically connect the first set of pins to a circuit within the microprocessor; the SDC mounted on the printed circuit board, wherein the output of the SDC is electrically connected to the first set of pins; and the microprocessor located on the top surface of the interposer and electrically connected to the one or more conductive traces.
- 26. The computer system as claimed in claim 25, wherein the interposer further comprises:
a set of pads on a top surface of the interposer that electrically connects the microprocessor to the one or more conductive traces and to the second set of pins.
- 27. The computer system as claimed in claim 25, wherein the microprocessor is mounted on a pinned package, and the interposer further comprises:
a socket on a top surface of the interposer that electrically connects the pinned package to the one or more conductive traces and to the second set of pins.
Parent Case Info
[0001] This application is a divisional of application U.S. Ser. No. 09/540,046, filed on Mar. 31, 2000.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09540046 |
Mar 2000 |
US |
Child |
10076893 |
Feb 2002 |
US |