Claims
- 1. An interposer comprising:a first set of pins on a bottom surface of the interposer that insert into a first socket of a printed circuit board, wherein at least some of the first set of pins electrically connect an output of a step down converter (SDC) mounted on the printed circuit board to one or more conductive traces within the interposer; a second set of pins on the bottom surface of the interposer that insert into a second socket of the printed circuit board, wherein at least some of the second set of pins are designated to provide inputs and outputs to an integrated circuit mounted on the interposer; and the one or more conductive traces that electrically connect the first set of pins to a circuit within the integrated circuit.
- 2. The interposer as claimed in claim 1, further comprising:a set of pads on a top surface of the interposer that electrically connects the integrated circuit to the one or more conductive traces and to the second set of pins.
- 3. The interposer as claimed in claim 2, wherein the integrated circuit is mounted on an integrated circuit package, and the set of pads electrically connects the integrated circuit package to the one or more conductive traces and to the second set of pins.
- 4. The interposer as claimed in claim 1, wherein the integrated circuit is mounted on a pinned package, the interposer further comprising:a socket on a top surface of the interposer that electrically connects the pinned package to the one or more conductive traces and to the second set of pins.
- 5. A method for fabricating an interposer, the method comprising:fabricating an interposer substrate having one or more conductive traces that electrically connect a first set of pins to one or more inputs to an integrated circuit mounted on the interposer substrate; attaching the first set of pins in a bottom surface of the interposer substrate, wherein the first set of pins insert into a first socket of a printed circuit board, and at least some of the first set of pins are designated to carry an output of a step down converter (SDC) mounted on the printed circuit board; and attaching a second set of pins in the bottom surface of the interposer substrate, wherein the second set of pins insert into a second socket of the printed circuit board, and at least some of the second set of pins are designated to provide additional inputs and outputs to the integrated circuit.
- 6. The method as claimed in claim 5, wherein fabricating the interposer substrate comprises:forming a set of pads on a top surface of the interposer substrate, wherein the set of pads electrically connects the integrated circuit to the interposer substrate.
- 7. The method as claimed in claim 5, wherein fabricating the interposer substrate comprises:attaching a socket to a top surface of the interposer substrate, wherein the socket electrically connects the integrated circuit to the interposer substrate.
Parent Case Info
This application is a divisional of application U.S. Ser. No. 09/540,046, filed on Mar. 31, 2000 now U.S. Pat. No. 6,366,467.
US Referenced Citations (10)