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J. Mike Brooks
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Caldwell, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
10,763,185
Issue date
Sep 1, 2020
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
10,312,173
Issue date
Jun 4, 2019
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
10,163,826
Issue date
Dec 25, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
9,960,094
Issue date
May 1, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
9,812,415
Issue date
Nov 7, 2017
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
9,362,208
Issue date
Jun 7, 2016
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
8,866,272
Issue date
Oct 21, 2014
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices
Patent number
8,138,613
Issue date
Mar 20, 2012
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for packaging semiconductor devices, packaged semiconduct...
Patent number
8,138,021
Issue date
Mar 20, 2012
Micron Technology, Inc.
David J. Corisis
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Covers for microelectronic imagers and methods for wafer-level pack...
Patent number
8,092,734
Issue date
Jan 10, 2012
Aptina Imaging Corporation
Tongbi Jiang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
7,955,898
Issue date
Jun 7, 2011
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating microelectronic devices
Patent number
7,910,385
Issue date
Mar 22, 2011
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for packaging semiconductor devices, packaged semiconduct...
Patent number
7,759,785
Issue date
Jul 20, 2010
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
7,750,449
Issue date
Jul 6, 2010
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for packaging microele...
Patent number
7,655,500
Issue date
Feb 2, 2010
Micron Technology
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for packaging microele...
Patent number
7,550,847
Issue date
Jun 23, 2009
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for packaging microele...
Patent number
7,329,949
Issue date
Feb 12, 2008
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for packaging microele...
Patent number
7,312,101
Issue date
Dec 25, 2007
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple substrate microelectronic devices and methods of manufacture
Patent number
7,298,031
Issue date
Nov 20, 2007
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple substrate microelectronic devices and methods of manufacture
Patent number
7,253,025
Issue date
Aug 7, 2007
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical device allowing for increased device densities
Patent number
7,084,351
Issue date
Aug 1, 2006
Micron Technology, Inc.
Salman Akram
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical device allowing for increased device densities
Patent number
6,914,198
Issue date
Jul 5, 2005
Micron Technology, Inc.
Salman Akram
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical device allowing for increased device densities
Patent number
6,909,055
Issue date
Jun 21, 2005
Micron Technology, Inc.
Salman Akram
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Adhesion enhanced semiconductor die for mold compound packaging
Patent number
6,740,545
Issue date
May 25, 2004
Micron Technology, Inc.
Jerrold L. King
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for coupling a semiconductor die to die terminals
Patent number
6,699,734
Issue date
Mar 2, 2004
Micron Technology, Inc.
Aaron Schoenfeld
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for coupling a semiconductor die to die terminals
Patent number
6,600,215
Issue date
Jul 29, 2003
Micron Technology, Inc.
Aaron Schoenfeld
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for coupling a semiconductor die to die terminals
Patent number
6,579,746
Issue date
Jun 17, 2003
Micron Technology, Inc.
Aaron Schoenfeld
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device having cyanate ester buffer coat and meth...
Patent number
6,559,519
Issue date
May 6, 2003
Micron Technology, Inc.
J. Mike Brooks
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical device allowing for increased device densities
Patent number
6,535,393
Issue date
Mar 18, 2003
Micron Technology, Inc.
Salman Akram
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Adhesion enhanced semiconductor die for mold compound packaging
Patent number
6,489,186
Issue date
Dec 3, 2002
Micron Technology, Inc.
Jerrold L. King
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20190252281
Publication date
Aug 15, 2019
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20180211896
Publication date
Jul 26, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20180040582
Publication date
Feb 8, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20160254204
Publication date
Sep 1, 2016
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20150364403
Publication date
Dec 17, 2015
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20150021769
Publication date
Jan 22, 2015
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20110233740
Publication date
Sep 29, 2011
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...
Publication number
20110169154
Publication date
Jul 14, 2011
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICES, PACKAGED SEMICONDUCT...
Publication number
20100279466
Publication date
Nov 4, 2010
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20100255636
Publication date
Oct 7, 2010
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC IMAGING UNITS HAVING AN INFRARED-ABSORBING LAYER AN...
Publication number
20090146234
Publication date
Jun 11, 2009
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20080224291
Publication date
Sep 18, 2008
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICES, PACKAGED SEMICONDUCT...
Publication number
20080224298
Publication date
Sep 18, 2008
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20080224329
Publication date
Sep 18, 2008
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR PACKAGING MICROELE...
Publication number
20080132006
Publication date
Jun 5, 2008
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR PACKAGING MICROELE...
Publication number
20080099917
Publication date
May 1, 2008
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic devices and methods for manufacturing microelectron...
Publication number
20070262436
Publication date
Nov 15, 2007
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical device allowing for increased device densities
Publication number
20060201705
Publication date
Sep 14, 2006
Micron Technology, Inc.
Akram Salman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Packaged microelectronic devices and methods for packaging microele...
Publication number
20060030150
Publication date
Feb 9, 2006
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Covers for microelectronic imagers and methods for wafer-level pack...
Publication number
20050253213
Publication date
Nov 17, 2005
Tongbi Jiang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Semiconductor device structure with adhesion-enhanced semiconductor...
Publication number
20050253243
Publication date
Nov 17, 2005
Jerrold L. King
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple substrate microelectronic devices and methods of manufacture
Publication number
20050019984
Publication date
Jan 27, 2005
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesion enhanced semiconductor die for mold compound packaging
Publication number
20050001295
Publication date
Jan 6, 2005
Jerrold L. King
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged microelectronic devices and methods for packaging microele...
Publication number
20040214373
Publication date
Oct 28, 2004
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for coupling a semiconductor die to die terminals
Publication number
20030113953
Publication date
Jun 19, 2003
Aaron Schoenfeld
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesion enhanced semiconductor die for mold compound packaging
Publication number
20030082849
Publication date
May 1, 2003
Jerrold L. King
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical device allowing for increased device densities
Publication number
20030076665
Publication date
Apr 24, 2003
Salman Akram
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electrical device allowing for increased device densities
Publication number
20030031000
Publication date
Feb 13, 2003
Salman Akram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical device allowing for increased device densities
Publication number
20030007340
Publication date
Jan 9, 2003
Salman Akram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having cyanate ester buffer coat and meth...
Publication number
20020195687
Publication date
Dec 26, 2002
Micron Technology, Inc.
J. Mike Brooks
H01 - BASIC ELECTRIC ELEMENTS